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The focus ring identified by TEL part designation 360-298.1-T13.1D is a precision annular consumable that sits at the very edge of the electrostatic chuck in a Tokyo Electron 300 mm plasma etch chamber. It encircles the 300 mm wafer, with its inner aperture sized close to the wafer diameter and its outer profile shaped to integrate with the surrounding edge hardware. In this position it does the unglamorous but critical work of extending the plasma sheath and RF field uniformly across the outermost millimetres of the wafer, where edge effects would otherwise corrupt etch results.
In any capacitively coupled or dual-frequency etch chamber, the region immediately beyond the wafer edge is electrically and physically discontinuous. Without a sacrificial ring to bridge that discontinuity, the plasma sheath bends downward at the wafer perimeter, ion trajectories tilt inward, and the etch front tilts, bows or slows across the edge exclusion zone. The focus ring presents a surface that is electrically and dimensionally matched to the wafer so that the sheath remains flat and the ion flux stays vertical right to the last die. The “T13.1” element of the designation reflects the ring thickness/step geometry that sets this sheath alignment, and the trailing “D” denotes the specific revision or material variant of that profile.
Because it is directly exposed to ion bombardment and reactive chemistry, the focus ring is a scheduled consumable rather than a permanent assembly. Its erosion rate, surface condition and dimensional drift directly govern edge critical dimension (CD), edge tilt and particle performance, which is why fabs track it as a wear-limited item with a defined replacement interval. ESCT Fab Support offers ES7099-155 as a second-source, new equivalent so that planned edge-ring changes need not be held hostage to OEM allocation.
The focus ring is far more than a mechanical spacer. It is an active participant in shaping the electromagnetic environment at the wafer edge, and its design balances electrical coupling, plasma confinement and sacrificial wear. Its principal functions within a TEL 300 mm etch chamber include:
Focus rings for TEL etch chambers are produced from carefully selected materials whose plasma compatibility, electrical behaviour and erosion characteristics are matched to the process and to the wafer they surround. Material choice is the single largest driver of both performance and consumable life.
Edge rings in this class are commonly fabricated from high-purity silicon, silicon carbide or quartz depending on the process chemistry. Silicon and SiC are favoured for fluorine- and oxygen-based etches because they erode predictably and shed minimal metallic contamination, while quartz suits certain oxide and confinement roles. ES7099-155 is supplied to match the form, fit and material function of the original ring so it integrates cleanly with the rest of the chamber consumable set.
The 360-298.1-T13.1D geometry, including its inner aperture, step height and overall thickness, is held to tight tolerance because the sheath alignment at the edge depends on the ring sitting at the correct height relative to the wafer surface. Flatness, concentricity and thickness consistency all feed directly into edge CD uniformity.
Few consumables have as direct a relationship with edge yield as the focus ring. As it erodes, its top surface recedes and the sheath geometry it once held in place begins to drift, progressively degrading the outermost dies. The condition of this single ring therefore propagates straight into the fab’s edge yield metrics:
Understanding how a focus ring fails helps engineers set a sensible replacement interval and recognise when an unscheduled change is warranted.
The dominant wear mode is steady erosion of the top surface by ion bombardment and reactive chemistry. As thickness is lost, the ring’s height relative to the wafer drops, the sheath sags at the edge and edge etch performance drifts out of specification. This is the wear mechanism that defines the planned change interval.
Repeated thermal cycling, mechanical handling during wafer transfer, and rough installation can crack or chip a brittle silicon or quartz ring. Cracks become particle sources and can compromise the sheath locally, so any chipped ring should be removed from service immediately rather than run to the scheduled interval.
Late in life, an eroded or roughened ring surface can shed particles or accumulate polymer and redeposited material that subsequently flakes. The result is rising defectivity on production wafers, which often appears before the ring reaches its dimensional erosion limit and is a frequent trigger for preventive replacement.
Focus rings should be changed during scheduled preventive maintenance using clean-room handling discipline. The following sequence reflects good practice; always defer to your tool’s qualified PM procedure and safety interlocks.
Edge rings are high-frequency consumables, so a reliable second-source supply is central to keeping etch chambers running without yield risk or schedule exposure. ESCT Fab Support supplies ES7099-155 to help fabs maintain continuity of supply alongside the OEM channel:
It surrounds the 300 mm wafer at the edge of the electrostatic chuck and extends the plasma sheath and RF field outward so the etch stays uniform and the ion trajectories stay vertical across the outermost dies, where edge effects would otherwise distort the result.
No. ES7099-155 is supplied as a second-source, new part that is verified to the form, fit and function of TEL OEM P/N 2L10-252346-11. It is a compatible replacement and is not an original OEM-branded component.
Replace it when it reaches its erosion/thickness limit, when edge CD or particle metrics drift out of specification, or immediately if it is cracked or chipped. Most fabs run it to a planned interval validated against monitor-wafer data.
Rings in this class are typically high-purity silicon, silicon carbide or quartz, chosen for the process chemistry. ES7099-155 is supplied to match the material function of the original ring so it behaves correctly under plasma.
The current quoted lead time is 4-5 weeks. Because focus rings are consumed on a regular interval, we recommend ordering against your PM forecast to maintain buffer stock.
Because the ring is matched to the original form, fit and function, it is intended to behave equivalently. As with any consumable change, we recommend qualifying it on a monitor wafer and confirming edge CD and particle performance before full production release.
The TEL focus ring 360-298.1-T13.1D (OEM P/N 2L10-252346-11, ESCT P/N ES7099-155) is an edge consumable that controls plasma sheath geometry, ion verticality and RF coupling at the perimeter of 300 mm wafers in TEL plasma etch chambers. Its material purity, dimensional accuracy and erosion behaviour directly govern edge CD uniformity, profile control and particle performance, making it a wear-limited item that must be tracked and replaced on schedule. Supplied as a second-source new part with a 4-5 week lead time, ES7099-155 gives fabs a dependable alternative for keeping etch edge yield stable.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252346-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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