OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The Upper Ring is a circular chamber consumable that sits in the upper region of a 300 mm plasma etch process chamber, framing the outer boundary of the discharge volume directly beneath the upper electrode and gas distribution assembly. In this position it forms part of the dielectric and plasma-facing perimeter that surrounds the wafer plane, working alongside the focus ring, edge ring and silicon electrode components to shape the field that governs how the etch behaves across the full diameter of the wafer.
Although it is a passive component with no moving parts, the Upper Ring is anything but incidental. It establishes a controlled gap and dielectric transition at the top edge of the plasma, helps confine the discharge so that it does not extend onto unintended chamber surfaces, and contributes to the symmetry of the electric field that the wafer edge experiences. Because it is continuously exposed to energetic ions, reactive radicals and process by-products, it is treated as a scheduled wear item and replaced on a defined preventive maintenance interval rather than run to failure.
ESCT Fab Support supplies this Upper Ring under part number ES2099-009 as a 2nd Source NEW, OEM-compatible component manufactured to match the form, fit and function of LAM original equipment part 716-443090-202(U3). It is intended as a direct, drop-in alternative that lets fabs maintain plasma confinement integrity and edge process control without depending on a single supply channel.
Positioned at the upper perimeter of the process volume, the Upper Ring performs several interlocking jobs that together preserve a stable, repeatable and well-confined plasma. Each of these functions has a direct line to wafer-level results, which is why the ring is specified, inspected and replaced with the same rigour applied to the more familiar focus and edge rings lower in the stack.
As a plasma-facing consumable, the Upper Ring lives or dies on its material behaviour. It must hold its dielectric and dimensional properties through thousands of RF cycles and aggressive chemistries while contributing as little particulate and contamination as possible to the process environment.
Confinement rings of this type are produced from high-purity dielectric ceramics or quartz selected for stable permittivity, low loss and strong resistance to fluorine- and oxygen-based plasmas. The grade and surface finish are chosen so the ring sustains its insulating behaviour and edge geometry across the full maintenance interval.
Trace contaminants and out-of-tolerance dimensions both translate into defectivity and process drift, so material purity and machining accuracy are treated as primary specifications rather than secondary details.
Because the Upper Ring sits at the edge of the field that defines the plasma, its condition propagates directly into measurable results at the wafer and across the chamber fleet. A worn, contaminated or mis-seated ring rarely fails dramatically; instead it erodes process margin in ways that show up as creeping non-uniformity and rising particle counts.
Continuous ion bombardment and chemical attack gradually erode the plasma-facing surfaces, changing the ring’s geometry and the local field profile. As recession accumulates, the upper plasma boundary shifts, edge uniformity drifts and the ring eventually falls outside its usable dimensional window.
Repeated heating and cooling cycles, combined with any mechanical stress from handling or seating, can initiate microcracks in the ceramic or quartz body. These can propagate to chips or fractures that compromise confinement, create arcing sites and become a substantial particle source.
Polymer and etch by-products deposit on the ring surface over time. Flaking of these films generates particles, while heavy build-up alters surface conditions and can disturb the local field and gas behaviour, so deposition is a primary trigger for cleaning or replacement.
The Upper Ring should be replaced during a planned preventive maintenance window by a trained technician following the relevant tool procedure. Keep it clean and handle it carefully, since this is a brittle, high-purity component whose performance depends on undamaged edges and accurate seating.
Confinement and edge consumables are consumed on a predictable cadence, which makes them ideal candidates for a planned, multi-source spares strategy. Stocking the Upper Ring as an OEM-compatible item from ESCT Fab Support protects preventive maintenance schedules against single-source lead-time risk and price exposure.
It forms part of the dielectric perimeter at the top of the discharge volume, helping confine the plasma, define a controlled gap beneath the upper electrode region and maintain a symmetrical field environment around the wafer edge. It also shields adjacent chamber hardware from direct plasma attack.
No. ES2099-009 is supplied as a 2nd Source NEW, OEM-compatible part. It is manufactured and verified to match the form, fit and function of LAM OEM part 716-443090-202(U3), but it is not an original OEM-branded component.
Replacement is driven by accumulated plasma exposure and your own preventive maintenance data rather than a fixed universal figure. Most fabs change confinement consumables on a scheduled interval, prompted by measured erosion, rising particle counts or edge process drift.
Typical indicators include visible surface recession or discolouration, chips or cracks, heavy by-product build-up, increasing particle adders and a drift in edge etch-rate or critical-dimension uniformity. Any cracking or chipping warrants immediate replacement.
The indicative lead time is 4-5 weeks. Planning replacement against your preventive maintenance calendar and holding appropriate buffer stock is recommended so that ring changes are never gated by procurement.
Because it is built to the original form, fit and function, it is intended to drop into the same position with the same geometry. As with any consumable change, the chamber should be seasoned, conditioned and requalified to your standard recipe before returning to production.
The Upper Ring (LAM OEM P/N 716-443090-202(U3)) is a plasma-facing confinement consumable that helps define the dielectric boundary, gap and field symmetry at the top of a 300 mm etch chamber. Its condition feeds directly into edge uniformity, plasma stability, particle performance and chamber matching, so it is managed as a scheduled wear item. Offered by ESCT Fab Support as part ES2099-009, this 2nd Source NEW, OEM-compatible ring gives fabs a verified, drop-in alternative for protecting both process margin and maintenance schedules.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Lam Research part number 716-443090-202(U3). It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Lam Research, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
We use cookies We use analytics cookies to see how visitors use this site, so we can improve it. They are set only if you accept. Read our Cookie Policy.
