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The TEL DRM Focus Ring is a circular, wafer-encircling consumable that sits on the electrostatic chuck (ESC) assembly of a Tokyo Electron 300 mm plasma etch chamber, immediately surrounding the 300 mm wafer. Designated by Tokyo Electron under OEM P/N 1D10-302208-13 and supplied by ESCT Fab Support as ES7099-215, it is a precision-machined annular part whose inner bore is dimensioned to seat closely against the wafer edge while its outer profile keys into the cathode hardware below. The “DRM” descriptor identifies it as belonging to a TEL DRM-class dielectric etch process module, where the focus ring is one of the most actively consumed parts in the chamber.
In a plasma etcher, the wafer edge is electrically and geometrically discontinuous: beyond the wafer, the RF field and the sheath above the plasma would distort without a deliberate extension of the chuck surface. The focus ring solves this by extending the effective surface outward, so the ion sheath remains flat and the electric field lines stay vertical across the outermost dies. Because it is exposed to the same energetic ion bombardment and reactive chemistry as the wafer, the focus ring is sacrificial, it erodes over time and is scheduled for periodic replacement as part of preventive maintenance (PM).
Its condition has a direct, measurable influence on edge etch rate, critical dimension (CD) uniformity, etch profile angle and on-wafer particle counts. As a result, the focus ring is treated as a yield-critical consumable rather than a passive spacer, and a steady supply of dimensionally accurate replacement rings keeps a fleet of DRM etch chambers within process specification.
The focus ring performs several overlapping electrostatic, plasma and mechanical functions that together govern how the outermost annulus of the wafer is etched. On a TEL DRM dielectric etch module its principal roles are:
Focus rings for TEL dielectric etch chambers are manufactured from high-purity, plasma-resistant materials chosen so the ring erodes predictably without contaminating the wafer. Common constructions include high-resistivity silicon, silicon carbide (SiC) or quartz, each selected to match the chemistry and RF conditions of the specific recipe. The ES7099-215 is produced to the same material class and dimensional envelope as the original TEL part.
The ring must withstand sustained fluorocarbon and oxygen-based plasma chemistries while keeping erosion slow and uniform. Material purity is critical because any metallic or particulate contamination released as the ring wears will deposit on the wafer edge and degrade yield.
Beyond material grade, the ring’s bore diameter, height, step geometry and flatness define how the sheath behaves at the wafer edge. Resistivity and dielectric properties set the RF coupling, so both physical and electrical characteristics must track the OEM specification closely.
Because the focus ring directly conditions the plasma at the wafer edge, its state drives several of the metrics that fabs monitor most closely. A worn, mismatched or contaminated ring can quietly erode edge yield long before it triggers an obvious fault:
The dominant wear mode is steady erosion of the upper surface and inner step under ion bombardment. As the ring thins, the sheath at the wafer edge drops and tilts, shifting edge CD and profile angle until the ring reaches its end-of-life height and must be replaced.
Thermal cycling, mishandling during PM and localised hot spots can initiate micro-cracks that propagate into chips or fractures. A cracked ring sheds particles onto the wafer edge and can disturb RF coupling, so any visible chipping is cause for immediate replacement.
Polymer and etch by-product build-up, combined with surface roughening, alters the local emissivity and electrical behaviour of the ring. This changes edge temperature and confinement, and flaking of accumulated deposits is a common source of edge defects late in ring life.
Focus ring replacement is a routine PM activity, but it must be performed cleanly and precisely because seating quality directly affects RF return and edge process. The following sequence reflects good practice; always follow the relevant TEL maintenance procedure and your fab’s ESH protocols:
Focus rings are consumed continuously, so a reliable second-source supply protects both cost and uptime. ESCT Fab Support stocks the ES7099-215 as an OEM-compatible alternative to TEL P/N 1D10-302208-13, verified to form, fit and function so it drops into your existing PM workflow:
It surrounds the 300 mm wafer on the chuck and extends the chuck surface outward so the plasma sheath stays flat and the ion paths stay vertical at the wafer edge. This keeps edge etch rate, CD and profile uniform with the rest of the wafer, and it shields the ESC and cathode from plasma erosion.
No. ES7099-215 is supplied as a second-source new, OEM-compatible focus ring. It is not an original Tokyo Electron part, but it is manufactured and verified to match the form, fit and function of TEL P/N 1D10-302208-13 so it can be used in the same DRM etch chambers.
Ring life depends on the recipe, RF power and chemistry, and is normally qualified by your process team against a defined wafer count or RF-hour budget. The ring is replaced at scheduled PM, or sooner if monitoring shows edge CD drift, profile change, rising particles or visible cracking.
TEL dielectric-etch focus rings are typically made from plasma-resistant, high-purity materials such as silicon, silicon carbide or quartz, depending on the process. The ES7099-215 is produced to the equivalent material class and resistivity so that erosion behaviour and RF coupling match the original.
The earliest signs are usually at the wafer edge: drifting critical dimensions, tilted or bowed profiles on perimeter dies, and rising edge particle or defect counts. Left in service, a degraded ring shortens effective PM life and can pull whole lots out of specification.
The typical lead time for ES7099-215 is 4-5 weeks. Because focus rings are a continuous consumable, many fabs hold a buffer stock and place repeat orders against their PM schedule to avoid any gap in supply.
The TEL DRM Focus Ring (OEM P/N 1D10-302208-13, ESCT P/N ES7099-215) is a sacrificial edge consumable that conditions the plasma at the 300 mm wafer perimeter on Tokyo Electron DRM-series etch chambers. By extending the chuck surface, shaping the sheath and field, confining the plasma and protecting the underlying hardware, it directly governs edge etch uniformity, CD control, profile angle and particle performance. It wears predictably through erosion, cracking and surface roughening, making a dependable, dimensionally accurate replacement supply central to both yield and uptime. ESCT Fab Support offers ES7099-215 as a second-source new, OEM-compatible ring, verified to form, fit and function and available on a typical 4-5 week lead time.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 1D10-302208-13. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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