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The Upper Outer Electrode Ring (TEL OEM P/N 2L10-356319-11, ESCT P/N ES7099-152) is an annular consumable that sits in the upper-electrode assembly of Tokyo Electron 300 mm capacitively coupled plasma (CCP) etch chambers. As the “outer” member of a segmented upper electrode, it surrounds the central showerhead or inner electrode plate and forms the outermost conductive surface that faces the plasma above the wafer edge. The “SST-T V2E” designation identifies it as a specific silicon-grade upper-electrode variant within TEL’s electrode family, supplied here as a precision-machined ring rather than a full electrode block.
In a CCP etch reactor the upper electrode is the RF counter-electrode to the powered lower electrode (the electrostatic chuck). The outer ring completes the radial extent of that upper surface, defining how the RF field and the reactive plasma terminate at the chamber periphery. Because it lives directly in the plasma sheath and is bombarded continuously by ions and radicals, it is treated as a scheduled consumable: it erodes predictably and is swapped at defined wafer counts to keep the chamber within process specification.
Although physically unglamorous, the outer upper-electrode ring has an outsized influence on edge etch uniformity, plasma confinement and particle performance. A worn or mismatched ring shifts the field at the wafer edge, changes critical-dimension uniformity across the outer few millimetres of the wafer, and becomes a source of flaking residue. ESCT supplies ES7099-152 as a second-source, brand-new component manufactured to match the form, fit and function of the TEL original.
Within the upper-electrode stack, the outer ring performs several overlapping electrical, plasma-shaping and mechanical duties simultaneously. It is the periphery of the counter-electrode and therefore the place where the discharge is geometrically and electrically closed off at the edge of the process region.
Upper-electrode consumables of this class are produced from high-purity, plasma-grade material chosen for predictable erosion, low metallic contribution and chemical compatibility with fluorine- and oxygen-bearing etch chemistries. The grade and surface finish directly determine erosion rate, particle behaviour and electrode lifetime.
The ring must withstand continuous ion bombardment and aggressive halogen chemistries without releasing particles or contributing unwanted species back into the discharge. Material purity and a controlled microstructure are what keep the erosion uniform rather than localised.
Because the ring defines a field boundary, its flatness, concentricity and surface finish are as important as its bulk material. Small dimensional deviations translate into measurable edge-uniformity shifts on the wafer.
The condition of the outer upper-electrode ring is closely coupled to the metrics fab engineers watch most: edge uniformity, defect density and chamber-to-chamber matching. As the ring wears, those metrics drift, and an out-of-spec or poorly made ring can degrade them abruptly.
Continuous ion bombardment slowly sputters material from the plasma-facing surface. As the ring thins, the local field geometry changes and the electrode-to-wafer relationship at the edge shifts, gradually pulling edge uniformity out of specification until the ring reaches its replacement count.
Polymer and etch by-products deposit on the ring and, combined with roughened erosion zones, can flake away under thermal and plasma cycling. These flakes become particle adders on the wafer and are a frequent reason for unscheduled wet cleans or premature ring replacement.
Thermal stress, mishandling during service or an uneven seating face can cause cracks, edge chips or poor contact. Any of these compromises the electrical and mechanical integrity of the upper electrode, producing arcing, hot spots or asymmetric plasma that immediately threatens wafer yield.
Replacement should follow TEL maintenance procedures for the specific platform and be carried out by trained technicians in a controlled environment. The outline below describes the typical sequence; always defer to the tool’s documented work instructions.
Upper-electrode rings are scheduled consumables, so a reliable second source protects both cost and availability without compromising process integrity. ESCT supplies ES7099-152 to match the TEL original on form, fit and function.
It forms the outermost conductive surface of the upper electrode in a TEL CCP etch chamber, extending the RF counter-electrode out to the chamber periphery. In doing so it shapes and confines the plasma at the wafer edge and provides a stable RF return geometry, which together govern edge etch uniformity.
No. ES7099-152 is supplied as a brand-new, second-source part that is OEM-compatible with TEL P/N 2L10-356319-11. It is verified to match the original on form, fit and function but is not an original TEL part and is not sold as one.
As a plasma-exposed consumable, it is replaced on a wafer-count or RF-hours schedule set by your process. The interval depends on chemistry, power and recipe; engineers usually correlate erosion and edge-uniformity drift to define the right replacement point for each chamber.
Continued erosion shifts the edge field geometry and degrades edge critical-dimension uniformity, while roughened and deposit-laden surfaces shed particles. Left long enough, this can cause arcing or asymmetric plasma, leading to yield loss and unscheduled downtime.
The typical lead time is 4–5 weeks. Because this is a scheduled consumable, we recommend aligning orders with your preventive-maintenance calendar and holding a buffer so a worn ring can be swapped without waiting on procurement.
Match the TEL OEM P/N 2L10-356319-11 against your upper-electrode bill of materials, and contact ESCT with your chamber configuration. Our team can confirm compatibility for your specific TEL 300 mm etch platform before you commit to an order.
The Upper Outer Electrode Ring (TEL OEM P/N 2L10-356319-11, ESCT P/N ES7099-152) is the outermost member of the upper-electrode assembly in TEL 300 mm plasma etch chambers. It extends the RF counter-electrode to the chamber edge, confines the plasma and stabilises the RF return path, making it a direct lever on edge uniformity, particle performance and chamber matching. As a scheduled consumable subject to erosion, flaking and seating faults, it benefits from disciplined replacement and a dependable supply. ESCT offers this ring brand-new as a second source, verified to form, fit and function, with a 4–5 week lead time to support planned maintenance.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-356319-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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