CEL BODY ASSY.SCCM-OX(SE)

PART DETAILS

3D87-003411-14
CEL BODY ASSY.SCCM-OX(SE)

OEM P/N: 

3D87-003411-14

ESCT P/N: 

ES7099-026

PART TYPE:

2nd Source NEW

OEM: 

TEL
MORE INFO

CEL body Assy. SCCM-OX (SE) for TEL systems

Precision chamber cell body assembly for plasma stability, process consistency, and chamber hardware protection

The 3D87-003411-14 CEL BODY ASSY. SCCM-OX (SE) is a critical chamber assembly used in Tokyo Electron (TEL) semiconductor processing equipment to support plasma confinement, chamber conditioning, and stable process performance in advanced semiconductor manufacturing applications.

Installed within the process chamber architecture, the cell body assembly serves as a structural and plasma-facing component that helps maintain chamber geometry, regulate plasma interactions, and protect surrounding chamber hardware from direct process exposure. By preserving critical chamber dimensions and supporting stable plasma conditions, the assembly contributes directly to process repeatability, contamination control, and wafer yield.

Because chamber cell assemblies operate under continuous exposure to plasma, reactive process chemistries, thermal cycling, RF energy, and ion bombardment, they are subject to gradual wear and erosion. Maintaining the condition of the cell body assembly is what preserves chamber qualification, process stability, and equipment uptime.

The ESCT equivalent part number for this component is ES7099-026, supplied as a 2nd Source NEW OEM-compatible replacement designed to meet form, fit, and functional requirements aligned with the original TEL component.

Functional role within TEL systems

The 3D87-003411-14 functions as a critical chamber conditioning and plasma-management assembly.

Core functions include:

  • Supporting plasma confinement and control
  • Maintaining chamber geometry and alignment
  • Protecting critical chamber hardware
  • Contributing to process repeatability
  • Supporting contamination control strategies
  • Helping maintain stable chamber performance

In TEL plasma-processing platforms, cell body assemblies commonly operate alongside:

  • Focus rings
  • Electrodes
  • Ground rings
  • Chamber liners
  • Plasma shields
  • ESC assemblies
  • RF power delivery systems

Design and performance characteristics

Chamber stability and process control

The cell body assembly helps maintain controlled operating conditions within the chamber.

Key performance characteristics include:

  • Stable chamber geometry
  • Improved process consistency
  • Reduced chamber condition drift
  • Tighter plasma control
  • Improved repeatability between production runs

Stable chamber architecture holds process performance.

Plasma-facing protection

The assembly helps shield critical hardware from direct plasma exposure.

Performance attributes may include:

  • Reduced wear on surrounding chamber components
  • Improved chamber longevity
  • More predictable maintenance
  • Reduced hardware replacement frequency
  • Better process stability over time

Protecting primary chamber components helps reduce overall operating costs.

Precision manufacturing and fitment

Designed for demanding semiconductor manufacturing environments.

Durability characteristics may include:

  • High dimensional accuracy
  • Stable operation under thermal cycling
  • Resistance to plasma erosion
  • Reliable chamber integration
  • Long-term operational stability

Maintaining dimensional integrity is critical for preserving chamber qualification.

Integration with related chamber hardware

The 3D87-003411-14 may operate alongside related chamber components including:

  • Focus rings
  • Chamber liners
  • Ground rings
  • Plasma shields
  • Electrodes
  • ESC assemblies
  • Process kit consumables

Together these components support chamber optimization and process control.

Impact on tool performance, yield, and uptime

The 3D87-003411-14 can directly influence chamber performance and manufacturing productivity.

Potential impacts of wear or degradation include:

  • Plasma instability
  • Process non-uniformity
  • Chamber conditioning drift
  • Increased particle generation
  • Reduced process repeatability
  • Chamber qualification failures
  • Increased downtime risk

Replacing a worn cell body assembly can help restore chamber stability and improve process consistency.

Common failure modes and diagnostic indicators

Plasma erosion

Continuous process exposure gradually affects component surfaces.

Indicators include:

  • Surface material loss
  • Erosion patterns
  • Chamber performance drift
  • Reduced process consistency
  • Visible wear progression

Dimensional wear

Long-term operation may alter component geometry.

Symptoms may include:

  • Chamber alignment concerns
  • Plasma confinement issues
  • Qualification failures
  • Increased tuning requirements
  • Reduced process repeatability

Particle generation

Surface degradation may contribute to contamination concerns.

Indicators include:

  • Increased particle counts
  • Yield-impacting defects
  • Chamber cleanliness issues
  • Frequent maintenance requirements
  • Process instability

Failure to replace worn chamber components may accelerate degradation of adjacent consumables and hardware.

Installation and maintenance best practices

To support best performance:

  • Follow OEM-approved installation procedures
  • Inspect all plasma-facing surfaces before installation
  • Verify alignment and seating during assembly
  • Evaluate adjacent consumables during maintenance
  • Monitor erosion during PM intervals
  • Perform chamber qualification after replacement
  • Confirm stable process performance before returning the tool to production

OEM part number and compatibility

The 3D87-003411-14 CEL Body Assy. SCCM-OX (SE) is an OEM-referenced TEL component.

Key considerations:

  • Must match chamber architecture requirements
  • Material and dimensional compatibility are critical
  • Verify process compatibility before installation
  • Confirm integration with surrounding chamber hardware
  • Evaluate associated wear components during maintenance

Why source from ESCT Fab Support

ESCT advantages

  • OEM-aligned form, fit, and functional verification
  • Quality-controlled manufacturing and inspection processes
  • Verified subsystem compatibility support
  • Faster availability compared to OEM lead times
  • Reduced Mean Time To Repair (MTTR)
  • Expertise in semiconductor chamber consumables and assemblies
  • Cost-effective second-source procurement strategies

Maintaining inventory of the ES7099-026 / 3D87-003411-14 helps reduce downtime exposure and improve maintenance readiness.

Frequently asked questions

1. What does the 3D87-003411-14 cell body assembly do?

It helps maintain chamber geometry, support plasma confinement, and protect surrounding chamber hardware during semiconductor processing operations.

2. Why is a cell body assembly important in plasma-processing equipment?

The assembly contributes to chamber stability, process repeatability, contamination control, and overall equipment performance.

3. What does SCCM-OX (SE) refer to?

It identifies a specific TEL chamber assembly configuration designed for compatible process applications and equipment platforms.

4. What are signs the cell body assembly may need replacement?

Common indicators include:

  • Surface erosion
  • Material wear
  • Chamber qualification failures
  • Plasma instability
  • Increased particle counts
  • Process drift

5. Can cell body wear affect process uniformity?

Yes. Changes in component geometry can alter plasma behavior and chamber conditions, affecting process consistency.

6. Can a worn assembly increase contamination risk?

Yes. Surface degradation and erosion can contribute to particle generation and wafer defects.

7. Can this component affect wafer yield?

Yes. Chamber instability, contamination, and process variation can directly impact yield and manufacturing performance.

8. How are cell body assembly issues typically diagnosed?

Issues are commonly identified through preventive maintenance inspections, chamber qualification testing, particle monitoring, and visual wear analysis.

9. Does replacement require chamber qualification afterward?

Yes. Chamber qualification and process verification should always be completed after replacement.

10. What happens if the wrong assembly is installed?

Incorrect dimensions or material specifications may affect chamber compatibility, plasma performance, and process outcomes.

11. Is this an original OEM TEL part?

No. This product is supplied as ESCT P/N ES7099-026, a 2nd Source NEW OEM-compatible replacement aligned with the original TEL component requirements.

12. Is compatibility verification important before ordering?

Yes. Chamber configuration, dimensions, and process requirements should always be confirmed.

13. Can ESCT verify compatibility before shipment?

Yes. ESCT supports compatibility verification based on equipment specifications and application requirements.

14. Are related chamber consumables available?

Depending on availability, associated focus rings, electrodes, liners, shields, ground rings, and other plasma-facing components may also be supported.

15. Why is preventive replacement recommended for chamber cell assemblies?

Preventive replacement helps maintain chamber stability, reduce contamination risks, preserve process consistency, and minimize unexpected production interruptions.

Summary

The 3D87-003411-14 CEL Body Assy. SCCM-OX (SE) is a critical chamber assembly that supports plasma confinement, chamber protection, and repeatable semiconductor manufacturing performance in TEL systems.

Its condition can directly influence process uniformity, contamination control, equipment uptime, and wafer yield.

Sourcing through ESCT Fab Support as ES7099-026 provides a verified 2nd Source NEW OEM-compatible replacement backed by semiconductor expertise, quality verification, and responsive supply support.

Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D87-003411-14. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.

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