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The TEL focus ring identified as BSP 305-75-T7.0-297 is a precision annular consumable that encircles the 300 mm wafer within a Tokyo Electron plasma etch process chamber. It is mounted directly on, or immediately adjacent to, the lower electrode and electrostatic chuck assembly, where it forms part of the dielectric and conductive environment that surrounds the wafer edge during etching. The “T7.0” element of the part name denotes the nominal ring thickness in the original supplied condition, a dimension that is fundamental to how the part shapes the plasma sheath above the wafer perimeter.
In a 300 mm etch process, the area where the wafer ends and the chuck hardware begins is electrically and geometrically discontinuous. Without a correctly engineered ring in this position, the plasma sheath would distort at the wafer boundary, ions would arrive at oblique angles, and the outermost dice would etch differently from the centre of the wafer. The focus ring exists to extend the effective etch field beyond the silicon, so that the sheath remains planar and the ion trajectories stay near-vertical right out to the wafer edge. It is consumed steadily by the same plasma it is there to control, which is why it is treated as a scheduled-replacement consumable rather than a permanent component.
This listing, ESCT P/N ES7099-187, is a second-source new ring manufactured to match the form, fit and function of TEL OEM part 2L10-252586-11. It is intended for fab engineers and maintenance teams who need a reliable, qualified alternative to the original consumable without the cost and lead-time burden of single-source OEM supply.
The focus ring performs several interlocking jobs at the wafer edge simultaneously, all of which influence how the outermost few millimetres of every wafer are processed. Its principal functions in a TEL etch chamber include the following:
Because the focus ring is exposed continuously to energetic ions and reactive chemistry, its material composition and dimensional accuracy define both its process performance and its service life. The ring must behave predictably in the plasma while resisting the very erosion that ultimately consumes it.
Focus rings of this type are produced from process-compatible materials such as high-purity silicon, silicon carbide or quartz, selected so that any material sputtered from the ring is benign to the etch chemistry and does not introduce metallic or particle contamination onto the wafer.
The nominal 7.0 mm thickness, the inner and outer diameters and the seating geometry must be held to tight tolerance, because even small deviations alter the sheath shape at the wafer edge and shift edge etch results.
Because the focus ring governs the etch environment at the wafer perimeter, its condition directly translates into edge yield and the stability of the whole process window. A ring that is worn, mismatched or incorrectly seated produces measurable consequences:
The dominant wear mechanism is gradual erosion of the ring’s upper surface by ion bombardment and chemical attack. As the original thickness reduces from its nominal value, the sheath profile at the wafer edge changes progressively, edge etch results drift, and the ring eventually reaches the point where it must be replaced to restore the process to its qualified state.
As erosion proceeds unevenly, the ring surface roughens and may develop micro-cracks or localised pitting. These features become sources of particle shedding, raising defect counts on the wafer and contaminating the chamber, which can trigger unplanned cleans well before the end of the planned maintenance cycle.
Thermal stress, mishandling during installation or a particle trapped under the ring can cause chipping, cracking or poor seating. A ring that does not sit flat compromises electrical contact and the RF return path, distorts the sheath asymmetrically and can lead to arcing or sudden, non-uniform process excursions.
Focus ring replacement should follow the tool owner’s qualified preventive-maintenance procedure. The following sequence reflects general best practice for changing this class of consumable in a TEL 300 mm etch chamber:
Focus rings are scheduled consumables, so their cost and availability have a continuous impact on cost of ownership. Sourcing a qualified second-source equivalent through ESCT Fab Support offers fabs practical advantages:
It surrounds the 300 mm wafer at the lower electrode and extends the plasma sheath beyond the wafer edge, keeping ion bombardment vertical and the etch uniform right out to the wafer perimeter. It also acts as a sacrificial surface that protects the chuck hardware from plasma attack.
No. This is a second-source new part supplied by ESCT Fab Support as an OEM-compatible equivalent to TEL P/N 2L10-252586-11. It is manufactured and verified to match the form, fit and function of the original, but it is not an original OEM-branded component.
Rings are typically replaced on a scheduled basis driven by accumulated RF or process hours, and confirmed by monitoring edge uniformity, critical-dimension drift and particle counts. Visible thickness loss, surface roughening, pitting or cracking are all indicators that the ring has reached the end of its useful life.
It is TEL’s descriptive coding for this specific ring variant. The “T7.0” element refers to the nominal thickness of the ring as supplied, while the remaining numbers correspond to the ring’s dimensional and configuration specification. The authoritative identifiers for ordering are the OEM and ESCT part numbers.
The current lead time is 4-5 weeks. Because focus rings are recurring consumables, we recommend maintaining buffer stock and forecasting replacement intervals so that planned maintenance is never held up waiting for a ring.
The ring is built to match the original’s critical dimensions and material characteristics, so it is designed to drop into the same maintenance procedure. As with any consumable change, you should run your standard chamber season and edge-uniformity requalification before returning the tool to production.
The TEL focus ring BSP 305-75-T7.0-297 (OEM P/N 2L10-252586-11, ESCT P/N ES7099-187) is a wafer-edge consumable for Tokyo Electron 300 mm plasma etch chambers. Sitting around the wafer at the lower electrode, it extends and shapes the plasma sheath so that edge etch uniformity, profile control and particle performance remain within specification. As a steadily consumed part, its material purity, nominal 7.0 mm thickness and dimensional accuracy directly determine edge die yield and process stability. Supplied by ESCT Fab Support as a new, OEM-compatible second source with a 4-5 week lead time, it gives fabs a cost-effective, reliable alternative for a high-frequency maintenance item.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252586-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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