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The Focus Ring (OEM P/N 2L10-252485-11) is a precision plasma-confinement consumable engineered for Tokyo Electron (TEL) 300 mm plasma etch process chambers. As the descriptor “BSP 302-80-T7.5-297” implies, it is a profiled annular ring with a nominal thickness in the order of 7.5 mm and an outer dimension referenced near 297 mm, designed to surround the wafer at the wafer edge and sit directly within the active plasma envelope. In TEL etch platforms, this ring is one of the most directly process-critical of all the chamber consumables because it physically defines where the wafer ends and the surrounding hardware begins, from the plasma’s point of view.
A focus ring of this type is mounted concentrically around the electrostatic chuck (ESC), framing the 300 mm wafer so that its inner bore aligns closely with the wafer perimeter. Its job is to extend the plasma sheath outward beyond the wafer edge, presenting a sacrificial surface to ion bombardment so that the etch field experienced by the outermost die is as close as possible to that seen by die at the wafer centre. Without a correctly dimensioned and correctly conditioned focus ring, the sheath bends at the wafer edge, ion trajectories tilt, and edge die suffer profile tilt and critical-dimension drift.
Because the ring is consumed by the same energetic plasma it helps to shape, it is a scheduled-replacement item. Its erosion rate, surface condition and dimensional profile change continuously through a chamber campaign, and the ring is one of the principal levers fab engineers use to recover edge yield and stabilise etch rate as a chamber ages. Supplying it as a verified second-source new part is therefore central to maintaining wafer output without paying premium OEM lead times.
In a TEL 300 mm etch chamber the focus ring is far more than a mechanical spacer. It actively participates in shaping the electromagnetic and plasma environment at the wafer edge, and it carries a portion of the RF return path that confines the discharge. Its principal functions include:
Focus rings used in dielectric and conductor etch on TEL platforms are manufactured from carefully selected plasma-resistant materials, commonly high-purity silicon, silicon carbide or a comparable engineered grade depending on the chemistry the chamber runs. Material choice is not cosmetic: it governs erosion rate, particle generation and the electrical behaviour of the ring throughout its service life.
The ring’s working face is continuously sputtered and chemically attacked by energetic ions and reactive species. A correctly specified material erodes slowly and, critically, erodes uniformly, so that the ring’s profile stays predictable and its consumption can be matched to a planned preventive-maintenance interval rather than failing unexpectedly.
The “T7.5” thickness and “297” outer reference in the part descriptor point to tight dimensional control. The inner bore, flatness, parallelism and surface finish all directly influence sheath shape and edge uniformity, so the ring must be machined and inspected to demanding tolerances.
Because the focus ring sits exactly where edge-die yield is won or lost, its condition propagates directly into the numbers fab managers watch most closely. A worn, mis-dimensioned or contaminated ring shows up first at the wafer edge and then, as the chamber drifts, across the wafer:
A focus ring is a sacrificial part, so wear is expected and managed, but the way it wears, and the failures that can occur in service, determine how aggressively the replacement interval must be set.
The dominant wear mode is gradual erosion of the ring’s upper face and inner edge under ion bombardment. As height is lost, the sheath drops relative to the wafer plane, edge ion angle tilts and edge etch behaviour shifts. This is the wear that the maintenance interval is designed around.
Repeated thermal cycling, localised hot spots or mechanical stress during handling can initiate cracks in brittle ring materials. A cracked ring can shed large particles, disturb the RF return path and, in severe cases, fragment inside the chamber, forcing an unplanned wet clean.
Polymer build-up, redeposited etch by-products or surface roughening can change the ring’s electrical and particle behaviour, leading to micro-arcing and elevated defectivity. Surface contamination often signals that the ring, and possibly neighbouring edge hardware, has reached the end of its useful campaign.
Focus ring replacement is a routine but precision preventive-maintenance task on TEL etch chambers. It must be carried out under proper cleanroom discipline because the ring sits in direct contact with the wafer edge environment. The following sequence reflects good practice; always defer to your site-approved TEL maintenance procedure.
Focus rings are high-frequency consumables, and OEM lead times can be long and costly. Sourcing verified compatible rings through ESCT Fab Support lets fabs hold the right buffer stock, match consumption to planned maintenance and protect edge yield without overpaying. Advantages of sourcing this ring through ESCT include:
It surrounds the 300 mm wafer and extends the plasma sheath outward past the wafer edge, keeping ion bombardment vertical and etch behaviour uniform on the outermost die. It also acts as a sacrificial barrier protecting the chuck and edge hardware, and forms part of the RF return path at the wafer periphery.
No. This ring is supplied as a second-source new part that is verified to the form, fit and function of TEL OEM P/N 2L10-252485-11. It is not an original Tokyo Electron OEM component and is not sold as one; it is offered as a compatible alternative for maintenance and replacement use.
Replacement is normally driven by accumulated wafer count and by process indicators such as edge critical-dimension drift, loss of centre-to-edge etch uniformity, rising edge particle counts or visible erosion and height loss during inspection. Most fabs set a preventive-maintenance interval and replace the ring before performance degrades.
The typical lead time is approximately 4-5 weeks. Because focus rings are consumed continuously, we recommend planning replenishment against your consumable usage rate and holding appropriate buffer stock to avoid chamber downtime.
Yes, supplied to the same form, fit and function as the OEM ring, it is intended to support consistent tool-to-tool matching. For best results, manage ring wear stage across chambers so that all tools in a matched group are operating with rings at comparable points in their service life.
Focus rings for TEL etch chambers are produced from plasma-resistant grades such as high-purity silicon or silicon carbide, selected to match the chamber chemistry and to deliver controlled erosion, low particle generation and stable electrical behaviour. Please confirm the exact grade required for your specific process when ordering.
The Focus Ring BSP 302-80-T7.5-297 (OEM P/N 2L10-252485-11, ESCT P/N ES7099-178) is a process-critical sacrificial consumable for TEL 300 mm plasma etch chambers. By framing the wafer and extending the plasma sheath beyond its edge, it preserves edge critical dimensions, etch uniformity and edge-die yield while protecting the underlying chuck and edge hardware. As a scheduled-replacement item subject to erosion, cracking and contamination, it benefits from disciplined preventive maintenance and reliable supply. Offered as a verified second-source new part with a 4-5 week lead time, it gives TEL etch fabs a cost-effective, dependable route to maintaining edge performance and chamber matching.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252485-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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