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The 3D10-251033-V1 FOCUS RING, 360-302 T3.4 is a precision-engineered silicon plasma-facing component used in Tokyo Electron (TEL) semiconductor processing equipment to support plasma confinement, wafer edge conditioning, and repeatable chamber performance.
Installed around the wafer process zone, the focus ring helps shape the plasma environment near the wafer perimeter, supporting uniform ion distribution and controlled edge processing conditions. Similar TEL focus ring configurations using the 360-302 geometry are widely used in 300mm plasma process chambers where plasma stability and edge uniformity are critical to yield performance.
Because focus rings operate under continuous plasma exposure, thermal cycling, ion bombardment, and reactive process chemistries, erosion, dimensional wear, contamination buildup, or surface degradation can contribute to process drift, plasma instability, particle generation, and increased maintenance frequency. The 3D10-251033-V1 is engineered to support stable chamber conditions and repeatable wafer processing performance.
The ESCT equivalent part number for this component is ES7099-100, supplied as a 2nd Source NEW OEM-compatible replacement designed to meet form, fit, and functional requirements aligned with the original TEL component.
The 3D10-251033-V1 functions as a critical plasma-conditioning and chamber-stability component.
Core functions include:
In many TEL plasma-processing platforms, this focus ring operates alongside electrodes, ground rings, ESC assemblies, inner cells, and chamber shielding components to support overall chamber stability.
The focus ring helps maintain controlled plasma behavior.
Key performance characteristics include:
Stable edge conditions hold process repeatability and yield.
Material integrity directly affects chamber performance.
Performance attributes may include:
Silicon focus rings are commonly used in TEL plasma-processing applications because of their compatibility with semiconductor manufacturing environments.
The 360-302 profile supports consistent chamber operation.
Durability characteristics may include:
Mechanical consistency helps preserve chamber qualification and process repeatability.
The 3D10-251033-V1 may operate alongside related chamber components including:
Together these components support broader chamber stability and process control.
The 3D10-251033-V1 can directly influence chamber performance and equipment availability.
Potential impacts of wear or degradation include:
Replacing a worn focus ring can help restore chamber stability and improve process repeatability.
Continuous plasma exposure may gradually affect ring performance.
Indicators include:
Long-term process exposure may affect ring geometry.
Symptoms may include:
Surface degradation may influence contamination control.
Indicators include:
Wear in the 3D10-251033-V1 may also increase stress on adjacent plasma-facing hardware.
To support best performance:
The 3D10-251033-V1 Focus Ring, 360-302 T3.4 is an OEM-referenced TEL component.
Key considerations:
OEM P/N: 3D10-251033-V1 ESCT P/N: ES7099-100 Part Type: 2nd Source NEW OEM: TEL
Maintaining inventory of the ES7099-100 / 3D10-251033-V1 can reduce downtime exposure and improve maintenance readiness.
It helps control plasma behavior around the wafer edge, supporting process uniformity, plasma stability, and repeatable chamber performance.
Focus rings influence plasma confinement and edge conditions, which directly affect process repeatability, critical dimensions, and yield.
It refers to a specific focus ring geometry and thickness configuration used within compatible TEL process chambers. Similar 360-302 focus ring designs are used across multiple TEL plasma-processing platforms.
4. What are signs the focus ring may need replacement?
Common indicators include:
Yes. Changes in ring geometry or surface condition can alter plasma behavior and impact wafer processing consistency.
Yes. Surface degradation may increase particle generation and contamination risks.
Yes. Plasma instability and contamination-related issues can directly impact wafer quality and production yield.
Issues are commonly identified through PM inspections, chamber qualification results, particle trend analysis, plasma diagnostics, or visual wear assessment.
Yes. Chamber qualification and process verification should be performed after replacement.
Incorrect dimensions or material characteristics may affect plasma behavior, chamber performance, and process outcomes.
No. This product is supplied as ESCT P/N ES7099-100, a 2nd Source NEW OEM-compatible replacement aligned with the original TEL component requirements.
Yes. Chamber configuration, dimensions, and process compatibility should always be confirmed.
Yes. ESCT supports compatibility verification based on equipment and application requirements.
Depending on availability, associated ground rings, electrodes, inner cells, shields, and other plasma-facing chamber components may also be supported.
The 3D10-251033-V1 Focus Ring, 360-302 T3.4 is a critical plasma-facing chamber consumable supporting plasma confinement, edge uniformity, and repeatable semiconductor process performance in TEL systems.
Its condition can directly influence process stability, contamination control, equipment uptime, and wafer yield.
Sourcing through ESCT Fab Support as ES7099-100 provides a verified 2nd Source NEW OEM-compatible replacement backed by semiconductor-focused expertise, quality verification, and responsive supply support.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-251033-V1. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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