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The Focus Ring 298.1-T3.6 (302.2) is a consumable edge ring fitted to Tokyo Electron 300 mm plasma etch process chambers, where it encircles the production wafer and forms the immediate boundary between the wafer edge and the surrounding chamber hardware. The descriptor embedded in the part name follows TEL’s dimensional shorthand: an inner aperture of approximately 298.1 mm that clears the 300 mm wafer, a ring profile thickness in the region of 3.6 mm, and an outer envelope of approximately 302.2 mm. Those few millimetres of annular real estate carry a disproportionate influence over how plasma behaves across the outermost die of every wafer processed.
In a TEL etcher, the focus ring sits concentrically on the electrostatic chuck (ESC) just outside the wafer clamping area. Its role is to extend the surface that the plasma sheath “sees” beyond the physical edge of the wafer, so that the electric field lines and ion trajectories that govern etch directionality do not collapse or distort at the wafer perimeter. Without a correctly conditioned focus ring, the sheath bends inward at the wafer edge, ions arrive at an angle rather than vertically, and the edge die suffer tilted profiles, critical-dimension drift and reduced yield.
Because the focus ring is directly exposed to the same energetic ion bombardment and reactive chemistry as the wafer, it is a scheduled-wear item. It erodes predictably over thousands of RF hours, and its recession is one of the primary drivers of edge process drift between preventive-maintenance cycles. Treating it as a managed consumable, rather than waiting for it to fail, is central to keeping a TEL etch chamber inside its process window.
The focus ring is a small part with several simultaneous electrical and process responsibilities. On a TEL plasma etcher it performs the following core functions:
Focus rings for TEL etch chambers are manufactured from plasma-grade materials selected to balance etch resistance, electrical behaviour and freedom from metallic contamination. The 298.1-T3.6 ring is supplied to match the material class, flatness and dimensional tolerances of the seat it occupies, so that it integrates cleanly into the existing edge stack.
The ring material must withstand sustained exposure to fluorine- and chlorine-based etch chemistries and continuous ion bombardment while eroding in a slow, uniform and predictable manner. Controlled erosion behaviour is what allows recession to be tracked and compensated.
The 298.1 mm inner aperture, 3.6 mm profile thickness and 302.2 mm outer dimension are not arbitrary, they set the gap to the wafer edge and the height of the ring relative to the wafer surface, both of which directly tune sheath shape and edge coupling.
Because it directly shapes the plasma over the wafer edge, the condition of this focus ring shows up immediately in edge metrology. The consequences of running a worn, mismatched or damaged ring include:
The dominant wear mode is gradual sputter erosion of the upper surface, which lowers the ring height relative to the wafer. As the 3.6 mm profile thins, the sheath geometry changes, the wafer edge gradually moves out of the optimum field and edge CD begins to drift, the trigger for scheduled replacement.
Thermal cycling, mishandling during preventive maintenance, or arcing can crack or chip the ring. Fractures create local field distortions, become particle sources and, in severe cases, can expose or damage the chuck beneath, making the ring unfit for further service.
Polymer and by-product films can accumulate on the ring surface, then flake to generate defects, while inconsistent seating or contamination can promote localised arcing. Arc sites pit the surface, perturb the edge bias and accelerate further degradation.
Focus-ring replacement is a routine preventive-maintenance activity but demands careful handling and cleanliness, as the ring sits on a high-value chuck and directly governs edge process behaviour. Always follow the OEM procedure and your site’s safety controls; the sequence below is a general guide.
Focus rings are high-frequency consumables, so hold qualified, compatible stock to avoid edge-yield loss and unplanned downtime. ESCT Fab Support offers the ES7099-196 focus ring as a cost-effective, form-fit-function alternative to sole-sourcing through the OEM:
It surrounds the 300 mm wafer at the chuck edge and extends the plasma sheath beyond the wafer perimeter, keeping ion trajectories vertical at the edge so the outermost die etch with the same profile and critical dimension as the centre of the wafer.
No. ES7099-196 is supplied as a second-source new part that is verified to the form, fit and function of TEL OEM P/N 2L10-252614-11. It is fully compatible with the application but is not an original OEM-branded component.
They are the ring’s key dimensions in TEL’s shorthand: an inner aperture of approximately 298.1 mm, a profile thickness in the region of 3.6 mm, and an outer dimension of approximately 302.2 mm. These set the wafer-to-ring gap and ring height that tune the edge plasma.
Replacement is driven by accumulated RF hours and measured erosion rather than a fixed calendar date. Most fabs tie it to a preventive-maintenance interval and track height recession, swapping the ring once edge CD or profile metrics begin to drift toward their control limits.
Typical indicators are rising edge-to-edge CD non-uniformity, tilted edge-die profiles, increasing particle counts and a measurable drop in ring height. Visible cracking, chipping or arc pitting are immediate grounds for replacement regardless of remaining height.
The typical lead time is 4–5 weeks. Because the focus ring is a recurring consumable, we recommend holding buffer stock aligned to your PM schedule so a replacement is always on hand for planned maintenance.
The Focus Ring 298.1-T3.6 (302.2), ESCT P/N ES7099-196, is an edge plasma-confinement consumable for TEL 300 mm plasma etch chambers and a compatible alternative to OEM P/N 2L10-252614-11. By extending the plasma sheath beyond the wafer edge and maintaining a controlled electrical and physical boundary, it preserves anisotropy, critical-dimension uniformity and yield on the outermost die. As a predictable wear item it should be managed as a tracked consumable, replaced on erosion-driven intervals, and kept in qualified buffer stock. Supplied as a second-source new part to a typical 4–5 week lead time, ES7099-196 gives TEL etch users a dependable, cost-effective way to keep their chambers inside the process window.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252614-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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