OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The Focus Ring 360-320-5 (TEL OEM P/N 2L10-251708-11) is a circumferential chamber consumable that sits immediately around the 300 mm wafer in a Tokyo Electron plasma etch process chamber. It is one of the most safety-critical and process-critical sacrificial parts in the tool, because it occupies the narrow transition zone between the wafer edge and the grounded chamber hardware. The dimensional designation in its raw name (a nominal 360 mm outer scale, a 320 mm inner aperture and a thin radial section) describes a part engineered to encircle the wafer with a tightly controlled gap so that the plasma sheath continues smoothly across the wafer edge rather than terminating abruptly at the substrate boundary.
In a TEL etch platform the focus ring rests on the electrostatic chuck assembly, concentric with the wafer, and is exposed to the same energetic plasma and directional ion bombardment as the substrate itself. Its job is to extend the electrical and physical profile of the wafer outward by a few millimetres, so that the edge dies see the same sheath shape, ion incidence angle and etch chemistry as the centre of the wafer. Because it is consumed steadily by ion sputtering during normal operation, it is classed as a planned-replacement consumable rather than a fixed structural component.
Even though it carries no moving parts and no active electronics, the focus ring has a disproportionate influence on edge yield. As device geometries shrink and the usable edge exclusion zone narrows, the condition of this ring directly determines how many of the outermost dies on every wafer pass inspection. A worn, cracked or mis-seated ring is one of the most common root causes of edge-band etch drift and particle excursions in high-volume etch fabs.
The focus ring is the principal sheath-shaping element at the wafer perimeter. By presenting a controlled dielectric or semiconducting surface at the same height as the wafer, it manipulates the local electric field so that ions arrive perpendicular to the wafer surface right out to the edge. Its core functions in a TEL 300 mm chamber include the following.
Focus rings for TEL etch chambers are manufactured from high-purity plasma-grade materials selected for predictable sputter behaviour, low particle generation and chemical compatibility with aggressive fluorine- and chlorine-based etch chemistries. The choice of material and the precision of the machined geometry together determine both the lifetime of the ring and the stability of the edge process it supports.
Edge rings of this type are typically produced from high-purity silicon, silicon carbide or quartz-class ceramics, each chosen so that erosion products are compatible with the process and do not contaminate the wafer. High material purity minimises metallic contamination, while a uniform, defect-free microstructure lets the ring erode evenly rather than spalling or generating flakes.
The 360-320-5 designation reflects the tight inner-diameter, outer-diameter and thickness tolerances the ring must hold to maintain the correct gap and step height relative to the wafer. Flatness and surface finish are equally important, because any deviation alters the local sheath and seats the ring unevenly on the chuck.
Because the focus ring governs the electrical and chemical environment seen by the outermost dies, its condition propagates directly into wafer-level results. As the ring erodes over its service life the edge process drifts, and the consequences accumulate across the whole production lot.
The dominant wear mechanism is steady ion sputtering of the inner edge and upper surface. As the ring thins and its inner profile recedes, the step height relative to the wafer changes, the sheath flattens at the edge, and edge etch performance gradually drifts until the ring reaches its end-of-life threshold and must be replaced.
Repeated thermal cycling, RF stress and mechanical handling can initiate hairline cracks, particularly once the ring has thinned through use. A cracked ring is a serious risk because it can shed large particles, distort the local plasma, or fracture during a process step and contaminate the chamber.
If the ring is not seated flat and concentric, or if etch by-product polymer accumulates beneath or around it, the gap and electrical coupling shift asymmetrically. This produces directional edge non-uniformity and can release flakes of redeposited material as particles onto subsequent wafers.
The focus ring is replaced during scheduled preventive maintenance, and correct handling protects both the new ring and the underlying chuck. The following sequence reflects good practice for TEL 300 mm etch chambers; always defer to the tool owner’s qualified maintenance procedure.
Focus rings are recurring, high-frequency consumables, so a dependable second-source supply is central to controlling cost of ownership and avoiding consumable-driven downtime. ESCT Fab Support offers this ring as a verified, form-fit-and-function compatible part to keep TEL etch chambers running predictably.
It encircles the 300 mm wafer on the electrostatic chuck and extends the plasma sheath beyond the wafer edge, keeping ion trajectories vertical and edge etch uniformity stable. Without a sound ring, the outermost dies see a distorted field and drift out of specification.
No. This ring is supplied as a brand-new, second-source part that is OEM-compatible. It is verified to the form, fit and function of TEL OEM P/N 2L10-251708-11 but it is not an original Tokyo Electron branded component.
Replacement is normally driven by the consumable life counter, by edge process drift seen on monitor wafers, or by visual inspection showing thinning, recession of the inner edge, cracking or particle build-up. Most fabs replace the ring at a set wafer count during scheduled preventive maintenance.
The indicative lead time is 4-5 weeks. Because focus rings are high-frequency consumables, many customers hold buffer stock and order against forecast so that fresh rings are always on hand for each maintenance cycle.
As the ring erodes, the step height and sheath shape at the wafer edge change, so edge critical dimensions and etch rates drift. This shrinks the usable wafer area and can introduce tilted features and particles, all of which reduce the number of good dies per wafer at the perimeter.
Handle the ring with clean gloves, touch only approved edges, and keep it in its protective packaging until installation. These ceramics and silicon parts are brittle, so avoid impact and edge loading, and observe ESD and cleanliness controls throughout to prevent chipping and contamination.
The Focus Ring 360-320-5 (TEL OEM P/N 2L10-251708-11, ESCT P/N ES7099-091) is a precision sacrificial consumable that surrounds the wafer in a Tokyo Electron 300 mm plasma etch chamber and shapes the plasma sheath at the wafer edge. Made from high-purity plasma-grade material and machined to tight dimensional tolerances, it governs edge etch uniformity, plasma confinement and particle performance, and it erodes predictably so that it can be replaced on a planned schedule. Supplied as a brand-new, second-source, form-fit-and-function compatible part with an indicative 4-5 week lead time, it helps TEL etch fabs maintain stable edge yield while controlling consumable cost of ownership.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-251708-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
We use cookies We use analytics cookies to see how visitors use this site, so we can improve it. They are set only if you accept. Read our Cookie Policy.
