OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The Tapered Polysilicon Section Ring (LAM OEM P/N 716-081665-252) is a segmented, profiled silicon consumable that sits at the outer boundary of the plasma processing region in a 300 mm etch chamber. As its raw nomenclature (“RING, SECTION, TAPER, POLY SI”) indicates, it is a polysilicon ring supplied as a discrete section or segment rather than a single full-circumference monolith, and it carries a tapered (angled or stepped) cross-section that shapes the plasma sheath as it transitions from the wafer edge towards the chamber wall. Within a TEL 300 mm plasma etch platform, components of this class belong to the edge consumable set that surrounds the electrostatic chuck and the wafer perimeter.
Polysilicon is chosen for this duty because it is chemically and electrically compatible with the silicon wafer it surrounds. A silicon-based edge ring etches in the same fluorine- and chlorine-bearing chemistries as the wafer, contributes no foreign metallic or ceramic species to the plasma, and presents a near-identical electrical surface to the discharge. The taper is functional rather than cosmetic: by progressively changing the height and surface angle at the wafer edge, the ring controls how the plasma sheath bends over the last few millimetres of the wafer, which is precisely the region where edge etch uniformity is hardest to hold.
Because it is exposed continuously to ion bombardment, radical flux and thermal cycling, this section ring is a planned-replacement consumable. Its condition directly governs edge die yield, particle performance and the repeatability of the etch process from wafer to wafer and lot to lot, making it one of the higher-turnover items in a fab’s etch spares inventory.
In service, the ring forms part of the consumable assembly that frames the wafer and conditions the plasma at the edge of the active area. Its primary contributions are as follows:
Polycrystalline silicon offers the in-kind chemistry that makes silicon edge consumables attractive. It reacts with the same etch gases as the wafer, so erosion products are silicon-based volatiles rather than contaminating metals or refractory oxides. The material must be of controlled purity and consistent grain structure so that erosion proceeds evenly and predictably across the tapered face.
The taper and the sectioned geometry are the features that distinguish this part from a plain flat ring. The angle, step heights and seating surfaces must be machined to tight tolerance so that the assembled ring presents the intended sheath-shaping profile and seats without gaps that could create field non-uniformities or particle traps.
Because this ring conditions the plasma exactly where edge die live, its state has a direct and measurable effect on output. A worn, mis-seated or contaminated ring shows up quickly in edge metrology and defect data:
The dominant wear mode is steady erosion of the silicon by ion bombardment and chemical etching. Over time the taper recedes and rounds, lowering the effective ring height and gradually shifting the edge sheath profile. This is normal consumption, but once the geometry has changed enough to move edge results out of specification, the ring has reached end of life.
Silicon is brittle, so thermal cycling, mechanical handling and seating stress can initiate cracks or chip the section edges. Because the part is supplied in sections, damaged segment corners and mating faces are a particular concern; a chipped seat can lift the ring, create a particle source and disturb local plasma uniformity.
Etch by-products and process residues can deposit on the ring surface, and films may flake during subsequent cycles. Accumulated deposition alters the surface chemistry and electrical behaviour of the ring and is a common contributor to particle excursions, prompting cleaning or replacement at scheduled maintenance.
Replacement should follow the tool owner’s approved preventive-maintenance procedure and be carried out by trained personnel under proper cleanliness controls. The following sequence reflects good general practice for an edge silicon consumable of this type:
Edge silicon consumables like this section ring are consumed continuously, so stocking and sourcing strategy has a direct effect on tool availability and cost per wafer. ESCT Fab Support helps fabs keep these high-turnover items flowing without over-reliance on a single channel:
It is a tapered polysilicon ring, supplied in sections, that surrounds the wafer at the edge of the plasma region. Its profiled silicon surface extends the plasma boundary outward and shapes the sheath at the wafer edge, helping to hold edge etch uniformity, confine the plasma and protect surrounding hardware.
No. This item is supplied as a second-source, new OEM-compatible part. It is not an original LAM-branded component. It is cross-referenced to LAM OEM P/N 716-081665-252 and verified to match the original in form, fit and function, but it is manufactured and supplied independently of the OEM.
Polysilicon is chemically and electrically in-kind with the silicon wafer. It etches in the same chemistries, presents a similar electrical surface to the discharge and produces silicon-based erosion products rather than metallic or ceramic contamination, which is why it is preferred for surfaces immediately surrounding the wafer.
A sectioned or segmented design defines the edge consumable boundary as discrete pieces. This can ease handling of an otherwise large and brittle silicon component and can simplify replacement, provided each segment is seated flush and gap-free so the assembled boundary behaves as a continuous surface.
Replace it when edge metrology, particle data or process-matching results drift out of specification, or when inspection reveals substantial taper loss, cracking, chipping or heavy deposition. Most fabs set a service-life interval based on accumulated RF or process hours and confirm against in-line results.
The current lead time for this part is approximately 4-5 weeks. For consumables that are replaced on a regular preventive-maintenance cadence, we recommend holding buffer stock or arranging scheduled replenishment so that the wear-driven demand is always covered.
The Tapered Polysilicon Section Ring (LAM OEM P/N 716-081665-252, ESCT P/N ES2099-057) is a segmented, profiled silicon edge consumable for 300 mm plasma etch chambers. Sitting at the wafer perimeter, its tapered polysilicon surface shapes the plasma sheath, supports edge etch uniformity, aids plasma confinement and provides an in-kind sacrificial surface that protects surrounding hardware. As a wear part subject to erosion, cracking and deposition, it should be inspected and replaced on a controlled maintenance schedule. ESCT Fab Support offers this ring as a verified second-source new alternative with a 4-5 week lead time, helping fabs maintain availability and control the cost of ownership for their etch edge consumables.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Lam Research part number 716-081665-252. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Lam Research, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
We use cookies We use analytics cookies to see how visitors use this site, so we can improve it. They are set only if you accept. Read our Cookie Policy.
