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360-T3.8 (314.4) Focus Ring for Plasma Uniformity and Edge Control, Tokyo Electron Platforms
The 2L10-251875-11 (FOCUS RING, 360-T3.8 (314.4)) is a precision-engineered plasma-facing focus ring used within Tokyo Electron semiconductor processing systems, designed to support wafer edge plasma control, process uniformity, and chamber stability in advanced plasma etch applications.
Positioned around the wafer on the electrostatic chuck (ESC), the focus ring helps shape electric field behavior and plasma density at the wafer perimeter, supporting controlled edge conditions while protecting surrounding chamber hardware from direct plasma exposure. Its 360 mm geometry, T3.8 thickness, and 314.4 profile specification are engineered for process-specific plasma tuning where tight control over edge behavior directly affects critical dimension performance, yield, and repeatability.
In aggressive plasma environments, focus ring geometry and wear condition can materially influence process outcomes. Erosion, dimensional drift, contamination, or incorrect profile selection may contribute to edge non-uniformity, particle generation, process instability, and reduced usable wafer area. The 2L10-251875-11 is designed to support reliable plasma-facing performance under sustained cleanroom production conditions.
The 2L10-251875-11 functions as a critical plasma-facing consumable supporting edge process control.
Core functions include:
The focus ring directly influences wafer edge process performance.
Key performance characteristics include:
Reliable focus ring performance is critical to maintaining repeatable process behavior.
The ring geometry and thickness are central to plasma tuning.
Performance attributes include:
Even small dimensional deviations can materially affect plasma behavior and uniformity.
The focus ring operates in aggressive plasma conditions requiring durable material performance.
Durability characteristics include:
The 2L10-251875-11 may operate alongside related chamber hardware including:
Together these components support plasma stability, chamber protection, and repeatable process performance.
The 2L10-251875-11 is directly tied to process quality and chamber stability.
Potential impacts of wear or degradation include:
Replacing a worn focus ring can restore plasma control and improve process repeatability.
Continuous plasma exposure can alter ring geometry over time.
Indicators include:
Material wear can contribute to contamination risk.
Symptoms may include:
Degraded focus rings may contribute to changes in edge process behavior.
Indicators include:
To support best performance:
The 2L10-251875-11 (FOCUS RING, 360-T3.8 (314.4)) is a Tokyo Electron OEM part.
Key considerations:
It refers to the ring’s geometry and thickness specification, including a 360 mm class design, 3.8 mm thickness, and 314.4 profile dimension, all of which influence plasma behavior and process tuning.
It shapes electric field and plasma density behavior at the wafer perimeter, supporting consistent edge process performance.
Thickness affects plasma sheath formation, ion behavior, and edge tuning. Even minor deviations may impact uniformity.
Typical indicators include:
Yes. Focus ring degradation can contribute to defectivity, variability, and reduced process control margins.
Yes. Focus rings are typically managed as plasma-facing consumables replaced based on wear thresholds or PM intervals.
Yes. ESCT supports dimensional, material, and compatibility verification aligned with OEM requirements.
Incorrect geometry can disrupt plasma distribution, alter chamber tuning, and increase non-uniform processing risk.
Depending on availability, associated components such as 2L10-251877-11, 2L10-252700-11, and related chamber hardware may also be supported.
This product is supplied as a 2nd New OEM-compatible assembly, verified to meet form, fit, and functional requirements aligned with the relevant part number. It is not an original OEM manufacturer part.
The 2L10-251875-11 Focus Ring (360-T3.8 (314.4)) is a mission-critical plasma-facing consumable supporting wafer edge control, process repeatability, and chamber stability in Tokyo Electron systems.
Its geometry, material condition, and interaction with surrounding chamber hardware can directly influence uniformity, uptime, and yield protection.
Sourcing through ESCT Fab Support provides verified quality, faster availability, and semiconductor-focused technical expertise to help maintain reliable, production-ready process performance.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-251875-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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