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The TEL Focus Ring 380-T6.5 (OEM part number 3D10-200330-12) is a consumable plasma-confinement ring that sits concentrically around the 300 mm wafer at the outer edge of the electrostatic chuck in Tokyo Electron plasma etch process chambers. The “380” designation reflects its nominal outer geometry sized to encircle a 300 mm substrate plus the surrounding chuck shelf, while the “T6.5” suffix denotes the ring thickness or step variant that sets the vertical position of its top surface relative to the wafer plane. In service it is the sacrificial component that extends the plasma sheath beyond the wafer perimeter, so that the etch behaviour seen by the outermost few millimetres of die matches that seen at the centre.
Because the focus ring is directly exposed to the same energetic ions and reactive radicals that etch the wafer, it is one of the highest-turnover consumables in a TEL etch toolset. Its profile, height and electrical coupling all change measurably as it erodes, and those changes translate directly into edge-of-wafer critical-dimension drift, tilt and yield loss. For this reason fabs treat the focus ring as a scheduled-replacement item managed against process-of-record limits rather than as a run-to-failure part.
This ESCT listing (ES7099-084) supplies the 380-T6.5 ring as a second-source new component, manufactured to the form, fit and function of the original 3D10-200330-12 so that it can drop into the chamber kit without process requalification beyond a fab’s normal incoming-part checks.
The focus ring performs several interlocking jobs at the wafer edge, all of which aim to make the plasma “see” a continuous, uniform surface rather than an abrupt boundary where the silicon ends. Its principal functions are:
As a plasma-facing consumable, the 380-T6.5 ring is specified around two performance pillars: how its material withstands the etch chemistry, and how its geometry holds the intended electrical and sheath conditions over a usable lifetime. Both are central to keeping edge results inside specification between scheduled changes.
Focus rings of this class are produced from high-purity etch-grade materials such as silicon, silicon carbide or quartz, selected so that erosion products are chemically compatible with the process and do not introduce metallic or particulate contamination. The chosen grade balances sputter and chemical-etch resistance against the fluorine-, chlorine- or bromine-bearing chemistries used in dielectric and conductor etch, giving a controlled, predictable erosion rate.
The T6.5 thickness variant exists precisely because the ring’s top-surface height relative to the wafer is a first-order process knob. Flatness, inner-diameter concentricity and surface finish must be held tightly so that the sheath sits where the process recipe expects it and the ring seats cleanly on the chuck shelf.
Because it governs the electrical and physical environment at the wafer perimeter, the condition of the focus ring shows up directly in edge-of-wafer metrology and in overall tool availability. A worn or out-of-spec ring drives the following consequences:
The dominant failure mode is gradual thinning of the ring top surface under continuous ion bombardment. As the surface recedes below its design height, the sheath drops at the wafer edge, ion trajectories tilt inward and edge critical dimensions and profiles move out of specification. This is a wear-out limit rather than a fault, which is why the part is replaced on an erosion-budget schedule.
Repeated thermal cycling, mechanical mishandling during transfer or clamping, and localised hot spots can initiate cracks or chips in the brittle ring material. A cracked ring is a particle generator and can shift the local electrical boundary unpredictably; in severe cases fragments can damage the chuck or wafer, so any visible fracture warrants immediate removal.
Polymer and etch by-products accumulate on and around the ring during processing. As these films thicken they can flake, raising defectivity, and they can also alter the effective surface and seating contact. Build-up that outpaces the clean cycle, or a ring that no longer seats flat because of erosion or residue, signals that replacement and a chamber clean are due.
Focus-ring replacement is a routine but contamination-sensitive preventive-maintenance task. It should be carried out by trained technicians following the TEL chamber procedure and the fab’s PM work instruction, with the tool safely shut down and isolated. A typical sequence is:
Focus rings are high-frequency consumables, so sourcing strategy has a direct effect on cost per wafer and on tool availability. ESCT Fab Support helps fabs manage that spend without compromising edge performance:
The “380” refers to the ring’s nominal sizing for the 300 mm wafer-and-chuck geometry it surrounds, and the “T6.5” identifies the specific thickness/step-height variant. Height is a critical process parameter, so the variant must match the configuration your chamber recipe was qualified against.
No. This is a second-source new component supplied by ESCT Fab Support. It is manufactured and verified to be compatible with TEL OEM part number 3D10-200330-12 in form, fit and function, but it is not an original Tokyo Electron OEM part and carries no OEM branding.
Replacement interval depends on the etch chemistry, RF power and process hours, so it is set by each fab against erosion limits and edge-metrology criteria rather than a fixed calendar period. Many fabs track ring life by RF hours or wafer count and replace before edge critical dimensions approach their control limits.
As the ring erodes below its design height the sheath drops at the wafer edge, causing edge critical-dimension drift, profile tilt and falling edge die yield. Continued use also raises particle and defectivity risk and can require additional wet cleans or requalification, so timely replacement protects both yield and uptime.
Because it is built to the original form, fit and function, the ring is intended to drop into the existing chamber kit. Fabs should still follow their standard incoming-part inspection and the normal post-PM seasoning and qualification run that any focus-ring change would trigger, confirming edge uniformity before returning the tool to production.
The current lead time is 4-5 weeks. As a recurring consumable, the focus ring suits a planned buffer-stock approach so that scheduled preventive maintenance is never held up waiting on delivery. ESCT can advise on order quantities to align with your PM cadence.
The TEL Focus Ring 380-T6.5 (OEM P/N 3D10-200330-12, ESCT P/N ES7099-084) is a sacrificial plasma-confinement consumable that controls sheath position, ion-incidence angle and edge etch uniformity at the perimeter of a 300 mm wafer in Tokyo Electron etch chambers. Its material purity and tightly held height and concentricity protect edge die yield, while its predictable erosion makes it a scheduled-replacement item managed against process limits. Supplied as a second-source new part verified to the original form, fit and function, with a 4-5 week lead time, ES7099-084 offers fabs a cost-effective, reliable source for one of their highest-turnover etch consumables.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-200330-12. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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