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The focus ring described by the TEL part designation “ADDWORK, RING-FOCUS 360-315-5.5” is the annular consumable that surrounds the 300 mm wafer at the wafer-support pedestal of a Tokyo Electron plasma etch chamber. Its geometry, an outer profile in the region of 360 mm, an inner aperture sized to seat closely around the 300 mm wafer edge, and a working thickness on the order of 5.5 mm, positions it as the ring that physically frames the wafer perimeter and conditions the plasma sheath directly above the outermost die. It is one of the most replacement-intensive items in the chamber kit because it sits squarely in the ion flux and erodes throughout normal production.
In a TEL 300 mm capacitively coupled etch reactor, the focus ring is mounted concentrically on the lower electrode (the electrostatic chuck assembly), forming a continuous surface that extends the wafer plane outward. By extending the conductive and dielectric environment past the silicon edge, the ring pulls the plasma sheath boundary outboard of the wafer, so that the edge die experience an ion trajectory and etch field comparable to die at the wafer centre. Without this extension, the sheath would bend sharply at the wafer edge and the outermost rows of die would etch at the wrong angle and rate.
Because it is consumed by the very process it enables, the focus ring is a scheduled-replacement item rather than a permanent fixture. Its erosion rate, surface condition and dimensional drift translate directly into edge-of-wafer yield, making a reliable, dimensionally accurate supply of replacement rings a core part of any TEL etch fleet’s sustaining-engineering plan.
The focus ring performs several coupled electrical and process functions simultaneously. It is not merely a spacer or a guard; it is an active part of the plasma boundary condition at the wafer edge and a contributor to the chamber’s particle and RF behaviour.
Focus rings for TEL 300 mm etch chambers are produced from carefully chosen plasma-resistant materials, most commonly high-purity silicon, silicon carbide or quartz depending on the process chemistry and the etch recipe the chamber is qualified for. The material is selected so that, as the ring erodes, the by-products are compatible with the process and do not introduce metallic or particulate contamination onto the wafer.
The ring’s inner diameter, outer profile and thickness (the 360–315–5.5 family of dimensions) are tightly toleranced because the gap between the ring and the wafer edge, and the height of the ring relative to the wafer surface, directly set the local sheath geometry. Flatness and surface finish are equally important: a warped or rough ring perturbs the field and becomes a particle source.
Few consumables have as direct a line to edge-of-wafer yield as the focus ring. Because it governs the sheath over the outermost die, its condition is reflected almost immediately in edge metrology, and a worn ring is a frequent root cause of edge-zone excursions on TEL etch tools.
The dominant wear mechanism is gradual erosion under continuous ion bombardment. As the ring loses material and its height drops below the wafer plane, the sheath geometry at the edge changes, edge etch rate and profile angle drift, and the ring eventually reaches an end-of-life thickness at which it must be replaced to recover edge uniformity.
Thermal cycling, mechanical handling during preventive maintenance and the brittleness of ceramic or silicon materials can produce cracks, edge chips or fractures. A cracked ring is both a particle source and an electrical discontinuity, and any visible chipping is grounds for immediate replacement.
Over time the exposed surface roughens and accumulates etch by-product and polymer redeposition. This degrades the ring’s field-shaping behaviour, raises particle counts and can cause flaking, so rings are inspected for surface condition as well as dimensional wear at each PM.
Focus-ring replacement is a routine preventive-maintenance activity, but it must be carried out cleanly and precisely because the ring’s seating and concentricity directly affect process results. The following sequence reflects good practice; always defer to your site’s qualified TEL maintenance procedure and ESD controls.
Focus rings are high-turnover consumables, so availability and dimensional consistency matter as much as unit cost. ESCT Fab Support supplies this ring as a qualified alternative to single-source OEM procurement, helping fabs hold ring inventory without exposure to long or unpredictable OEM lead times.
It surrounds the 300 mm wafer on the lower electrode and extends the plasma sheath outward beyond the silicon edge, so the outermost die etch with the same ion trajectory and rate as the wafer centre. It also acts as a sacrificial, particle-controlling surface at the wafer perimeter.
No. This ring is supplied as a new, second-source OEM-compatible part. It is verified to the form, fit and function of TEL OEM P/N 2L02-250063-11 but it is not an original Tokyo Electron OEM part and is not sold as one.
Rings are typically replaced on an RF-hours schedule, but the practical indicators are drifting edge critical-dimension and etch-depth, rising edge particle counts, and visible erosion, thinning, chipping or surface roughening found during preventive-maintenance inspection.
Focus rings for these chambers are made from high-purity plasma-resistant materials such as silicon, silicon carbide or quartz, selected so that erosion by-products are compatible with the etch chemistry and do not contaminate the wafer. The exact material is matched to the qualified process for the chamber.
Yes. Because the ring sets the sheath over the edge die, a thinned, roughened or damaged ring causes edge profile tilt, edge CD drift and increased particles, all of which reduce yield in the outer rows of die. Timely replacement is the most effective way to protect edge-of-wafer performance.
The indicative lead time is 4–5 weeks. Because focus rings are continuous-consumption items, we recommend holding buffer stock aligned to your preventive-maintenance cadence so replacements are always on the shelf when a chamber reaches its replacement interval.
The focus ring under TEL OEM P/N 2L02-250063-11 (ESCT P/N ES7099-228) is a critical edge-confinement consumable in Tokyo Electron 300 mm plasma etch chambers. Seated concentrically around the wafer on the lower electrode, it extends the plasma sheath outboard of the silicon edge to keep edge die etching uniformly, while acting as a sacrificial, particle-controlling surface in the ion flux. Its dimensions, material purity, flatness and surface condition all feed directly into edge-of-wafer yield, and because it erodes in normal use it is a scheduled-replacement item that benefits from reliable, dimensionally consistent second-source supply. ESCT Fab Support offers this ring as a form-fit-function-verified alternative with a defined lead time to keep TEL etch fleets running predictably.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L02-250063-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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