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The Focus Ring 360-318-5.5 (TEL OEM P/N 2L02-250067-11) is a circular plasma-confinement consumable that sits directly around the outer edge of the electrostatic chuck in a Tokyo Electron (TEL) 300 mm plasma etch chamber. In TEL nomenclature, the “rework” designation indicates a ring whose dimensions and surface have been brought to specification through controlled machining and finishing, while the “360-318-5.5” descriptor reflects the ring’s characteristic diameters and nominal thickness profile. Functionally, it is the component that extends the wafer-plane plasma sheath outward beyond the silicon edge so that the electric field, ion trajectories and etch chemistry seen by the outermost dies match those at the wafer centre.
In a 300 mm etcher the wafer edge is the single most difficult region to control. Without a properly conditioned focus ring, the plasma sheath bends sharply at the wafer rim, ions strike the perimeter at an angle, and etch rate, profile angle and critical dimension all drift across the last few millimetres of useable silicon. The focus ring suppresses that distortion by presenting a continuous, sacrificial dielectric (or semiconductive) surface at the same height as the wafer, effectively making the plasma “see” a wafer that is larger than 300 mm.
Because it is consumed by the same ion bombardment it is designed to shape, the focus ring is one of the highest-turnover consumables in any etch fleet. As it erodes, the sheath geometry it controls changes, which is why focus-ring height and condition are tracked as primary process variables. The ES7099-230 supplied by ESCT Fab Support is a 2nd-source, new component manufactured to match the form, fit and function of the original 2L02-250067-11 part.
The focus ring is mounted concentric to the electrostatic chuck, immediately outboard of the wafer edge, and works in concert with the cover ring, edge ring and lower electrode assembly to define the plasma environment at the wafer perimeter. Its responsibilities span field shaping, RF coupling and contamination control:
Focus rings of this class are produced from high-purity plasma-grade materials chosen to balance erosion resistance, dielectric behaviour and particle cleanliness. The material selection governs both how the ring shapes the field and how long it survives before its profile drifts out of process window.
Edge-confinement rings in TEL etch chambers are commonly fabricated from high-purity silicon, silicon carbide or quartz depending on the process chemistry. Each presents a distinct erosion rate, sputter yield and secondary-particle signature under fluorine- or chlorine-based plasmas, and the surface finish is held tight to limit defect generation.
The “360-318-5.5” geometry must be reproduced precisely, because the ring’s inner diameter, outer diameter and thickness collectively set the height relationship between ring surface and wafer surface. Even a fraction of a millimetre of step or thickness error shifts the sheath and degrades edge uniformity.
Because the focus ring directly governs the plasma environment at the wafer edge, its condition is one of the strongest levers on edge yield and chamber matching. A worn, mis-seated or out-of-spec ring propagates into measurable process and productivity losses:
The dominant wear mechanism is steady erosion from continuous ion bombardment. As the ring thins, the step between ring surface and wafer surface increases, the sheath drops, and edge etch behaviour drifts. This is a gradual, predictable failure that is managed by tracking RF hours and measuring ring height at each preventive-maintenance interval.
Thermal cycling, handling during maintenance and localised arcing can initiate cracks or edge chips in the brittle ring material. Once fractured, the ring becomes a particle source and can shed fragments onto the wafer, driving sudden defectivity excursions that demand immediate replacement rather than scheduled change-out.
If the ring is not seated flat and concentric, contact with the lower electrode becomes uneven, thermal coupling varies around the circumference and the ring erodes asymmetrically. The result is an azimuthal signature in edge uniformity that no chemistry adjustment can fully correct until the ring is reseated or replaced.
Focus-ring replacement is a routine but precision-sensitive preventive-maintenance task. The ring must be installed clean, flat and concentric, and the chamber requires conditioning before it returns to production. The following sequence reflects good practice; always defer to the tool owner’s qualified procedure and safety requirements.
Focus rings are high-frequency consumables, so consistent availability and dimensional reliability matter as much as unit price. ESCT Fab Support supplies the ES7099-230 as a managed alternative to single-sourcing through the OEM:
It sits around the wafer edge and extends the plasma sheath outward so that ions strike the wafer perimeter at the correct angle. This keeps edge etch rate, profile and critical dimension matched to the wafer centre, maximising the number of good dies in the outer band.
No. The ES7099-230 is a 2nd-source, new component supplied as an OEM-compatible alternative to TEL P/N 2L02-250067-11. It is manufactured and verified to match the original part’s form, fit and function, but it is not an original OEM-branded part and is not supplied by Tokyo Electron.
Replacement frequency depends on process chemistry, RF power and run time rather than a fixed calendar interval. Most fabs track accumulated RF hours and measure ring height at each preventive-maintenance window, replacing the ring once erosion shifts edge uniformity toward the process-window limit.
Typical indicators include a creeping edge critical-dimension or etch-rate trend, tilted edge profiles, rising particle counts and growing chamber-to-chamber mismatch. When edge metrics drift while the rest of the wafer remains stable, the focus ring is one of the first consumables to check.
Yes. A freshly installed ring changes the edge environment, so the chamber should be run through its season or conditioning recipe and then qualified for edge uniformity and particles before production wafers are processed. This stabilises the surface and confirms the ring is seated correctly.
The standard lead time is 4 to 5 weeks. Because this is a high-turnover consumable, we recommend holding buffer stock sized to your replacement cadence and placing replenishment orders ahead of scheduled preventive maintenance to avoid tool downtime.
The Focus Ring 360-318-5.5 (TEL OEM P/N 2L02-250067-11, ESCT P/N ES7099-230) is a sacrificial edge-confinement consumable for Tokyo Electron 300 mm plasma etch chambers. It shapes the plasma sheath at the wafer perimeter, sustains edge etch uniformity and critical-dimension control, and protects the underlying electrostatic chuck from direct ion exposure. As a high-frequency wear part, its height, profile and seating directly determine edge yield, particle performance and chamber matching. Supplied by ESCT Fab Support as a verified 2nd-source new component with a 4 to 5 week lead time, it offers a reliable, cost-effective route to keeping TEL etch tools running within their validated process window.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L02-250067-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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