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The Shin Protection Ring (polished finish), Tokyo Electron OEM part number 3D10-350067-11, is a chamber consumable ring used in TEL 300 mm plasma etch process chambers. The term “shin” refers to the lower electrode skirt region, the vertical and shouldered surfaces that surround the cathode assembly below the wafer plane. This ring is fitted around that region to shield the underlying electrode body, fasteners and dielectric surfaces from direct plasma exposure, ion bombardment and the corrosive process chemistries that circulate inside the chamber during etch.
Like the focus ring, edge ring and other consumables that ring the wafer pedestal, the shin protection ring is a sacrificial protective component. It is positioned in the plasma-facing zone but outside the active wafer area, so it absorbs erosion that would otherwise attack permanent, high-value hardware. The “polishing” designation in the part name indicates a controlled, polished surface finish on the plasma-facing faces, which reduces particle adhesion, promotes predictable erosion and helps maintain a stable, repeatable surface condition across the consumable’s service life.
Because it sits at the boundary between the energised electrode and the chamber interior, the shin protection ring contributes to plasma confinement geometry, RF return-path integrity and particle performance near the wafer edge. A worn, cracked or contaminated ring can quietly degrade edge etch uniformity and defectivity long before it triggers an obvious fault, which is why it is treated as a scheduled-replacement item in most TEL etch preventive maintenance programmes.
The shin protection ring performs a combination of mechanical shielding, electrical and plasma-shaping duties around the lower electrode. Its principal functions inside a TEL 300 mm etch chamber include the following:
Consumable protection rings in TEL etch chambers are manufactured from process-grade materials chosen for plasma resistance, chemical inertness and controlled erosion behaviour, typically high-purity ceramics such as alumina or quartz, or specialised process-grade compounds depending on the chamber and recipe. The material must withstand fluorine- and chlorine-based chemistries, energetic ion flux and elevated surface temperatures without shedding particles or contaminating the wafer. Purity has to be high, because trace metallic or mobile-ion contamination liberated from a protective ring can degrade device performance and yield.
The polished finish is a defining feature of this ring. A controlled, polished plasma-facing surface reduces the number of nucleation sites where deposits and particles can adhere, and it promotes uniform, predictable surface erosion rather than localised roughening. This matters for defectivity: a smooth surface is less likely to flake or release particulate during plasma cycling and chamber cleans. Consistent surface condition across the ring also supports recipe-to-recipe repeatability and stable chamber matching across a fleet of tools.
Although it operates outside the active wafer area, the condition of the shin protection ring has a direct line to process outcomes. As it erodes or accumulates deposits, the local plasma environment and electrical boundary at the lower-electrode periphery drift, with consequences that show up at the wafer edge and in chamber defectivity metrics:
The dominant wear mechanism is gradual erosion of the plasma-facing surfaces by ion bombardment and chemical attack. Over time the polished faces roughen and material is removed, changing local geometry and surface condition. This is expected, sacrificial wear, the ring is designed to take it, but once erosion progresses past the qualified limit the ring no longer protects effectively and must be replaced.
Etch by-products and polymer films accumulate on and around the ring during processing. As these deposits thicken they can crack, flake and shed particles onto the wafer, especially during thermal cycling or plasma strikes. A roughened or contaminated surface accelerates the problem, which is why the polished finish and a disciplined clean-and-replace cadence are central to particle control.
Ceramic and quartz rings are brittle and vulnerable to cracking or chipping from thermal stress, repeated thermal cycling, or mishandling during installation. Edge chips and hairline cracks become particle sources and can compromise the protective and electrical function of the ring. Careful handling, correct seating and inspection at every preventive maintenance interval catch this damage early.
Replacement should be carried out by qualified maintenance technicians during a scheduled preventive maintenance window, following the relevant TEL service documentation for the specific chamber. The following sequence outlines good practice:
Consumable protection rings are predictable, recurring spend, which makes them ideal candidates for a managed sparing strategy. ESCT Fab Support supplies TEL-compatible chamber consumables verified to form, fit and function, helping fabs keep critical etch tools running without overcommitting to single-source OEM lead times. Working with ESCT for part ES7099-105 offers several advantages:
It is a sacrificial protective ring fitted around the lower-electrode skirt (“shin”) region of a TEL 300 mm plasma etch chamber. It shields the electrode body, fasteners and dielectric surfaces from plasma erosion and reactive chemistries, while contributing to plasma confinement geometry and particle control near the wafer edge.
No. ESCT P/N ES7099-105 is supplied as a new, OEM-compatible second-source part. It is verified to match the original TEL component (OEM P/N 3D10-350067-11) in form, fit and function, but it is not an original OEM-branded part and is not sold as one.
The polished finish on the plasma-facing surfaces reduces particle adhesion, promotes uniform erosion and limits flaking during plasma cycling and chamber cleans. This supports lower defectivity and more repeatable, stable chamber performance over the ring’s service life.
As a consumable, it is replaced based on accumulated RF hours, wafer counts or measured erosion thresholds defined in your preventive maintenance plan rather than on a fixed calendar. It should be inspected at every PM interval and replaced once erosion, deposits, cracking or chipping reach the qualified limit.
An over-eroded or contaminated ring can drive edge etch-rate drift, rising particle counts and reduced edge-die yield, and it can expose the underlying electrode hardware to accelerated wear. This typically leads to longer chamber recovery, more frequent wet cleans and loss of chamber matching.
The standard lead time is 4–5 weeks. We recommend aligning orders with planned preventive maintenance and maintaining a small buffer stock so that consumable replacement never gates tool availability.
The Shin Protection Ring with polished finish (TEL OEM P/N 3D10-350067-11, ESCT P/N ES7099-105) is a sacrificial consumable that protects the lower-electrode shin region of TEL 300 mm plasma etch chambers. By absorbing plasma erosion, maintaining a clean polished surface and supporting stable plasma confinement and RF return conditions, it safeguards high-value electrode hardware while protecting edge uniformity, defectivity and yield. Supplied as a new, OEM-compatible second-source part on a 4–5 week lead time, it is a sound choice for fabs seeking supply-chain resilience without compromising on form, fit and function.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-350067-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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