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The TEL focus ring identified by OEM part number 2L10-252514-11 is an annular plasma-confinement consumable that sits in the immediate edge region of a 300 mm wafer in a Tokyo Electron plasma etch process chamber. Carried on the electrostatic chuck assembly and surrounding the outer circumference of the wafer, the focus ring extends the plasma sheath beyond the silicon edge so that the reactive ion flux which arrives at the last few millimetres of the wafer behaves as closely as possible to the flux arriving at the centre. The internal designation BSP 305-70-T7.5 captures the geometry that defines that behaviour, an inner bore sized to seat closely around a 300 mm wafer, an outer diameter in the region of 305 mm and a profiled thickness on the order of 7.5 mm that governs sheath height at the wafer perimeter.
In an etch chamber the focus ring is a sacrificial component. It is positioned in the most aggressive part of the discharge, exposed to energetic ion bombardment, fluorine- and chlorine-bearing radicals, and the steep electric-field gradients that exist where the powered cathode meets the chamber edge. Because it is consumed during normal operation, it is one of the highest-turnover wet-clean and preventive-maintenance items in the chamber, and its dimensional state has a direct, measurable effect on edge die yield.
This component is supplied by ESCT Fab Support as part number ES7099-176, a second-source new part manufactured and verified to the form, fit and function of the original Tokyo Electron item. It is intended as a like-for-like replacement consumable for fabs and tool refurbishers managing the recurring cost of edge-ring maintenance on TEL 300 mm etch platforms.
The focus ring exists to make the wafer behave, electrically and chemically, as if it were larger than it actually is. By presenting a continuation of the wafer surface at the same approximate height and dielectric character, it pulls the plasma sheath outward and keeps ion trajectories at the wafer edge vertical rather than tilted. In a TEL etch chamber its principal functions include:
Focus rings for TEL etch chambers are produced from carefully selected plasma-grade materials whose erosion characteristics, electrical properties and particle behaviour are matched to the process. The choice of material and the precision of the machined profile together determine how long the ring holds its electrical and dimensional function before edge performance drifts.
Edge rings in this service are typically made from high-purity silicon, silicon carbide or fine-grain isotropic graphite depending on the specific etch recipe and chemistry the chamber runs. The governing requirements are consistent across material families:
The BSP 305-70-T7.5 profile is more than a description of size; it is a functional specification. Inner bore concentricity, outer diameter, the approximately 7.5 mm thickness and any stepped or chamfered top surface all influence sheath height and field shaping at the wafer edge. ESCT-supplied rings are held to tight tolerances on:
Because the focus ring controls conditions at the very edge of the wafer, its condition translates almost directly into edge-die yield and tool availability. A correctly specified, dimensionally sound ring keeps the process window wide; a worn or out-of-spec ring narrows it. The practical consequences include:
The focus ring is designed to wear, but the way it wears determines when it must be replaced and what symptoms appear at the wafer before that point.
The dominant failure mode is gradual erosion of the top surface by ion bombardment. As the ring thins from its nominal 7.5 mm, the sheath at the wafer edge drops, ion trajectories begin to tilt and edge critical dimension drifts. Left in service too long, the ring reaches a point where edge die fall outside specification and the process can no longer be corrected by recipe adjustment.
Repeated thermal cycling, mishandling during installation, or a localised hot spot can crack a brittle silicon, silicon carbide or graphite ring. A cracked ring is an immediate particle hazard, can disturb the local field and may damage the chuck. Any visible chip, crack or fracture is cause for immediate removal regardless of remaining thickness.
Towards end of life the eroded surface becomes rough, pitted or develops re-deposited polymer build-up. This degraded surface sheds particles onto the wafer edge and can alter the local erosion rate, showing up as a rise in edge defect counts well before the ring is fully consumed. Monitoring particle trends is often a more sensitive end-of-life indicator than thickness alone.
Focus-ring replacement is a routine but exacting preventive-maintenance task. Because the ring sits on the electrostatic chuck and defines edge conditions, cleanliness and correct seating are critical. The following sequence reflects good practice; always defer to your facility’s approved procedure and the relevant Tokyo Electron maintenance documentation.
Focus rings are recurring-spend items: every chamber consumes them on a predictable cycle, and lead time on edge consumables directly affects how lean a fab can run its inventory without risking unplanned downtime. ESCT Fab Support helps customers manage that exposure with verified second-source parts and dependable supply.
It surrounds the 300 mm wafer at its outer edge and extends the plasma sheath beyond the silicon, keeping ion trajectories vertical and etch behaviour uniform from the wafer centre out to the edge die. It also acts as a sacrificial surface that protects the electrostatic chuck from direct ion bombardment.
No. This is a second-source new part supplied by ESCT Fab Support. It is manufactured and verified to match the form, fit and function of the original Tokyo Electron item OEM P/N 2L10-252514-11, but it is not an original OEM-branded component.
The ring is replaced when erosion thins it past its usable profile, when edge critical-dimension or uniformity drifts out of specification, when edge particle or defect counts rise, or whenever any chip or crack is found. Many fabs schedule replacement on a wafer-count or RF-hours basis, supplemented by particle and edge-yield monitoring.
Focus rings in this service are produced from plasma-grade materials such as high-purity silicon, silicon carbide or fine-grain graphite, chosen to suit the chamber’s etch chemistry. The material is selected for high purity, predictable erosion and suitable electrical behaviour at the wafer edge.
The typical lead time is 4–5 weeks. Because focus rings are a recurring consumable, we recommend factoring this into your preventive-maintenance planning and holding an appropriate buffer stock to avoid unplanned chamber downtime.
After installation the chamber should be seasoned or conditioned per the approved recipe, then verified with a qualification wafer to confirm edge etch uniformity and particle performance before returning to production. The consumable life counter should also be reset at the same time.
The TEL focus ring identified as BSP 305-70-T7.5, OEM P/N 2L10-252514-11 and ESCT P/N ES7099-176, is a critical edge-confinement consumable for Tokyo Electron 300 mm plasma etch chambers. Seated on the electrostatic chuck around the wafer perimeter, it shapes the plasma sheath, preserves vertical ion incidence at the edge, protects underlying hardware and directly governs edge-die yield, profile control and particle performance. As a sacrificial part it is among the highest-turnover preventive-maintenance items in the chamber, making reliable, dimensionally accurate second-source supply an important part of managing etch tool cost and uptime.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252514-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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