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The 3D87-003411-14 CEL BODY ASSY. SCCM-OX (SE) is a critical chamber assembly used in Tokyo Electron (TEL) semiconductor processing equipment to support plasma confinement, chamber conditioning, and stable process performance in advanced semiconductor manufacturing applications.
Installed within the process chamber architecture, the cell body assembly serves as a structural and plasma-facing component that helps maintain chamber geometry, regulate plasma interactions, and protect surrounding chamber hardware from direct process exposure. By preserving critical chamber dimensions and supporting stable plasma conditions, the assembly contributes directly to process repeatability, contamination control, and wafer yield.
Because chamber cell assemblies operate under continuous exposure to plasma, reactive process chemistries, thermal cycling, RF energy, and ion bombardment, they are subject to gradual wear and erosion. Maintaining the condition of the cell body assembly is what preserves chamber qualification, process stability, and equipment uptime.
The ESCT equivalent part number for this component is ES7099-026, supplied as a 2nd Source NEW OEM-compatible replacement designed to meet form, fit, and functional requirements aligned with the original TEL component.
The 3D87-003411-14 functions as a critical chamber conditioning and plasma-management assembly.
Core functions include:
In TEL plasma-processing platforms, cell body assemblies commonly operate alongside:
The cell body assembly helps maintain controlled operating conditions within the chamber.
Key performance characteristics include:
Stable chamber architecture holds process performance.
The assembly helps shield critical hardware from direct plasma exposure.
Performance attributes may include:
Protecting primary chamber components helps reduce overall operating costs.
Designed for demanding semiconductor manufacturing environments.
Durability characteristics may include:
Maintaining dimensional integrity is critical for preserving chamber qualification.
The 3D87-003411-14 may operate alongside related chamber components including:
Together these components support chamber optimization and process control.
The 3D87-003411-14 can directly influence chamber performance and manufacturing productivity.
Potential impacts of wear or degradation include:
Replacing a worn cell body assembly can help restore chamber stability and improve process consistency.
Continuous process exposure gradually affects component surfaces.
Indicators include:
Long-term operation may alter component geometry.
Symptoms may include:
Surface degradation may contribute to contamination concerns.
Indicators include:
Failure to replace worn chamber components may accelerate degradation of adjacent consumables and hardware.
To support best performance:
The 3D87-003411-14 CEL Body Assy. SCCM-OX (SE) is an OEM-referenced TEL component.
Key considerations:
Maintaining inventory of the ES7099-026 / 3D87-003411-14 helps reduce downtime exposure and improve maintenance readiness.
It helps maintain chamber geometry, support plasma confinement, and protect surrounding chamber hardware during semiconductor processing operations.
The assembly contributes to chamber stability, process repeatability, contamination control, and overall equipment performance.
It identifies a specific TEL chamber assembly configuration designed for compatible process applications and equipment platforms.
Common indicators include:
Yes. Changes in component geometry can alter plasma behavior and chamber conditions, affecting process consistency.
Yes. Surface degradation and erosion can contribute to particle generation and wafer defects.
Yes. Chamber instability, contamination, and process variation can directly impact yield and manufacturing performance.
Issues are commonly identified through preventive maintenance inspections, chamber qualification testing, particle monitoring, and visual wear analysis.
Yes. Chamber qualification and process verification should always be completed after replacement.
Incorrect dimensions or material specifications may affect chamber compatibility, plasma performance, and process outcomes.
No. This product is supplied as ESCT P/N ES7099-026, a 2nd Source NEW OEM-compatible replacement aligned with the original TEL component requirements.
Yes. Chamber configuration, dimensions, and process requirements should always be confirmed.
Yes. ESCT supports compatibility verification based on equipment specifications and application requirements.
Depending on availability, associated focus rings, electrodes, liners, shields, ground rings, and other plasma-facing components may also be supported.
Preventive replacement helps maintain chamber stability, reduce contamination risks, preserve process consistency, and minimize unexpected production interruptions.
The 3D87-003411-14 CEL Body Assy. SCCM-OX (SE) is a critical chamber assembly that supports plasma confinement, chamber protection, and repeatable semiconductor manufacturing performance in TEL systems.
Its condition can directly influence process uniformity, contamination control, equipment uptime, and wafer yield.
Sourcing through ESCT Fab Support as ES7099-026 provides a verified 2nd Source NEW OEM-compatible replacement backed by semiconductor expertise, quality verification, and responsive supply support.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D87-003411-14. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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