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The TEL focus ring supplied under ESCT P/N ES7099-231 (OEM P/N 2L10-252796-11) is a plasma-facing consumable that sits in the immediate periphery of the 300 mm wafer inside a Tokyo Electron plasma etch chamber. Designated in the raw catalogue as a “FOCUS RING 360-318-5.5 WIDE”, the part follows the geometry typical of a wide-profile focus ring: an annular component whose dimensional callouts describe its outer diameter, inner aperture and the cross-sectional thickness that defines how far it stands proud of the electrostatic chuck. The “WIDE” designation distinguishes it from narrower variants used in the same chamber family, and signals a broader radial land that extends plasma confinement further across the wafer edge.
Within the chamber, the focus ring encircles the wafer and forms a continuation of the electrode surface beyond the wafer’s physical boundary. Because the silicon wafer ends abruptly at its bevel, the electric field, plasma sheath and ion trajectories would otherwise distort at the edge, producing tilted etch profiles, faster or slower edge etch rates and non-uniform critical dimensions in the outermost few millimetres of die. The focus ring corrects this by extending the conductive or dielectric boundary outward, so that the sheath remains flat and the ion flux strikes the wafer edge at the same near-vertical angle it does at the centre.
As a directly plasma-exposed part, the focus ring is consumed during normal production. It erodes process-cycle by process-cycle, and its rate of wear directly determines how long edge etch performance stays inside specification before the ring must be replaced. For high-volume fabs running TEL 300 mm etch tools, the focus ring is therefore one of the most frequently scheduled consumable swaps, and a reliable, dimensionally faithful supply protects edge yield.
The focus ring is not a passive spacer; it is an active element of the plasma electrical environment. Its material, height and radial width are all tuned so that the plasma behaves at the wafer edge exactly as it does over the bulk of the wafer. In a TEL etch chamber it performs several interlinked functions:
Focus rings for TEL 300 mm etch chambers are manufactured from plasma-grade materials selected to match the wafer’s electrical and thermal behaviour while resisting aggressive fluorine- and chlorine-based chemistries. The exact material specified for a given process depends on the etch recipe, but performance ultimately rests on two attributes: how the ring interacts with the plasma electrically, and how slowly and cleanly it erodes.
The ring material is chosen so that its resistivity and dielectric properties continue the wafer’s electrical environment across the edge boundary. A correct match keeps the sheath flat and the local bias uniform, which is what holds edge critical dimensions inside the same window as the wafer centre.
Because the ring is consumed in service, its erosion rate, surface finish and machined tolerances govern both process stability and ring lifetime. A dimensionally faithful ring seats correctly, stands at the intended height and erodes predictably, giving a reliable replacement schedule.
Because the focus ring controls the plasma at the wafer edge, its condition translates directly into edge die yield and chamber availability. A worn, mis-seated or out-of-specification ring is one of the most common root causes of edge-only excursions on TEL etch tools.
The dominant wear mechanism is steady erosion under ion bombardment. As the ring thins, its standoff height falls, the sheath at the edge sinks, ion trajectories begin to tilt and edge critical dimensions drift. Past a threshold height the ring can no longer hold edge uniformity and must be replaced even though it remains physically intact.
Thermal cycling, mechanical handling and uneven seating can crack or chip the ring, particularly at the thin inner land. A cracked or improperly seated ring disturbs local impedance, creates a particle source and can damage the chuck periphery beneath it, so any visible fracture is cause for immediate replacement.
As the plasma-facing surface roughens and accumulates redeposited films, the ring begins to flake and shed particles onto the wafer edge. This shows up as rising edge defect counts well before the ring reaches its erosion limit, and is a frequent trigger for unscheduled cleans or swaps.
Focus ring replacement is a routine preventive-maintenance task, but handle it carefully because the ring is brittle, particle-sensitive and electrically critical. Always follow the relevant TEL maintenance procedure and your fab’s PM checklist; the following is a general sequence:
Focus rings are consumed continuously, so their availability and consistency directly affect both yield and cost of ownership. Sourcing dimensionally faithful, plasma-grade rings through ESCT Fab Support lets fabs hold edge performance steady while controlling spend and lead-time risk:
It encircles the 300 mm wafer and extends the plasma sheath and electrode boundary beyond the wafer edge, keeping the sheath flat and ion incidence vertical at the periphery. That preserves edge etch rate, critical dimension and sidewall angle, and protects the chuck from direct plasma erosion.
No. This ring is supplied as a new, OEM-compatible second-source component verified to the form, fit and function of TEL OEM P/N 2L10-252796-11. It is not an original Tokyo Electron branded part, and is offered as an equivalent alternative to the OEM consumable.
The numbers describe the ring’s geometry, outer and inner dimensions and cross-sectional thickness in millimetres, and “WIDE” identifies the broader radial profile variant used in this chamber family. These dimensions set how the ring seats and how far it extends plasma confinement across the wafer edge.
Lifetime depends on the etch recipe, RF power and run hours, so it is tracked in wafers or RF hours rather than a fixed interval. The ring is replaced once erosion drops its height below the usable window or once edge uniformity and particle data trend out of specification.
The edge sheath sinks as the ring thins, tilting ion trajectories and shifting edge critical dimensions and profile. Edge die yield falls, particle counts rise as the surface roughens, and in severe cases the eroded or cracked ring exposes the chuck periphery to plasma damage.
The indicative lead time is 4-5 weeks. Because focus rings are a recurring consumable, we recommend planning orders against your PM schedule and maintaining buffer stock so chambers are never held waiting on an edge-ring swap.
The wide-profile focus ring under ESCT P/N ES7099-231 (OEM P/N 2L10-252796-11) is a plasma-facing consumable for TEL 300 mm etch chambers that extends the plasma sheath beyond the wafer edge, holds ion incidence vertical and protects the electrostatic chuck. Its material grade, dimensional accuracy and controlled erosion behaviour directly govern edge critical dimension uniformity, particle performance and chamber availability. Supplied as a new, OEM-compatible second-source part on an indicative 4-5 week lead time, it lets fabs sustain edge yield and a predictable replacement cadence while reducing reliance on a single supply channel.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252796-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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