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The focus ring identified by TEL part number 3D10-250946-11 is an annular consumable that surrounds the 300 mm wafer at the periphery of a Tokyo Electron plasma etch chamber. Sitting directly on or adjacent to the electrostatic chuck, the ring extends the wafer plane outward so that the plasma sheath, electric field and ion trajectories at the wafer edge mirror conditions seen across the bulk of the wafer. In doing so it converts an inherently abrupt boundary, the physical edge of the silicon, into a smoothly continuing electrical surface, which is the single most important factor in achieving uniform etch results out to the last few millimetres of usable die area.
Within the JI ATCC family of TEL etch hardware, this component is a sacrificial part by design. It is intentionally placed in the most aggressive region of the chamber so that it, rather than the chuck or other costly assemblies, absorbs the bulk of the plasma and ion-bombardment damage. As it erodes, the geometry that controls edge plasma changes, and so the focus ring is treated as a scheduled-replacement item with a defined service life measured in radio-frequency (RF) hours or processed wafer count.
Because the focus ring governs the transition between wafer and chamber, even small dimensional or material variations translate directly into measurable shifts in edge critical dimension (CD), etch rate and tilt. That sensitivity is exactly why a correctly specified, dimensionally accurate replacement part matters as much as the original, and why this ring is offered to the same form, fit and function as the OEM item.
In a TEL 300 mm etch chamber the focus ring performs several interdependent jobs simultaneously, all of them concentrated in the critical edge zone where process control is most difficult to maintain.
A focus ring lives or dies on its material behaviour under continuous plasma exposure. The part must survive an environment of energetic ions, reactive halogen chemistries and thermal cycling while contributing as little contamination as possible to the wafer it surrounds.
Focus rings for TEL etch chambers are manufactured from high-purity consumable-grade materials, commonly silicon, silicon carbide or quartz depending on the process and chamber generation, chosen for their resistance to fluorine- and chlorine-based etch chemistries and for their predictable, gradual erosion rather than sudden failure.
Beyond raw material, the ring’s machined geometry and dielectric properties determine how faithfully it reproduces the intended edge plasma. Tight tolerances on inner diameter, height, step profile and flatness all matter, because the focus ring effectively sets the electrical and physical boundary conditions for every wafer that passes through.
Because the focus ring controls the most fragile part of the etch process, its condition is reflected almost immediately in production data. A fresh, correctly specified ring widens the usable edge process window; a worn or out-of-specification ring narrows it and erodes yield from the outermost dies inward.
The dominant wear mechanism is gradual erosion of the ring’s upper surface under continuous ion bombardment. As height is lost, the step relationship between ring and wafer changes, the sheath drops below its intended contour, and edge etch rate, CD and tilt drift out of specification, the classic signature of a ring approaching end of life.
Repeated thermal cycling and mechanical handling can initiate cracks or edge chips, particularly in brittle ceramic or quartz materials. A cracked ring is a serious particle source and can compromise seating and the RF return path, so any visible fracture warrants immediate replacement rather than continued use.
As the exposed surface roughens and deposits build up, the ring begins to shed particulate onto the wafer edge and can promote localised micro-arcing. Rising defect counts and edge contamination at the metrology step are common indicators that the ring has degraded beyond its useful service window.
Focus-ring replacement is a routine but precision-critical preventive-maintenance task. The following sequence reflects general best practice; always follow the specific TEL maintenance procedure and your fab’s safety and contamination-control protocols for the exact chamber.
Focus rings are high-turnover consumables, so a reliable, cost-effective supply directly protects fab uptime and the cost-per-wafer of edge-sensitive processes. ESCT Fab Support stocks and sources TEL-compatible focus rings to keep preventive maintenance on schedule without dependence on a single supply channel.
It surrounds the 300 mm wafer in a TEL plasma etch chamber and extends the wafer plane outward, shaping the plasma sheath and electric field at the edge so that ion bombardment and etch behaviour at the wafer rim match the centre. This is what keeps edge critical dimension, profile and uniformity within specification.
No. This is a 2nd-source, new OEM-compatible focus ring, not an original Tokyo Electron part. It is supplied as a new component verified to the same form, fit and function as the OEM item and cross-referenced to TEL P/N 3D10-250946-11 for compatibility.
Service life depends on process chemistry, RF power and wafer throughput, so it is tracked in RF hours or processed-wafer count rather than a fixed calendar interval. The ring is replaced when edge metrology drifts or scheduled preventive maintenance falls due, whichever comes first.
Typical indicators include drifting edge etch rate and CD, increased edge tilt, rising particle or defect counts at the wafer rim, and any visible erosion, cracking or chipping during a chamber open. A measurable loss of ring height is the most direct sign that end of life is near.
The typical lead time is 4-5 weeks. Because focus rings are consumed on a predictable schedule, we recommend ordering ahead of your preventive-maintenance cycle so a verified replacement is on the shelf before the existing ring reaches end of life.
Yes. Quote your TEL chamber and the OEM part number 3D10-250946-11, or our ESCT P/N ES7099-139, and our team can help confirm compatibility for your specific etch process and chamber configuration before you order.
The TEL focus ring JI ATCC-BSP8.3-75LR (OEM P/N 3D10-250946-11, ESCT P/N ES7099-139) is a sacrificial edge-confinement consumable that defines the plasma and electrical boundary at the wafer rim in Tokyo Electron 300 mm etch chambers. By extending the wafer plane and shaping the sheath, it preserves edge etch uniformity, CD control and profile while protecting the electrostatic chuck beneath it. As a predictable wear item, it benefits from disciplined preventive-maintenance scheduling and a dependable supply of dimensionally accurate, plasma-resistant replacements. Offered as a new, 2nd-source part verified to form, fit and function, this ring lets fabs sustain edge yield and tool uptime with confident, cost-effective replacement.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-250946-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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