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The LAB 360 focus ring (TEL OEM P/N 2L10-251538-11) is a precision annular consumable that sits in the upper edge region of a Tokyo Electron 300 mm plasma etch chamber, encircling the production wafer where it rests on the electrostatic chuck. The “360” and “06-4.5” markings in the raw part name describe a specific ring geometry and profile within the LAB family of edge-ring hardware, while the “PL” suffix denotes the polished, plasma-grade finish applied to the working surfaces. As a focus ring, this component is one of the most directly process-influencing consumables in the chamber, because it physically defines the boundary between the wafer edge and the surrounding chamber wall.
In a 300 mm etch tool, the wafer is only 300 mm across but the plasma sheath, RF field and gas flow must behave uniformly all the way to the outermost few millimetres of usable silicon. The focus ring is what makes that possible. It extends the wafer surface electrically and physically outward, so that the plasma sheath does not collapse or bend sharply at the wafer perimeter. Without it, or with a worn one, the etch profile at the edge die would tilt, the etch rate would drift, and the outer ring of devices on every wafer would fall out of specification.
Because the focus ring is sacrificial by design, it is consumed steadily by the same ion bombardment it is there to manage. It is therefore one of the highest-turnover items in any TEL etch preventive-maintenance schedule, and a part that fabs deliberately keep on the shelf. ESCT Fab Support supplies this LAB 360 focus ring as a 2nd-source NEW component, verified to the form, fit and function of the original.
The focus ring performs several simultaneous jobs at the wafer edge. It is not merely a spacer; it is an active part of the electrical and plasma environment that determines whether edge die are usable. Its principal functions include:
Focus rings for 300 mm etch service are manufactured from high-purity process-grade materials (typically silicon, silicon carbide or quartz depending on the chemistry the chamber runs) chosen for predictable, low-particle erosion under continuous ion bombardment. The polished (“PL”) working surface minimises micro-asperities that would otherwise seed particle generation and accelerate localised erosion. A consistent material grade matters because the ring is consumed dimensionally over its life, and the process must be able to compensate for that erosion in a repeatable way.
Beyond the bulk material, the value of a focus ring lies in its dimensional fidelity. Inner diameter, outer diameter, thickness, the seating step and the flatness of the wafer-adjacent surface all influence where the plasma sheath bends. A ring that is dimensionally faithful to the OEM profile reproduces the original edge electrical environment, so the chamber’s established recipe behaves as it did when the ring was new.
Because the focus ring governs the edge of every wafer the chamber processes, its condition translates directly into measurable yield at the wafer perimeter, where a large fraction of die reside. The consequences of using a correct, in-specification ring, and the penalties of a worn or wrong one, include:
The normal end-of-life mechanism is gradual erosion of the plasma-facing surface. As the ring thins, the height step relative to the wafer changes, the sheath shifts, and edge etch rate and profile slowly drift out of specification. This is why focus rings are tracked by accumulated RF hours and replaced on a defined schedule rather than run to physical failure.
Thermal cycling, mechanical mishandling during a wet clean, or localised arcing can chip or crack the ring. Any fracture is a serious particle source and disturbs the local field, so a chipped ring must be replaced immediately regardless of remaining erosion budget.
Polymer or by-product deposition on the ring, or particulate trapped under it on the seating face, lifts or tilts the ring so it no longer sits flat. The result is asymmetric edge etch, intermittent RF coupling and elevated defectivity, failures that present as a process problem but originate at the ring interface.
Focus-ring replacement is a routine preventive-maintenance task on TEL etch systems, but cleanliness and seating discipline determine whether the new ring performs to its potential. A typical replacement sequence follows these steps:
Focus rings are high-turnover consumables, so availability and consistency matter as much as the part itself. Sourcing this LAB 360 ring (ESCT P/N ES7099-072) through ESCT Fab Support gives fabs and refurbishers a dependable second source with these advantages:
It encircles the wafer at the edge of the electrostatic chuck and extends the plasma sheath, RF field and gas environment outward beyond the physical wafer edge. This keeps the etch uniform and the profiles vertical at the outermost die, which would otherwise be the first to fall out of specification.
No. This is a 2nd-source NEW component supplied as an OEM-compatible part. It is verified to the form, fit and function of TEL OEM P/N 2L10-251538-11, but it is not an original Tokyo Electron branded part and is not sold as such.
It depends on the process chemistry, RF power and duty cycle, so replacement is governed by accumulated RF hours defined in your preventive-maintenance plan rather than by a single fixed figure. Because the ring erodes steadily, most fabs replace it on a scheduled interval before edge performance drifts.
Focus rings for 300 mm etch service use high-purity process-grade materials such as silicon, silicon carbide or quartz, selected to match the chamber chemistry and to erode predictably with low particle generation. The part is manufactured to reproduce the OEM material specification and polished surface finish.
Typical indicators are drifting edge etch rate or critical dimension, tilted edge profiles, rising particle counts at the wafer perimeter and visible thinning, chipping or cracking on inspection. Any crack, chip or arcing damage warrants immediate replacement regardless of remaining erosion budget.
The typical lead time is 4–5 weeks. Order by quoting ESCT P/N ES7099-072 together with TEL OEM P/N 2L10-251538-11 so the correct LAB 360 ring profile is supplied for your chamber configuration.
The LAB 360 focus ring (TEL OEM P/N 2L10-251538-11, ESCT P/N ES7099-072) is a sacrificial edge-confinement consumable that determines plasma sheath shape, RF coupling and gas behaviour at the wafer perimeter in TEL 300 mm plasma etch chambers. Its high-purity material, polished finish and faithful dimensional profile are what keep edge die in specification, particle counts low and recipes stable across the PM cycle. As a high-turnover item, it is a sensible part to stock, and ESCT Fab Support supplies it as a 2nd-source NEW component with a typical 4–5 week lead time.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-251538-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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