2010-251681-11
FOCUS RING,LAB 360-T4.5-310

TEL focus ring LAB 360-T4.5-310 (OEM P/N 2010-251681-11), edge confinement consumable for Tokyo Electron 300 mm plasma etch systems

ESCT P/N ES7099-048 • Tokyo Electron (TEL) 300 mm etch chamber focus ring

The TEL focus ring designated LAB 360-T4.5-310 is an annular consumable that sits in the upper electrode/cathode region of a Tokyo Electron 300 mm plasma etch chamber, encircling the wafer and bridging the area between the wafer edge and the surrounding chamber hardware. Its purpose is to extend the plasma sheath and electric field profile beyond the silicon edge so that the outermost few millimetres of the wafer see the same ion energy and angular distribution as the wafer centre. In a process module where edge-to-edge uniformity is measured in single-digit percentages, this single ceramic part has a disproportionate influence on yield.

Because the focus ring is mounted directly in the path of energetic ions and reactive radicals, it is a sacrificial component by design. It erodes preferentially so that the more expensive electrode, electrostatic chuck and chamber liner do not. The dimensional code embedded in the name, nominally a 360 mm-class outer profile, a 4.5 mm-order thickness reference and a 310 series fitment, reflects the close tolerancing required for the ring to seat correctly against the cathode and present the right step height relative to the wafer surface.

ESCT Fab Support supplies this focus ring under part number ES7099-048 as a second-source, new component manufactured to the form, fit and function of the original TEL part, with a typical lead time of 4–5 weeks. It is intended for fabs running TEL 300 mm dielectric and conductor etch processes that need a dependable, cost-controlled supply of edge-confinement consumables.

Functional role of the focus ring in Tokyo Electron etch platforms

In a TEL 300 mm etch chamber the focus ring performs several interrelated jobs at once, and small changes in its geometry or surface condition propagate directly into the edge process window. Its principal functions include:

• Extending the plasma sheath radially outward so the electric field does not collapse at the wafer perimeter, keeping ion trajectories vertical at the wafer edge.
• Controlling edge etch rate and critical dimension (CD) by tuning the local sheath thickness through the ring’s height relative to the wafer top surface.
• Confining the plasma over the active area and reducing stray etching of chamber surfaces outside the wafer footprint.
• Providing a defined termination for the RF field at the wafer edge, supporting a consistent impedance environment across the electrode.
• Acting as a sacrificial shield that protects the underlying cathode, electrostatic chuck rim and ceramic insulator ring from direct ion bombardment.
• Helping manage edge thermal boundary conditions, which influence reaction kinetics and polymer deposition in the outer wafer zone.

Material and process performance

Material selection and plasma resistance

Focus rings of this class are produced from high-purity dielectric or semiconductor-grade materials, commonly quartz/fused silica, high-purity silicon or fine-grained ceramic, chosen so the ring is chemically compatible with the process chemistry and does not introduce metallic or particulate contamination into the wafer edge. The key material attributes are:

• High purity to avoid mobile-ion and metal contamination at the sensitive wafer perimeter.
• Resistance to fluorine- and chlorine-based plasma chemistries and to physical sputtering by energetic ions.
• Controlled dielectric properties so the ring presents the intended electrical termination to the RF field.
• Thermal stability across repeated heating and cooling cycles without cracking or excessive distortion.

Dimensional accuracy and surface finish

Because the ring tunes the edge sheath through its physical step height and inner profile, dimensional fidelity to the original TEL part is required. ES7099-048 is machined and finished to reproduce the seating geometry, inner-diameter step and surface texture of the OEM ring so that process engineers do not have to re-baseline the edge recipe after installation:

• Tight tolerance on thickness and step height to preserve the established edge CD and tilt response.
• Flatness and concentricity control so the ring seats evenly and does not rock or create a non-uniform gap.
• Consistent surface finish to give predictable erosion behaviour and particle performance over the ring’s service life.

Impact on tool performance and yield

A worn, mis-seated or out-of-spec focus ring is one of the most common root causes of edge-zone yield loss in plasma etch. As the ring degrades, its consequences appear across multiple metrics:

• Edge CD drift and a widening centre-to-edge uniformity gap as the sheath height at the perimeter changes.
• Etch profile tilt or “edge roll” on the outer few millimetres, where features lean inward or outward.
• Rising particle counts and defectivity as the eroded ring sheds material onto the wafer.
• Reduced effective wafer yield as edge die fall outside specification limits.
• Shorter intervals between wet cleans and unscheduled chamber interventions, lowering tool availability.

Common wear and failure modes

Erosion and height loss

The dominant wear mode is gradual thinning of the ring as ions sputter material from its upper surface. As the step height drops, the local sheath at the wafer edge changes shape, edge etch rate and CD shift, and the process eventually drifts outside its control limits. This wear is expected and is the reason the focus ring is treated as a scheduled consumable rather than a permanent component.

Cracking and thermal stress

Repeated thermal cycling, mechanical clamping stress and occasional handling shocks can initiate micro-cracks, chips or full fractures, particularly in brittle quartz or silicon. A cracked ring can suddenly alter the field environment, generate large particles, or in severe cases interfere with wafer clamping and handling, forcing an unplanned chamber stop.

Deposition build-up and contamination

Polymer and by-product films deposit on the ring surface over time. If this build-up flakes, it becomes a particle source; if it accumulates unevenly, it distorts the local plasma. A ring whose surface or purity has degraded can also become a source of edge contamination, which is why timely replacement matters as much as raw erosion budget.

Installation and replacement guidance

Replacement should follow the equipment owner’s approved preventive-maintenance procedure for the specific TEL chamber, performed in a clean environment by trained technicians. A representative sequence is:

• Place the tool in the correct maintenance mode, vent the chamber, and confirm RF and gas are isolated and the chamber is at a safe temperature.
• Open the chamber following the OEM access procedure and inspect the cathode, electrostatic chuck rim and adjacent rings for collateral wear or residue.
• Remove the worn focus ring carefully using gloved, lint-free handling, noting its orientation and seating reference features.
• Clean the seating surface and surrounding hardware per the approved procedure so the new ring beds down without trapped particles.
• Install ES7099-048 in the correct orientation, verifying that it seats flat, fully and concentrically with no rocking or gap.
• Close and pump down the chamber, then run leak-check, season/conditioning and any required RF set-up steps.
• Qualify the chamber with monitor wafers, confirming edge CD, uniformity and particle performance before returning to production.

Spare parts strategy for Tokyo Electron etch consumables

Focus rings are high-turnover consumables, so a reliable second source materially improves chamber availability and cost per wafer. Sourcing ES7099-048 through ESCT Fab Support gives fabs several advantages:

• New, second-source parts built to the form, fit and function of TEL OEM P/N 2010-251681-11.
• Competitive pricing on a frequently consumed item, reducing total cost of ownership on edge consumables.
• A predictable 4–5 week lead time that supports planned PM scheduling and buffer-stock strategies.
• A single ESCT part number (ES7099-048) for clean purchasing, traceability and reorder.
• Supply-chain diversification that reduces dependence on a single OEM channel for critical etch spares.

Frequently asked questions

What does this focus ring actually do in the chamber?

It surrounds the wafer and extends the plasma sheath and electric field past the silicon edge, so the outer few millimetres of the wafer see the same ion energy and direction as the centre. This keeps edge etch rate, critical dimension and profile within specification and protects the underlying electrode hardware.

Is this an original TEL OEM part?

No. ES7099-048 is supplied as a new, second-source component manufactured to match the form, fit and function of TEL OEM P/N 2010-251681-11. It is not an original OEM part and is not sold as one; it is offered as a compatible alternative for fabs seeking a reliable, cost-effective supply.

How often does a focus ring need replacing?

Service life depends on the process chemistry, power levels and run time, so there is no single figure. Most fabs replace focus rings on a defined preventive-maintenance interval or when edge uniformity, CD or particle data indicate the ring has eroded beyond its control limit. Tracking edge metrics is the most reliable way to time replacement.

Will I need to re-tune my etch recipe after fitting it?

The part is dimensioned to reproduce the OEM ring’s seating geometry and step height, so in most cases the existing edge recipe carries over. As with any consumable change, we recommend qualifying the chamber with monitor wafers and confirming edge CD, uniformity and particle performance before returning to production.

What is the lead time and how do I order?

The typical lead time for ES7099-048 is 4–5 weeks. Because focus rings are consumed continuously, many customers place standing or buffer-stock orders aligned to their PM schedule. Quote the ESCT part number ES7099-048, and the TEL reference 2010-251681-11 if helpful, when requesting a quotation.

How should the ring be handled and stored?

Handle it only with clean, gloved hands or appropriate tooling, keep it in its protective packaging until installation, and avoid mechanical shock to prevent chipping or cracking of the brittle ceramic or silicon. Store in a clean, dry environment to keep the surface free of contamination before fitting.

Summary

The TEL focus ring LAB 360-T4.5-310 (OEM P/N 2010-251681-11), supplied by ESCT Fab Support as ES7099-048, is a sacrificial edge-confinement consumable for Tokyo Electron 300 mm plasma etch chambers. By extending the plasma sheath beyond the wafer edge and tuning the local field through its precise step height, it governs edge critical dimension, etch profile, uniformity and particle performance, while shielding the cathode and chuck from ion bombardment. Manufactured to the form, fit and function of the OEM ring and offered as a new, second-source part with a 4–5 week lead time, it gives fabs a dependable, cost-controlled way to keep edge yield stable across preventive-maintenance cycles.

Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2010-251681-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.

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