OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The Focus Ring N (LLD-HT variant), carrying Tokyo Electron OEM part number 1810-250082-11, is a circumferential edge consumable that surrounds the 300 mm wafer on the electrostatic chuck within a TEL plasma etch chamber. As the component sitting immediately outboard of the wafer edge, the focus ring is one of the most influential parts in the entire process kit when it comes to determining how the plasma behaves over the outermost few millimetres of the substrate. The “N” designation and the “LLD-HT” suffix identify a specific chamber and process configuration within the TEL platform, where the ring geometry, height and material set are tuned for a defined etch recipe family and operating temperature window.
Physically, a focus ring of this type is a precision-ground annular component whose inner diameter, top profile and thickness are held to tight tolerances. It rests on a supporting ledge or insulating ring around the cathode and bridges the electrical and geometric discontinuity that would otherwise exist at the wafer edge. Without a correctly dimensioned ring in place, the plasma sheath would terminate abruptly at the substrate perimeter, bending the ion trajectories inward and producing tilted, tapered or otherwise distorted features in the edge exclusion zone.
Because it is directly exposed to energetic ions, reactive radicals and elevated temperatures, the focus ring is a scheduled consumable. It erodes predictably over its service life, and its condition has a first-order effect on edge etch rate, profile angle and particle performance. Maintaining a supply of dimensionally accurate, material-matched rings is therefore a core part of keeping a TEL etch tool within its yield window.
The focus ring performs several interrelated jobs simultaneously, combining electrostatic, geometric and thermal functions to extend uniform plasma conditions beyond the physical edge of the wafer. In a TEL 300 mm chamber its responsibilities include the following.
The performance of a focus ring is governed almost entirely by its material composition and its dimensional precision. Both must remain consistent across every replacement ring if the tool is to maintain a stable, repeatable process from one kit change to the next.
Focus rings for TEL etch chambers are manufactured from high-purity process-compatible materials such as silicon, quartz or silicon carbide, selected so that the ring etches at a controlled rate and does not introduce metallic or particulate contamination into the chamber. The material grade dictates the erosion rate, the cleanliness of the eroded surface and the way the ring interacts with the specific etch chemistry of the LLD-HT recipe family.
Beyond material, the ring’s inner diameter, top-surface height relative to the wafer plane and overall flatness determine how cleanly the plasma sheath bridges the wafer edge. Small deviations in height step or concentricity translate directly into edge tilt and uniformity drift.
Because it controls conditions over the wafer edge, the focus ring has a disproportionate effect on yield relative to its size and cost. The condition of this single consumable shows up directly in edge-zone process data and in particle counts.
As a sacrificial consumable, the focus ring is expected to wear, but it fails the process in characteristic ways that maintenance teams learn to recognise.
The dominant wear mode is steady erosion of the top surface and inner edge under ion bombardment. As the ring thins, the sheath at the wafer edge drops, ion trajectories tilt inward and edge profiles begin to slope. This drift accumulates over RF hours until the ring crosses its consumption limit and edge yield falls outside specification.
The high-temperature operating environment implied by the LLD-HT designation subjects the ring to repeated thermal cycling. Micro-cracks, chips or fractures can develop, particularly if a ring is mishandled, seated unevenly or run beyond its rated life. A cracked ring is an immediate particle and arcing risk and warrants prompt replacement.
Late in life the eroded surface roughens and polymer or by-product deposits can accumulate and flake. Both effects raise on-wafer particle counts and can cause localised process non-uniformity, driving the need for a kit change before the nominal erosion limit is reached.
Focus ring replacement is a routine but contamination-sensitive procedure that must follow Tokyo Electron’s documented maintenance and safety practices. The following sequence outlines the general approach; always defer to the tool-specific procedure for the chamber configuration.
Focus rings are high-frequency consumables, so a reliable, dimensionally consistent supply protects tool availability and yield. ESCT Fab Support offers this ring as a cost-effective, qualified alternative to sole-source OEM procurement.
It surrounds the 300 mm wafer on the chuck and extends the plasma sheath beyond the wafer edge, keeping ion trajectories vertical at the outermost dies. This preserves edge etch uniformity and feature profile angle, and it protects the chamber hardware beneath it by eroding sacrificially.
No. This ring is supplied as a second-source, new part that is OEM-compatible, verified to match the form, fit and function of the original. It is not an original Tokyo Electron part and is not sold as one, but it is intended as a direct replacement for the equivalent OEM ring.
Rings are normally replaced on an RF-hour or consumption-counter basis defined for the recipe. Practical indicators include drifting edge etch-rate uniformity, tilting edge profiles, rising particle counts, or any visible cracking, chipping or excessive height loss observed during preventive maintenance.
The LLD-HT suffix identifies a specific chamber and high-temperature process configuration for which this ring geometry and material are intended. Because focus rings are configuration-specific, you should confirm that your chamber matches this variant before ordering; our team can help verify fitment against your tool.
Focus rings of this class are produced from high-purity, process-compatible materials such as silicon, quartz or silicon carbide, chosen to erode cleanly and avoid contaminating the wafer edge. The exact grade is matched to the original specification so that erosion behaviour and electrical properties remain consistent with the OEM ring.
The typical lead time is 4-5 weeks. Because focus rings are consumed predictably with RF hours, we recommend forecasting consumption against your kit-change interval and holding buffer stock so that replenishment orders are placed well ahead of reaching the consumption limit.
The Focus Ring N (LLD-HT variant), OEM P/N 1810-250082-11 and ESCT P/N ES7099-220, is a critical edge consumable for TEL 300 mm plasma etch chambers. By extending the plasma sheath beyond the wafer edge and maintaining vertical ion trajectories, it governs edge etch uniformity, feature profile, edge die yield and particle performance. As a sacrificial part it wears predictably and must be replaced on schedule with a dimensionally accurate, material-matched ring. ESCT Fab Support supplies this component as a qualified second-source new part, offering consistent quality, clear cross-referencing and a 4-5 week lead time to keep your TEL etch tools running within their yield window.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 1810-250082-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
We use cookies We use analytics cookies to see how visitors use this site, so we can improve it. They are set only if you accept. Read our Cookie Policy.
