OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The Upper Focus Ring designated Type L-205 (TEL OEM part number 1810-350062-M1) is an annular consumable component that sits within the upper assembly of a Tokyo Electron 300 mm plasma etch process chamber. As its name indicates, it is an “upper” ring, mounted in the region around the upper electrode and gas-distribution showerhead rather than around the wafer carrier itself, and forms part of the dielectric and ground hardware that shapes the plasma above the substrate. Focus rings of this kind are sacrificial parts: they are deliberately positioned in the most aggressive part of the discharge so that they, rather than more expensive structural hardware, absorb the cumulative effects of ion bombardment and reactive-gas chemistry.
In a TEL etch chamber the plasma must be confined to a well-defined volume directly over the 300 mm wafer, and the electrical and physical boundary conditions at the edge of that volume determine how uniform the process is from wafer centre to wafer edge. The upper focus ring contributes to this boundary. It tailors the radial profile of the electric field and the gas flow near the upper electrode, helping to keep the discharge symmetric and stable. When the ring is fresh and dimensionally correct, the chamber etches predictably; as it erodes, the field profile drifts and process results follow.
Because it is exposed to plasma every wafer of every lot, the Type L-205 upper focus ring is a planned replacement item. Fabs schedule its change at defined RF-hour or wafer-count intervals as part of preventive maintenance, and they hold spares on the shelf to avoid an unscheduled chamber-down event. The part offered here, ESCT P/N ES7099-165, is a 2nd Source NEW component manufactured to match the form, fit and function of the original TEL ring.
Within the chamber the upper focus ring performs several overlapping electrical, gas-dynamic and mechanical duties. It is not simply a spacer; its geometry and material properties are part of the process recipe in the sense that any change to them shifts the result at the wafer. Its principal functions include:
Upper focus rings for TEL etch chambers are produced from plasma-grade materials chosen to survive an aggressive fluorocarbon, oxygen or halogen environment while contributing as little particle and metallic contamination as possible. Depending on the chamber and recipe, rings in this family are commonly high-purity quartz, alumina or a comparable engineered ceramic. The ES7099-165 ring is manufactured to the material specification, surface finish and dimensional tolerances required for stable operation in the L-205 position.
The ring must resist sputter erosion from energetic ions and chemical etching from the reactive species in the discharge. Material purity and density govern how slowly the surface recedes and how few particles are released as it wears, which is why plasma-grade feedstock and tight process control during manufacture matter so much.
Beyond chemistry, the ring must hold its shape and seat correctly under repeated thermal cycling. Warpage, dimensional drift or a poor fit at the mounting interface changes the electrical boundary and the gas path, so geometry is controlled as tightly as material composition.
Because the upper focus ring sits at the boundary of the discharge, its condition propagates directly into the metrics the process engineer watches. A correct, fresh ring keeps the chamber inside its qualification window; a worn or out-of-spec ring shows up as edge-of-wafer process drift and rising defect counts.
The dominant wear mechanism is gradual erosion. Continuous ion bombardment and chemical attack thin the ring and round its features over time, slowly altering the field and flow geometry until edge uniformity drifts outside the qualification window and the ring must be replaced.
Repeated thermal cycling, mechanical handling and any localised hot spot can crack a ceramic or quartz ring. A crack is an immediate failure: it can change the electrical path, become a particle source, or in severe cases shed fragments into the chamber, so a cracked ring is scrapped rather than reused.
As the surface erodes it roughens and can accumulate redeposited polymer and etch by-product. Once these films begin to flake, the ring becomes a defect source on the wafer. Rising particle counts at the wafer edge are a classic late-life indicator that the upper focus ring needs changing.
Replacement of the upper focus ring is a routine preventive-maintenance task, but it is performed in a contamination-sensitive environment and should follow the relevant TEL maintenance procedure for the specific chamber. The following sequence summarises good practice:
Focus rings are high-turnover consumables, so the way a fab sources them has a direct effect on cost of ownership and chamber availability. ESCT Fab Support supplies the ES7099-165 upper focus ring as a qualified second-source alternative to the OEM part, giving maintenance and procurement teams a dependable option for routine and emergency stock. Advantages of sourcing through ESCT include:
L-205 is the TEL type designation for this specific upper focus ring geometry. It identifies the particular ring profile and mounting configuration used in the upper assembly of the relevant chamber, distinguishing it from other focus and edge rings in the same tool family.
No. This is a 2nd Source NEW part. It is a new, OEM-compatible upper focus ring manufactured to match the form, fit and function of TEL OEM P/N 1810-350062-M1, but it is not an original Tokyo Electron OEM component and is supplied as an independent alternative.
A wafer-edge focus ring surrounds the wafer on the lower electrode and shapes the plasma right at the wafer edge. An upper focus ring sits in the upper electrode region and conditions the plasma boundary from above. Both confine and shape the discharge, but they act at different positions in the chamber.
Replacement intervals depend on the recipe, power levels and chemistry, so they are set by each fab from its own RF-hour or wafer-count data and process-control trends. The ring is treated as a scheduled consumable and changed during planned preventive maintenance before erosion pushes results out of specification.
Typical indicators are drift in edge-of-wafer etch rate or critical dimension, rising particle and defect counts, reduced plasma stability, and visible erosion, thinning or cracking on inspection during a maintenance opening.
The typical lead time is 4-5 weeks. Because focus rings are consumables, we recommend holding safety stock and ordering ahead of planned preventive-maintenance cycles so a chamber is never held waiting for a ring.
The Upper Focus Ring Type L-205 (TEL OEM P/N 1810-350062-M1), supplied by ESCT Fab Support as P/N ES7099-165, is a plasma-grade consumable that shapes and confines the discharge in the upper region of a Tokyo Electron 300 mm etch chamber. By maintaining a correct electrical and gas-dynamic boundary, it underpins centre-to-edge uniformity, particle performance and chamber-to-chamber matching. Like all focus rings it is sacrificial and must be changed on a planned schedule, which makes a reliable, cost-effective second source useful to any fab running these tools. Offered new, with form, fit and function verified against the OEM part and a 4-5 week lead time, ES7099-165 is a sound choice for both routine replenishment and safety stock.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 1810-350062-M1. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
We use cookies We use analytics cookies to see how visitors use this site, so we can improve it. They are set only if you accept. Read our Cookie Policy.
