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The Upper Ring HPT is an upper-assembly confinement ring used in LAM 300 mm plasma etch process chambers. It is one of the ring-stack components that sits above the wafer plane, framing the upper boundary of the active plasma region and helping to define the volume in which the discharge is sustained. In the high-power, high-pressure (HPT) operating regimes for which this ring is intended, the upper ring works alongside the lower confinement rings, the gas-distribution showerhead and the cathode assembly to hold the plasma where it is needed and to keep reactive species and ion flux away from chamber surfaces that should remain clean.
As a consumable exposed directly to fluorocarbon, oxygen and inert-gas chemistries under continuous RF excitation, the Upper Ring HPT is a wear item. Its surfaces are subject to ion bombardment, chemical attack and thermal cycling on every process step, and its condition has a direct bearing on plasma symmetry, etch uniformity across the wafer edge, and the particle environment inside the chamber. Because it is positioned in the upper part of the chamber, the ring also influences how cleanly the discharge terminates above the wafer and how gas is steered toward the pumping path.
Carried under ESCT P/N ES2099-032 and matched to LAM OEM P/N 716-007136-002(S), this ring is offered to fabs and refurbishers that need a dependable, dimensionally faithful replacement to keep chambers in production without waiting on extended OEM allocations. Understanding what the part does, how it wears and how to install it correctly protects both yield and chamber uptime.
The Upper Ring HPT performs several inter-related duties at the top of the chamber. It is not a structural part in the load-bearing sense; rather, it is a process-defining surface whose geometry, dielectric behaviour and cleanliness shape the plasma the wafer actually sees.
Upper confinement rings of this class are manufactured from high-purity plasma-grade dielectric materials, typically a fine-grained ceramic or quartz-family material selected for low sputter yield and resistance to fluorine- and oxygen-based chemistries. The objective is a surface that erodes slowly and predictably, releases minimal contamination as it does so, and holds its dielectric properties across the chamber’s process window.
Because the ring defines a geometric boundary of the plasma, its dimensions, flatness and surface finish must match the OEM datum closely. A ring that is out of tolerance or that distorts under thermal load changes the confinement geometry and degrades edge uniformity. The material must therefore tolerate repeated heating and cooling cycles without cracking, warping or shedding particles.
The condition of the Upper Ring HPT is felt directly in process results. As the ring erodes or accumulates deposits, the plasma boundary it defines shifts, and the symmetry it is meant to preserve degrades. The downstream consequences fall on uniformity, defectivity and chamber availability.
Continuous ion bombardment and chemical attack gradually thin the ring and roughen its exposed surfaces. As the profile recedes from the original geometry, the plasma boundary moves with it and edge uniformity drifts. Roughened surfaces also hold polymer more tenaciously and become harder to clean, accelerating the cycle of degradation.
Fluorocarbon chemistries deposit polymer films on cooler ring surfaces. When these films grow thick or are stressed by thermal cycling, they crack and flake, releasing particles into the chamber. Flaking from an upper-chamber surface is particularly damaging because debris can fall onto the wafer below, driving defect excursions.
Thermal shock, mechanical mishandling during service, or over-torquing at the seating interface can crack or chip the ring. Even a small chip changes the local field environment, creates a particle source and can compromise the dielectric isolation the ring is meant to provide, often forcing an immediate replacement.
The Upper Ring HPT should be replaced during scheduled preventive maintenance using clean-handling discipline. Always follow the LAM tool documentation and your fab’s qualified PM procedure; the steps below describe the general sequence.
Confinement rings are recurring consumables, so a sound stocking strategy keeps chambers productive and protects against supply gaps. ESCT supplies the Upper Ring HPT as a verified alternative to OEM allocation, with practical advantages for fabs and refurbishers managing multiple chambers.
It is an upper-assembly confinement ring that helps define the boundary and symmetry of the plasma in a LAM 300 mm etch chamber. It shapes the discharge above the wafer, provides dielectric isolation from grounded hardware and acts as a sacrificial surface against ion bombardment and chemical attack.
No. This is supplied as a new, second-source OEM-compatible part. It is not an original LAM part, but it is manufactured and verified to match the form, fit and function of LAM OEM P/N 716-007136-002(S) so it can be used as a direct replacement.
Order against ESCT P/N ES2099-032, which corresponds to LAM OEM P/N 716-007136-002(S). Keeping both numbers in your stores system makes it easy to match the part to the chamber position when planning maintenance.
Replacement intervals depend on chemistry, RF power, duty cycle and your particle and uniformity limits, so they are best set from your own PM data. As a wear item, the ring is typically swapped on a scheduled PM or whenever erosion, deposit build-up or particle trends indicate it has reached end of life.
The indicative lead time is 4-5 weeks. We recommend holding buffer stock of consumable rings and placing replenishment orders ahead of planned maintenance so that chamber availability is never gated by part supply.
After fitting, verify vacuum integrity and leak performance, run the appropriate season and qualification recipes, and confirm that etch uniformity and particle counts are within specification before releasing the chamber to production.
The Upper Ring HPT (LAM OEM P/N 716-007136-002(S), ESCT P/N ES2099-032) is a plasma-grade upper confinement ring for LAM 300 mm etch chambers. It defines the upper plasma boundary, preserves discharge symmetry, provides dielectric isolation and serves as a sacrificial surface that protects more costly hardware. Because erosion, polymer flaking and cracking degrade uniformity and raise defectivity, the ring is a planned consumable best managed through scheduled PM and buffer stocking. Supplied new and verified to OEM form, fit and function with an indicative 4-5 week lead time, ES2099-032 offers a dependable, cost-effective route to keeping LAM etch chambers in qualified production.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Lam Research part number 716-007136-002(S). It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Lam Research, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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