RING,FOCUS 360-298.1-T12.1

PART DETAILS

2L10-251765-11
RING,FOCUS 360-298.1-T12.1

OEM P/N: 

2L10-251765-11

ESCT P/N: 

ES7099-097

PART TYPE:

2nd Source NEW

OEM: 

TEL
MORE INFO

2L10-251765-11 Focus ring 360-298.1-T12.1 for TEL systems

Precision focus ring for plasma confinement, edge process control, and chamber stability

The 2L10-251765-11 RING, FOCUS 360-298.1-T12.1 is a precision-engineered plasma-facing chamber component used in Tokyo Electron (TEL) semiconductor equipment to support plasma confinement, wafer edge conditioning, and process uniformity during advanced semiconductor manufacturing processes.

Installed around the wafer process zone, the focus ring helps shape and stabilize plasma behavior near the wafer perimeter, supporting controlled edge effects, improved process repeatability, and stable chamber operating conditions. In semiconductor applications where plasma distribution directly influences etch profiles, deposition uniformity, critical dimension control, and yield performance, maintain a properly functioning focus ring.

Because focus rings operate under continuous plasma exposure, ion bombardment, thermal cycling, and reactive process chemistries, erosion, dimensional wear, surface degradation, or contamination buildup can contribute to plasma instability, edge non-uniformity, particle generation, and increased maintenance frequency. The 2L10-251765-11 is engineered to support reliable chamber performance under demanding fab production environments.

The ESCT equivalent part number for this component is ES7099-097, supplied as a 2nd Source NEW OEM-compatible replacement designed to meet form, fit, and functional requirements aligned with the original TEL component.

Functional role within TEL systems

The 2L10-251765-11 functions as a critical plasma-conditioning and chamber-stability component.

Core functions include:

  • Supporting plasma confinement around the wafer edge
  • Helping maintain stable edge process conditions
  • Contributing to uniform plasma distribution
  • Supporting repeatable wafer processing performance
  • Helping reduce edge-related process variability
  • Supporting uptime through reliable chamber consumable performance

In many TEL process platforms, this focus ring operates alongside ground rings, ESC assemblies, chamber shields, silicon consumables, and other plasma-facing hardware that collectively support process stability and chamber reliability.

Design and performance characteristics

Plasma confinement and edge uniformity

The focus ring helps maintain controlled plasma behavior.

Key performance characteristics include:

  • Stable plasma confinement support
  • Controlled edge plasma interaction
  • Repeatable process boundary conditions
  • Reduced risk of edge non-uniformity
  • Contribution to wafer-to-wafer consistency

Stable plasma conditions are critical to maintaining process repeatability and yield.

Plasma-facing material performance

Material integrity directly affects chamber stability.

Performance attributes may include:

  • Semiconductor-grade construction
  • Stable plasma-facing characteristics
  • Resistance to plasma-induced erosion
  • Reduced susceptibility to contamination-related degradation
  • Reliable performance under sustained process exposure

Surface condition directly influences contamination control and process consistency.

Precision geometry and chamber integration

The 360-298.1-T12.1 profile supports consistent chamber operation.

Durability characteristics may include:

  • Precision dimensional tolerances
  • Stable chamber integration performance
  • Reliable fit within TEL process architectures
  • Reduced susceptibility to dimensional drift
  • Support for repeatable maintenance outcomes

Mechanical consistency helps preserve chamber qualification and process repeatability.

Integration with related chamber hardware

The 2L10-251765-11 may operate alongside related chamber components including:

  • Ground ring assemblies
  • ESC process hardware
  • Chamber shields and liners
  • Silicon chamber consumables
  • RF distribution hardware
  • Plasma-facing process components

Together these components support broader chamber stability and process control.

Impact on tool performance, yield, and uptime

The 2L10-251765-11 can directly influence chamber performance and equipment availability.

Potential impacts of wear or degradation include:

  • Edge process non-uniformity
  • Plasma instability
  • Increased particle generation risk
  • Chamber conditioning drift
  • Higher defect exposure
  • Increased preventive maintenance frequency
  • Reduced equipment availability

Replacing a worn focus ring can help restore chamber stability and improve process repeatability.

Common failure modes and diagnostic indicators

Plasma-facing surface erosion

Continuous plasma exposure may gradually affect ring performance.

Indicators include:

  • Surface erosion patterns
  • Material loss over time
  • Increased edge process variability
  • Chamber performance drift
  • Reduced plasma consistency

Dimensional wear or geometry changes

Long-term process exposure may affect ring geometry.

Symptoms may include:

  • Dimensional drift
  • Chamber qualification concerns
  • Process repeatability issues
  • Edge profile inconsistencies
  • Progressive chamber instability

Particle generation and contamination risks

Surface degradation may influence contamination control.

Indicators include:

  • Increased particle counts
  • Defect-related excursions
  • Chamber cleanliness concerns
  • More frequent maintenance intervals
  • Reduced process stability

Wear in the 2L10-251765-11 may also increase stress on adjacent chamber consumables and plasma-facing hardware.

Installation and maintenance best practices

To support best performance:

  • Follow OEM-approved handling procedures
  • Inspect plasma-facing surfaces before installation
  • Verify correct seating and orientation
  • Evaluate surrounding chamber consumables during service events
  • Inspect for erosion and contamination during PM intervals
  • Perform chamber qualification after replacement
  • Confirm stable process conditions before production return

OEM part number and compatibility

The 2L10-251765-11 Focus Ring 360-298.1-T12.1 is an OEM-referenced TEL component.

Key considerations:

  • Must match chamber architecture requirements
  • Material and dimensional compatibility are critical
  • Verify process compatibility before installation
  • Confirm integration with surrounding chamber hardware
  • Evaluate associated wear components during maintenance

OEM P/N: 2L10-251765-11 ESCT P/N: ES7099-097 Part Type: 2nd Source NEW OEM: TEL

Why source from ESCT Fab Support

ESCT advantages

  • OEM-aligned form, fit, and functional verification
  • Quality-controlled manufacturing and inspection processes
  • Verified subsystem compatibility support
  • Faster availability versus OEM lead times
  • Reduced Mean Time To Repair (MTTR)
  • Expertise in semiconductor plasma-facing consumables
  • Cost-effective second-source procurement strategies

Maintaining inventory of the ES7099-097 / 2L10-251765-11 can reduce downtime exposure and improve maintenance readiness.

Frequently asked questions

1. What does the 2L10-251765-11 focus ring do?

It helps control plasma behavior around the wafer edge, supporting process uniformity, plasma stability, and repeatable chamber performance.

2. Why is a focus ring important in semiconductor processing?

Focus rings influence plasma confinement and edge conditions, which directly affect process repeatability, critical dimensions, and yield.

3. What does “360-298.1-T12.1” indicate?

It identifies a specific focus ring geometry and thickness configuration designed for compatible TEL chamber applications.

4. What are signs the focus ring may need replacement?

Common indicators include:

  • Surface erosion
  • Material wear
  • Plasma instability
  • Edge process variability
  • Increased particle counts
  • Chamber qualification concerns

5. Can focus ring wear affect process uniformity?

Yes. Changes in ring geometry or surface condition can alter plasma behavior and impact wafer processing consistency.

6. Can a worn focus ring contribute to contamination?

Yes. Surface degradation may increase particle generation and contamination risks.

7. Can this component affect yield?

Yes. Plasma instability and contamination-related issues can directly impact wafer quality and production yield.

8. How are focus ring issues typically diagnosed?

Issues are commonly identified through PM inspections, chamber qualification results, particle trend analysis, plasma diagnostics, or visual wear assessment.

9. Does replacement require chamber qualification afterward?

Yes. Chamber qualification and process verification should be performed after replacement.

10. What happens if the wrong focus ring is installed?

Incorrect dimensions or material characteristics may affect plasma behavior, chamber performance, and process outcomes.

11. Is this an original OEM TEL part?

No. This product is supplied as ESCT P/N ES7099-097, a 2nd Source NEW OEM-compatible replacement aligned with the original TEL component requirements.

12. Is compatibility verification important before ordering?

Yes. Chamber configuration, dimensions, and process compatibility should always be confirmed.

13. Can ESCT verify compatibility before shipment?

Yes. ESCT supports compatibility verification based on equipment and application requirements.

14. Are related TEL chamber consumables available as well?

Depending on availability, associated ground rings, focus rings, shields, silicon consumables, and other plasma-facing chamber components may also be supported.

15. Why is preventive replacement of focus rings recommended?

Replacing focus rings before severe erosion occurs helps maintain chamber stability, reduce particle-related defects, and minimize unplanned production interruptions.

Summary

The 2L10-251765-11 Focus Ring 360-298.1-T12.1 is a critical plasma-facing chamber consumable supporting plasma confinement, edge uniformity, and repeatable semiconductor process performance in TEL systems.

Its condition can directly influence process stability, contamination control, equipment uptime, and wafer yield.

Sourcing through ESCT Fab Support as ES7099-097 provides a verified 2nd Source NEW OEM-compatible replacement backed by semiconductor-focused expertise, quality verification, and responsive supply support.

Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-251765-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.

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