OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The Focus Ring T4.3 S700 is a circular, plasma-facing consumable that encircles the 300 mm wafer inside a Tokyo Electron (TEL) plasma etch process chamber. Sitting directly on the electrostatic chuck assembly at the outer edge of the wafer, it extends the active etch environment beyond the silicon perimeter so that the edge die experience the same plasma sheath conditions as the centre of the wafer. Its compact “T4.3” geometry and “S700” platform designation reflect a part engineered for a specific TEL etch chamber generation, where the radial profile of the ring is tuned to the chamber’s RF and gas distribution behaviour.
As a focus ring, this component performs a deceptively simple-sounding but electrically critical job: it shapes the plasma sheath at the wafer edge. The dielectric and conductive properties of the ring govern how ion trajectories bend as they cross the boundary from wafer to surrounding hardware. Get this transition right and the etch front stays vertical and uniform out to the last millimetre of usable silicon; get it wrong and the outermost rings of die tilt, taper or etch at the wrong rate, eroding yield on the most expensive real estate of the wafer.
Because it is positioned in the most aggressive part of the chamber, directly in the path of energetic ions and reactive radicals, the focus ring is a scheduled-replacement consumable. It erodes predictably over thousands of RF hours, and managing that erosion is a core part of running a stable, high-yield etch process. ESCT P/N ES7099-064 is supplied as a form, fit and function equivalent to the TEL original, giving fabs a reliable replacement path without OEM lead-time exposure.
Within a TEL 300 mm etch chamber, the focus ring is the principal edge-tuning element. It mediates between the wafer it surrounds and the grounded or biased hardware beyond it, controlling the local electrical and physical environment that determines edge etch behaviour. Its key functions include the following.
Focus rings of this class are manufactured from plasma-resistant materials selected to balance etch durability, electrical character and particle cleanliness. The chosen material set must survive a punishing flux of ions and radicals while contributing as little contamination as possible to the wafer it protects.
The ring material is chosen to erode slowly and cleanly under the chamber’s specific chemistries, whether fluorocarbon-based dielectric etch or other reactive plasmas. Slow, uniform erosion is the goal, a material that recedes evenly keeps the edge process stable for longer between changes.
Beyond raw durability, the ring must hold its dimensions, flatness and electrical character so that the sheath geometry it creates is repeatable. Tight tolerance control on inner diameter, thickness and concentricity is what keeps edge results matched across the chamber and across the fleet.
Because the focus ring governs the edge etch environment directly, its condition has an outsized effect on usable yield and on the stability of the etch process over time. A worn, cracked or mis-seated ring produces problems that propagate straight to the wafer.
The dominant wear mechanism is steady sputter and chemical erosion of the upper surface and inner edge. As the ring thins, the sheath geometry it creates shifts, pushing edge etch results out of specification. This is the normal end-of-life mode and is the basis for scheduled replacement at a defined RF-hour or wafer-count interval.
Repeated rapid heating and cooling, mechanical stress during handling, or an improperly seated ring can initiate cracks. A cracked ring is an immediate liability: it can shed large particles, disturb the local plasma and, in the worst case, fracture during a run and damage the chuck or wafer.
If the ring is not seated flat and concentric, or if etch by-products build up beneath or around it, the edge gap and electrical contact change. This can cause localised arcing, asymmetric etch signatures and accelerated, uneven erosion that cuts ring life short.
Focus-ring replacement is a routine preventive-maintenance task, but it must be done cleanly and precisely because seating and concentricity directly affect process results. The following sequence reflects good practice; always follow your site’s TEL maintenance procedures and safety requirements.
Focus rings are recurring consumables, so fabs benefit from a procurement strategy that keeps qualified stock on hand without over-committing to OEM pricing and lead times. ESCT supports that strategy with a dependable second-source supply of edge consumables.
It surrounds the 300 mm wafer in a TEL plasma etch chamber and shapes the plasma sheath at the wafer edge. By extending the active plasma environment beyond the silicon and steering ion trajectories, it keeps etch features at the wafer perimeter vertical and uniform, protecting edge die yield.
No. This is a new, second-source part that is OEM-compatible with TEL P/N 2L10-251509-11. It is not an original Tokyo Electron OEM component; it is supplied as a new equivalent verified to match the original in form, fit and function.
Replacement intervals depend on the chemistry, RF power and duty of the specific process, so they are best set from your own erosion and yield data. In practice fabs replace focus rings on a scheduled RF-hour or wafer-count basis once edge results begin to drift toward their control limits.
The clearest signs are drifting edge critical dimensions, increasing centre-to-edge non-uniformity, rising particle counts and visible thinning or surface roughening on inspection. Any cracking or chipping warrants immediate replacement regardless of accumulated hours.
The typical lead time is 4-5 weeks. Because focus rings are predictable, high-turn consumables, we recommend ordering against your planned maintenance schedule and holding qualified buffer stock to avoid unplanned tool downtime.
Yes. This ring is identified by TEL OEM P/N 2L10-251509-11 and ESCT P/N ES7099-064. Quoting either number lets us confirm the correct part for your TEL 300 mm etch chamber and match it to your tool configuration.
The Focus Ring T4.3 S700 (TEL OEM P/N 2L10-251509-11, ESCT P/N ES7099-064) is an edge-confinement consumable that shapes the plasma sheath around the 300 mm wafer in TEL etch chambers, holding edge etch uniformity and protecting perimeter die yield. As a sacrificial, scheduled-replacement part, it erodes predictably and demands clean handling, accurate seating and qualified replacement stock. ESCT supplies it as a new, OEM-compatible alternative on a 4-5 week lead time, giving fabs a cost-effective, dependable second source for keeping TEL etch tools running within specification.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-251509-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
We use cookies We use analytics cookies to see how visitors use this site, so we can improve it. They are set only if you accept. Read our Cookie Policy.
