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The focus ring identified by TEL part number 2L10-252587-11 is a precision plasma-facing consumable that sits in the wafer-edge region of a Tokyo Electron 300 mm etch process chamber. Decoded from its descriptor “RING, FOCUS BSP 305-70-T6.5-297”, the part is an annular ring sized to the 300 mm wafer platform, with a nominal section thickness in the region of 6.5 mm and an outer diameter in the 297-305 mm class. It surrounds the wafer on the electrostatic chuck, extending the conductive and dielectric environment of the wafer surface out beyond the substrate edge so that the plasma sheath does not collapse or distort where the silicon ends.
In a TEL capacitively coupled etch chamber, the focus ring is one of the most heavily worked consumables in the kit. It is directly exposed to ion bombardment, radical flux and the RF fields that drive the etch, and it erodes measurably across its service life. Because it controls the shape of the sheath at the precise location where edge die are processed, its condition has an outsized influence on the few millimetres of wafer that historically deliver the lowest yield. A correctly profiled, fresh focus ring keeps the last ring of die behaving like the centre of the wafer; a worn one does the opposite.
ESCT Fab Support supplies this focus ring (ESCT P/N ES7099-186) as a second-source, brand-new component manufactured to match the form, fit and function of the original TEL part. It is intended as a drop-in consumable replacement for engineers maintaining edge etch uniformity, plasma confinement and particle performance on 300 mm TEL platforms, with a typical lead time of 4-5 weeks.
The focus ring is a sacrificial sheath-shaping element. Its primary job is to make the wafer “look” larger to the plasma so that the electrical and chemical conditions seen by edge die match those seen at the wafer centre. In doing so it performs several interlinked functions:
Focus rings for 300 mm etch are produced from carefully selected plasma-resistant materials, most commonly high-purity silicon or quartz, with the choice driven by the chemistry and the need to avoid metallic or particulate contamination. Whatever the base material, dimensional accuracy and surface quality determine how faithfully the ring shapes the sheath and how cleanly it erodes.
The plasma-facing surface must withstand sustained ion bombardment and aggressive radical chemistry while eroding in a slow, uniform and predictable manner. Purity has to be high because any incorporated impurity can be liberated into the plasma and deposited on the wafer as a defect.
The ring’s inner diameter, outer diameter, height step and the roughly 6.5 mm section thickness implied by the descriptor must be held to tight tolerance. Small deviations in step height or flatness directly change the sheath profile over the edge die and the seating of the wafer relative to the ring.
Because the focus ring governs the edge of every wafer, its condition shows up directly in fab metrics. A ring that has eroded beyond its useful window or that was poorly made introduces measurable losses:
The dominant failure mode is normal, expected erosion. Ion bombardment slowly removes material from the plasma-facing surface, lowering the step height and altering the local sheath profile. Edge performance drifts gradually until the ring crosses its qualified wear limit and must be replaced.
Thermal cycling, mechanical handling during preventive maintenance and stress concentrations can crack or chip the ring, particularly with brittle silicon or quartz. A cracked ring is an immediate source of particles and can fail catastrophically, so any visible damage warrants removal from service.
Over many cycles the surface can roughen or accumulate redeposited etch by-products and polymer. This changes the effective surface condition, raises particle risk and can subtly shift RF coupling at the wafer periphery, contributing to edge non-uniformity even before the wear limit is reached.
Focus ring replacement is a routine preventive-maintenance task, but it must be carried out cleanly because the part sits at the most contamination-sensitive point in the chamber. The following sequence reflects good practice; always follow the TEL tool documentation and your fab’s PM procedure.
Focus rings are recurring consumables, so availability and consistency matter as much as the individual part. Sourcing them through ESCT Fab Support gives maintenance and procurement teams a dependable second-source supply that keeps chambers running without over-reliance on a single channel.
It surrounds the wafer on the electrostatic chuck and extends the plasma sheath beyond the wafer edge, keeping ion trajectories vertical and the etch environment uniform across the outermost die. It also shields the chuck and edge hardware from ion bombardment.
No. This ring is supplied as a second-source, brand-new component manufactured to be compatible with TEL P/N 2L10-252587-11. It is verified to match the original in form, fit and function, but it is not an original OEM part and is not sold as such.
Replacement intervals depend on the etch chemistry, power and run hours specific to your process. The ring is a sacrificial consumable that erodes over time; most fabs track its life by wafer count or RF hours and replace it at a qualified wear limit determined by edge uniformity and particle data.
Typical indicators are edge critical-dimension or etch-rate drift, rising particle counts, tilted edge features and a measurable loss of step height on inspection. When edge performance can no longer be held within spec by normal compensation, the ring has reached the end of its useful life.
The typical lead time is 4-5 weeks. Order against ESCT P/N ES7099-186, referencing the OEM number 2L10-252587-11, and plan delivery into your preventive-maintenance schedule so a fresh ring is on hand before the installed one reaches its wear limit.
Any consumable introduced into a qualified etch process should be evaluated under your own change-control and requalification procedure. The ring is built to match the original specification, but edge uniformity and particle performance should be confirmed on the tool before full production release, exactly as with any new consumable.
The focus ring (TEL P/N 2L10-252587-11, ESCT P/N ES7099-186) is a plasma-facing edge consumable for TEL 300 mm plasma etch chambers. Sized to the 300 mm wafer platform with a nominal section near 6.5 mm, it shapes the plasma sheath at the wafer edge, maintains the RF and dielectric environment around the substrate, protects the chuck from ion bombardment and absorbs erosion as a defined, replaceable surface. Its condition directly drives edge critical dimension, uniformity, matching and particle performance, which is why a consistent, well-made replacement is so useful. Supplied by ESCT Fab Support as a second-source NEW part with a 4-5 week lead time, ES7099-186 gives maintenance teams a dependable, form-fit-function-matched option for keeping edge yield stable across a TEL etch fleet.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252587-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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