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The TEL Focus Ring identified by OEM part number 3D10-251187-V1 is a consumable edge-confinement component used in Tokyo Electron (TEL) 300 mm plasma etch process chambers. The original descriptor, “FOCUS RING, PM 380-303 T4”, points to a focus ring fitted to a specific process module (PM) configuration within a TEL etch platform. In service it sits concentrically around the electrostatic chuck, framing the wafer edge and forming the immediate boundary between the active plasma sheath and the chamber hardware below it.
A focus ring is one of the most heavily duty-cycled consumables in any etch tool. Its primary job is to extend the plasma sheath outward beyond the silicon so that the electric field, and therefore the trajectory of incoming ions, remains vertical right out to the wafer’s outermost dies. Because it is positioned directly in the path of ion bombardment and reactive radicals, it erodes continuously throughout production, and its condition has a direct and measurable bearing on edge etch uniformity, critical dimension (CD) control and overall die yield at the wafer periphery.
ESCT Fab Support supplies this focus ring under part number ES7099-182 as a second-source, new replacement that is verified to the form, fit and function of the TEL original, giving fabs a cost-controlled and supply-secure alternative for a part that is consumed and rotated through the chamber on a routine preventive maintenance schedule.
Within a TEL 300 mm etch process module, the focus ring performs several interdependent jobs at once. It is not a passive spacer; it actively shapes the plasma and the RF environment at the wafer edge, and small changes in its geometry or material state translate into measurable shifts in process behaviour. Its key functions include:
As a plasma-exposed consumable, the value of this focus ring lies in how predictably its material behaves under sustained ion bombardment and aggressive process chemistries. Two characteristics dominate its performance: erosion behaviour and electrical compatibility with the surrounding chamber.
Focus rings for TEL etch modules are produced from high-purity, plasma-grade materials selected for slow, uniform erosion under fluorine- and chlorine-based chemistries and high-energy ion flux. The goal is a controlled, even wear rate so that sheath geometry drifts slowly and predictably across the maintenance interval rather than degrading abruptly.
Beyond raw erosion resistance, the ring must reproduce the original’s height, inner and outer diameters, seating geometry and dielectric properties. These features set the sheath profile and the RF impedance seen at the wafer edge, so close conformance is what keeps edge process results matched to a known baseline.
Because the focus ring governs the plasma environment at the wafer edge, its condition feeds directly into the metrics that production engineers watch most closely. A worn, mismatched or contaminated ring shows up in the data long before it causes a hard fault, and the consequences accumulate across every wafer processed in the module:
A focus ring is engineered to wear out; the engineering challenge is recognising when it has reached the end of its useful life rather than waiting for a failure. The dominant modes are described below.
The most common end-of-life mode is simple thinning. Ion bombardment steadily reduces the ring height, lowering the sheath at the wafer edge and progressively tilting ion trajectories. This is a gradual process, which is precisely why it is managed by RF-hours or wafer-count limits rather than by visual judgement alone.
Thermal cycling, mishandling during a PM, or stress concentrated in a thinned ring can produce cracks or chips. A fractured ring is a serious event: it generates particles, can disturb the seating and field uniformity, and in the worst case fragments may contact or damage the wafer or chuck.
As erosion advances, the exposed surface roughens and can develop redeposited films. These layers flake under continued bombardment and become a source of particles that land on the wafer edge, driving up defect counts even while the ring is still dimensionally serviceable.
Focus ring replacement is a routine preventive-maintenance activity, but it must be carried out with the same care as any plasma-facing part to protect both the new ring and the chamber. The following sequence reflects general good practice; always work to the relevant TEL maintenance procedure and your fab’s qualification protocol.
Focus rings are consumed continuously, so they are best managed as a planned, stocked consumable rather than a reactive purchase. Sourcing them through ESCT Fab Support gives engineering and procurement teams a dependable second-source channel for keeping TEL etch modules in production:
It frames the wafer edge on the electrostatic chuck and extends the plasma sheath outward past the silicon, keeping ion trajectories vertical at the edge dies. This preserves edge etch uniformity and CD control while shielding the chuck and edge hardware from direct ion bombardment.
No. This is supplied as a second-source, new part that is verified to the form, fit and function of the TEL original under OEM part number 3D10-251187-V1. It is not an original OEM part and is not sold as one, but it is intended as a direct compatible replacement.
Focus rings are normally replaced on an RF-hours or wafer-count basis defined by your process. Warning signs that the interval needs review include edge CD drift, tilted edge profiles, worsening centre-to-edge uniformity, rising particle counts at the wafer edge, and visible thinning, cracking or surface roughening at the next PM.
Because it is dimensionally and materially matched to the original, the ring is intended to drop into your existing process without changes. As with any consumable change, ESCT recommends running your standard wafer-edge qualification after installation to confirm results against your baseline.
The typical lead time is 4-5 weeks. As this is a continuously consumed part, we recommend holding buffer stock and placing replenishment orders against your planned PM schedule to avoid gaps in availability.
Keep it in its protective packaging until installation, handle it only with clean, lint-free gloves, and avoid contact with the seating and plasma-facing surfaces. Plasma-grade consumables are sensitive to contamination and mechanical stress, so careful handling directly protects particle performance and ring life.
The TEL Focus Ring (OEM P/N 3D10-251187-V1, ESCT P/N ES7099-182) is a critical edge-confinement consumable for Tokyo Electron 300 mm plasma etch process modules. By shaping the plasma sheath and RF environment at the wafer periphery, it governs edge etch uniformity, CD control, particle performance and edge-die yield, while acting as a sacrificial barrier that protects the chuck and surrounding hardware. Supplied by ESCT Fab Support as a second-source, new replacement with a typical 4-5 week lead time, it gives fabs a cost-effective, supply-secure way to maintain consistent edge process results across routine maintenance cycles.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-251187-V1. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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