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The TEL Focus Ring LAB 360-T4-306, carried under ESCT part number ES7099-041 and cross-referenced to Tokyo Electron OEM part number 2010-251671-11, is an annular plasma-facing consumable that sits in the immediate periphery of the 300 mm wafer inside a TEL plasma etch process chamber. It is one of the most directly process-critical parts in the chamber stack, because it occupies the transition zone between the powered electrostatic chuck and the grounded chamber hardware, exactly where edge electric fields and plasma sheath behaviour are hardest to control.
Functionally, the focus ring extends the effective surface around the wafer so that the plasma sheath does not collapse abruptly at the wafer edge. A correctly dimensioned ring keeps the sheath boundary planar across the last few millimetres of the wafer, which is where edge die are most vulnerable to tilted ion trajectories, etch-rate roll-off and critical-dimension drift. As the ring is consumed by ion bombardment, its profile changes, and that change is one of the leading drivers of edge yield degradation over a chamber’s wet-clean cycle.
Because the ring is sacrificial by design, it is replaced on a defined interval. Keeping qualified, dimensionally accurate replacement rings on hand directly protects edge-of-wafer yield, chamber matching and overall tool availability, making this a high-turnover item in any TEL 300 mm etch fleet.
The focus ring performs several coupled electrical, electrostatic and process-management jobs simultaneously. In a TEL etch chamber it works alongside the electrostatic chuck, the cover/insulator rings and the upper electrode to shape the plasma at the wafer edge, and its condition is monitored as part of routine chamber qualification.
Focus rings for TEL 300 mm etch chambers are manufactured from high-purity plasma-resistant materials selected to balance etch resistance, electrical behaviour and particle performance. Material choice and surface finish together determine how predictably the ring erodes and how long it sustains in-spec edge results.
Depending on the specific process, focus rings in this class are produced from high-purity silicon, silicon carbide or quartz, each offering different erosion rates and electrical characteristics under fluorine- or chlorine-based chemistries. The LAB 360-T4-306 is supplied to the material specification appropriate to its chamber position, so that its conductivity, dielectric behaviour and sputter resistance match the original part.
Edge uniformity is acutely sensitive to ring geometry. Inner diameter, step height relative to the wafer, flatness and seating-surface finish must all be held to tight tolerances, because even small departures shift the local sheath and degrade the outermost die. ESCT rings are produced and inspected to the original form and fit so installed performance matches OEM expectations.
Because the focus ring governs the most marginal region of every wafer, its condition feeds straight through to device yield and tool economics. A worn or out-of-spec ring rarely fails outright; instead it slowly pulls edge results away from target until die at the wafer periphery fall out of specification.
The dominant wear mode is steady sputter erosion from ion bombardment, which thins the ring and rounds its inner step. As the step height falls, the sheath no longer sits planar across the wafer edge, edge etch rate shifts and edge-die yield falls. This erosion sets the ring’s service life and is the primary reason for scheduled replacement.
Repeated thermal cycling, mechanical handling stress and any localised hot spots can initiate micro-cracks, chips or fractures, particularly in brittle ceramic and silicon materials. Cracks compromise both the electrical boundary and the part’s integrity, and can shed particles or, in the worst case, allow fragments to reach the wafer.
Process by-products and polymer can accumulate on and around the ring between cleans. Flaking deposits become a particle source, and uneven build-up can disturb local plasma behaviour, contributing to defectivity and edge non-uniformity well before the ring reaches its erosion limit.
Focus ring replacement is a routine preventive-maintenance task, but it must be performed cleanly and precisely, because the ring’s seating and orientation directly affect edge results. Always follow the relevant TEL maintenance procedure and your fab’s safety controls; the steps below summarise good practice.
Focus rings are high-frequency consumables, so supply reliability and dimensional consistency matter as much as unit price. ESCT Fab Support helps fabs hold the right inventory of qualified rings to protect uptime without over-committing capital, with this part carried under ESCT P/N ES7099-041 against TEL OEM P/N 2010-251671-11.
It surrounds the 300 mm wafer at the edge of the electrostatic chuck and extends the plasma sheath beyond the wafer perimeter. This keeps ion trajectories near-vertical at the wafer edge, stabilises the radial electric field and protects edge-die critical dimensions and profile uniformity.
No. This focus ring is supplied as a second-source, new part that is OEM-compatible and verified to the original form, fit and function. It is not an original Tokyo Electron OEM component, but it is intended as a direct, qualified replacement for OEM P/N 2010-251671-11.
Replacement intervals are process-specific and driven by erosion rate. Most fabs schedule the swap as part of a defined preventive-maintenance cycle, triggered by accumulated RF hours, wafer count or measured edge-uniformity drift, rather than waiting for an outright failure.
Focus rings in this class are made from high-purity plasma-resistant materials such as silicon, silicon carbide or quartz, depending on the chamber and process. This part is supplied to the material specification appropriate to its position so its electrical and erosion behaviour match the original.
The usual signs are gradual edge critical-dimension drift, edge etch-rate roll-off, rising edge-die defectivity and increasing particle counts. Visual inspection during maintenance will also show reduced step height, thinning, rounding of the inner edge or cracking.
The typical lead time is 4-5 weeks. Because focus rings are consumed on a predictable schedule, we recommend ordering against your preventive-maintenance plan so qualified replacements are on the shelf before they are needed.
The TEL Focus Ring LAB 360-T4-306 (ESCT P/N ES7099-041; OEM P/N 2010-251671-11) is a sacrificial edge-confinement consumable that shapes the plasma sheath around the 300 mm wafer in TEL plasma etch chambers. Its geometry and material directly control edge etch uniformity, ion directionality and particle performance, making it one of the most yield-relevant consumables in the chamber. Supplied as a second-source new part to OEM form, fit and function, with a 4-5 week lead time, it offers a dependable, cost-effective way to keep TEL etch tools matched and in production.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2010-251671-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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