OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The TEL focus ring carrying OEM part number 2L10-251497-11 is an edge-process consumable used in Tokyo Electron 300 mm plasma etch process chambers. The ring is the annular component that surrounds the wafer once it is clamped to the electrostatic chuck, occupying the narrow band between the outer edge of the silicon substrate and the chamber’s confinement hardware. In a class of components that is small in mass yet disproportionately influential on results, the focus ring is one of the most consequential parts a fab buys repeatedly, because it sits directly in the path of the plasma sheath and is consumed by it.
Its job is to extend the plasma and the bias-driven sheath outward beyond the silicon, so that ions arriving at the wafer’s extreme edge see the same vertical trajectory and the same field shape as ions arriving at the centre. Without that extension, the sheath would curve sharply at the wafer boundary, tilting incoming ions and degrading the last few millimetres of usable area. The ring effectively makes the wafer behave as though it were larger than it is, presenting a continuous dielectric and electrical surface across the transition from substrate to chamber.
Because it is exposed to continuous ion bombardment and reactive chemistry, the focus ring erodes over time and is scheduled for periodic replacement. ESCT Fab Support supplies this ring (ES7099-057) as a 2nd-source new component built to the form, fit and function of the original, giving process and maintenance engineers a dependable consumable channel without the cost and lead-time pressure of single-source procurement.
Within a TEL 300 mm etch chamber the focus ring performs several overlapping electrical and geometric functions, all aimed at making the wafer edge behave identically to the wafer centre while protecting the hardware beneath it.
Focus rings for this duty are made from materials chosen to interact predictably with the plasma chemistry and to erode in a controlled, gradual manner. The two performance dimensions that matter most are the material’s behaviour under bombardment and its dimensional and thermal stability across the process cycle.
The ring is engineered to withstand sustained ion bombardment and fluorine- or chlorine-bearing chemistries without flaking, cracking or generating excessive particulate. A clean, even erosion profile is preferable to a hard, brittle surface that spalls, because controlled wear keeps the edge field stable for longer and protects particle performance.
Edge process uniformity depends on the ring holding its critical dimensions (inner diameter, step height relative to the wafer plane and overall flatness) across thermal cycling. A ring that warps or whose seating face is uneven will shift the sheath geometry and skew edge results.
Because the focus ring governs the electrical and geometric environment at the wafer edge, its condition feeds directly into edge die yield and chamber matching. A worn or out-of-spec ring is one of the most common root causes of edge-only process drift.
The dominant wear mode is gradual recession of the ring’s upper surface under ion bombardment. As the step height relative to the wafer falls, the sheath at the edge sags and ion trajectories begin to tilt, pulling edge etch rate and profile out of specification well before the ring physically fails.
Thermal cycling, mishandling during installation, or non-uniform erosion can lead to cracking or edge chipping. Once the surface integrity is compromised, the ring sheds particulate onto the wafer, driving defect excursions that may not be traced back to the edge immediately.
A ring that is improperly seated, slightly warped or carrying polymer build-up on its underside will not make uniform thermal and electrical contact. The result is asymmetric edge behaviour, localised hot spots and inconsistent RF return that show up as one-sided non-uniformity on the wafer map.
Replacing a focus ring is a routine preventive-maintenance task, but small errors in cleanliness or seating translate directly into edge process problems. The following sequence reflects sound general practice; always follow the controlling TEL maintenance procedure for the specific chamber.
Focus rings are high-frequency consumables, so the way a fab sources them has a direct effect on cost of ownership and tool availability. ESCT Fab Support helps engineering and procurement teams keep these edge parts flowing reliably.
It surrounds the wafer and extends the plasma sheath outward beyond the silicon edge, keeping ion trajectories vertical and the electric field uniform right out to the wafer boundary. In doing so it preserves etch uniformity and feature profile in the outermost die and protects the hardware beneath it from direct plasma attack.
No. This ring (ES7099-057) is supplied as a 2nd-source new part, manufactured to match the form, fit and function of the original TEL component referenced by OEM P/N 2L10-251497-11. It is not an original OEM part and is not represented as one; it is offered as a compatible alternative.
Most fabs replace focus rings on a consumable-life schedule based on accumulated RF hours or wafer count, supported by edge-sensitive process monitoring. Drifting edge etch rate, edge critical-dimension shift, profile tilt at the wafer periphery or rising edge particle counts are all signs the ring has eroded past its useful window.
The typical lead time is 4-5 weeks. Because focus rings are consumed continuously, we recommend planning replenishment against your preventive-maintenance cadence and holding appropriate buffer stock so that scheduled maintenance is never delayed waiting on parts.
Because the ring is built to the original form, fit and function, including critical inner diameter, step height and flatness, it is intended to reproduce the same edge sheath behaviour as the part it replaces. As with any new consumable, qualify it on monitor wafers during your normal post-maintenance procedure before returning the chamber to production.
Treat it as a particle-critical, plasma-facing part. Keep it in its protective packaging until installation, handle it with clean gloves, avoid contact with the process surfaces and inspect it for chips or contamination before fitting. Store it in a clean, dry environment away from sources of mechanical shock.
The TEL focus ring (OEM P/N 2L10-251497-11, ESCT P/N ES7099-057) is a plasma-facing edge consumable for Tokyo Electron 300 mm etch chambers that extends and shapes the plasma sheath at the wafer boundary. By keeping ion trajectories vertical and the edge field uniform, it directly governs edge etch uniformity, feature profile and particle performance, while shielding the chuck and adjacent hardware. It wears progressively under bombardment and is replaced on a scheduled basis, making reliable, cost-effective sourcing a real contributor to tool availability and cost of ownership. ESCT Fab Support supplies it as a 2nd-source new part with a typical 4-5 week lead time and clear OEM cross-referencing.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-251497-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
We use cookies We use analytics cookies to see how visitors use this site, so we can improve it. They are set only if you accept. Read our Cookie Policy.
