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The TEL Focus Ring identified by OEM part number 2L10-251061-21 is a consumable annular ring that sits at the outer periphery of the electrostatic chuck in a Tokyo Electron 300 mm plasma etch process chamber. The “LAB” descriptor and the “360-T4 (320)” designation point to a specific dimensional and material build of focus ring used to set the plasma sheath geometry at the wafer edge. As a circumferential component that surrounds the 300 mm wafer, it is one of the most directly process-influencing consumables in the chamber, because everything it does happens within a few millimetres of the device-bearing edge of the substrate.
In service, the focus ring is a sacrificial part. It is deliberately positioned in the path of the plasma and the accelerated ions so that it, rather than the chuck or the wafer carrier hardware, absorbs the bombardment that would otherwise distort the field at the wafer edge. Because it erodes during normal operation, it is replaced on a defined preventive maintenance cadence. The accuracy with which a replacement ring reproduces the original height, inner diameter, flatness and material composition therefore translates almost directly into edge die yield.
ESCT Fab Support supplies this focus ring under part number ES7099-060 as a 2nd Source NEW component, manufactured to match the form, fit and function of the original. It is intended as a cost-managed, supply-secure alternative to the OEM consumable for fabs that need to hold their etch process windows without being exposed to single-source lead times.
The focus ring extends the effective electrical and physical surface of the wafer outward beyond its actual edge. By presenting a controlled surface at the same potential reference as the wafer, it keeps the plasma sheath flat and the ion trajectories vertical right up to the last ring of die. Its principal functions in a TEL etch chamber are as follows:
Focus rings for TEL 300 mm etch chambers are produced from process-grade materials selected for plasma resistance, electrical behaviour and low particle generation. The 360-T4 (320) build represents a defined material and dimensional specification, and reproducing that specification faithfully is what allows a 2nd source ring to drop into an established process without re-tuning.
Depending on the application, focus rings of this class are manufactured from high-purity silicon, silicon carbide or quartz-family materials chosen to withstand fluorine- and chlorine-based etch chemistries. The key performance attributes are erosion resistance, controlled electrical characteristics and freedom from contaminant species that could migrate to the wafer.
The height, inner diameter, flatness and surface finish of the ring set the sheath geometry at the wafer edge. Even small departures from specification shift the apparent edge of the plasma and change the etch result on the outer die, so dimensional fidelity is the most important single quality attribute.
Because the focus ring acts on the most yield-sensitive zone of the wafer, its condition has an outsized effect on chamber output. A correctly specified, in-life ring keeps the edge process within its window; a worn or out-of-spec ring degrades edge results long before any alarm is raised. The practical consequences include:
As a sacrificial part the focus ring is expected to wear, but the way it wears and fails determines when it must be replaced and what it does to the process beforehand.
Continuous ion bombardment gradually reduces the ring height and rounds its inner edge. As the ring thins, the sheath plane drops relative to the wafer and ion trajectories at the edge begin to tilt, shifting edge critical dimensions and tilting etch profiles on the outer die. This is the normal end-of-life mechanism and the reason ring height is tracked against a replacement limit.
Thermal cycling, mechanical handling and material fatigue can produce cracks or chips, especially as the ring thins near end of life. Fractured material is a direct particle source and can cause sudden defect excursions, making careful handling and visual inspection at every PM necessary.
Plasma exposure roughens the ring surface and can leave polymer or by-product deposits, which alter local electrical and thermal behaviour and can flake off as particles. Roughening also changes erosion rate over time, so a ring left in service too long degrades edge uniformity progressively rather than abruptly.
Focus ring replacement is a routine preventive maintenance task, but cleanliness and correct seating are critical because the part sits directly in the process path. The following sequence reflects good practice; always follow your facility’s approved procedure and the relevant TEL maintenance documentation.
Focus rings are high-turnover consumables, so securing a reliable supply at a controlled cost protects both budget and uptime. Sourcing ES7099-060 through ESCT Fab Support gives fabs a practical second-source option for this TEL ring:
It surrounds the 300 mm wafer at the edge of the electrostatic chuck and shapes the plasma sheath there, keeping ion trajectories vertical at the wafer periphery so that etch profile and critical dimensions stay uniform out to the outermost die.
No. ES7099-060 is supplied as a 2nd source NEW, OEM-compatible focus ring manufactured to match the form, fit and function of TEL OEM P/N 2L10-251061-21. It is not an original OEM part and is not sold as one.
Focus rings are replaced on a height or wafer-count limit defined by your process, and at any sign of cracking, chipping or excessive surface roughening. Drift in edge critical dimensions or a rise in edge particle counts often signals that a ring is approaching end of life.
When the ring reproduces the original height, inner diameter, flatness and material, it should drop into an established process without re-tuning. As with any consumable change, qualify the first ring against your edge process metrics before committing it to volume production.
The standard lead time is 4-5 weeks. Because focus rings are consumed on a regular PM cycle, we recommend holding buffer stock and reordering ahead of demand to avoid any gap in availability.
Handle only with clean, powder-free gloves, touching the ring at its edges, and keep it in its original protective packaging until installation. Store in a clean, dry environment and inspect for chips or cracks immediately before fitting, since particulate damage directly affects wafer yield.
The TEL focus ring 360-T4 (320), OEM P/N 2L10-251061-21, is a sacrificial edge-confinement consumable that controls the plasma sheath and ion trajectories at the wafer periphery in Tokyo Electron 300 mm plasma etch chambers. Its height, inner diameter, flatness and material composition govern edge etch uniformity, particle performance and edge die yield, which is why faithful reproduction of the original specification matters so much. Supplied by ESCT Fab Support as ES7099-060, a 2nd source NEW ring matched to OEM form, fit and function with a 4-5 week lead time, it gives fabs a cost-managed, supply-secure way to keep this critical wear part on the shelf and their etch edge process inside its window.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-251061-21. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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