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The TEL Focus Ring 360-302-C is a circular plasma-facing consumable that surrounds the 300 mm wafer inside a Tokyo Electron etch process chamber. Catalogued by ESCT Fab Support under part number ES7099-133 and corresponding to OEM part number 3D10-251155-V1, it is the annular component that sits immediately outboard of the wafer edge on the electrostatic chuck, bridging the gap between the silicon being processed and the surrounding chamber hardware. Although it is one of the simpler-looking parts in the chamber, the focus ring performs a disproportionately important job: it shapes the plasma sheath at the wafer perimeter so that the outermost die receive the same ion flux and etch behaviour as die at the centre.
In a TEL etch platform the focus ring is a sacrificial item. It is deliberately exposed to the most aggressive part of the discharge, the region where the sheath bends around the wafer edge, and it erodes over time so that the wafer and the chuck do not. Because its geometry directly controls sheath shape at the edge, even a small change in its height or profile translates into measurable shifts in edge etch rate, etch depth and critical-dimension uniformity. For this reason the focus ring is one of the most frequently replaced consumables in a high-volume etch fab, and keeping a reliable supply on the shelf is a core part of chamber availability planning.
This component is supplied by ESCT as a second-source, brand-new part verified to the form, fit and function of the original. It is intended as a drop-in consumable for the chamber position the 360-302-C occupies, offering fabs an alternative supply route that protects uptime without compromising edge process integrity.
The focus ring is an active element of the plasma confinement scheme rather than a passive spacer. By extending the effective electrode surface beyond the wafer edge and presenting a controlled dielectric or conductive profile to the discharge, it determines where and how the plasma sheath terminates around the wafer perimeter. Its principal functions inside a TEL 300 mm chamber include the following.
A focus ring earns its place in the chamber through the interaction between its material set and the etch chemistry it lives in. Two performance dimensions matter most: how the material withstands the plasma, and how its geometry holds up as it erodes.
Focus rings of this type are produced from etch-grade consumable materials selected for their behaviour under continuous ion bombardment and reactive fluorine- or chlorine-based chemistries. The material must erode in a predictable, controlled manner, resist micro-cracking under thermal cycling, and avoid contributing metallic or particulate contamination to the wafer.
Because the focus ring controls sheath shape geometrically, its as-supplied dimensions and surface finish are as important as its bulk material. Inner and outer diameters, step heights and seating surfaces must match the original so the ring sits flush on the chuck and presents the correct profile to the plasma.
The condition of the focus ring feeds directly into the metrics a fab tracks at the wafer edge. As it wears, its influence on the edge sheath changes, and the symptoms appear in yield data long before the chamber would otherwise flag a fault.
A focus ring is consumed by design, so its failure modes are dominated by predictable erosion plus a handful of secondary mechanisms that can shorten its life unexpectedly.
The primary wear mode is gradual sputter and chemical erosion that thins the ring and lowers its top surface. As height falls, the sheath at the wafer edge reshapes and edge process performance drifts out of specification, defining the end of the ring’s useful life and the point at which it must be replaced.
Repeated thermal cycling, mechanical handling during preventive maintenance, or local hot spots can cause cracks or edge chips. A cracked ring is a serious particle source and can fragment, so any visible fracture warrants immediate removal regardless of remaining height.
Polymer and by-product films can accumulate on the ring and its seat, while particles trapped under the ring prevent it sitting flush. Both disturb thermal contact and field symmetry, producing azimuthal non-uniformity that mimics or accelerates normal wear-out.
Focus ring replacement is a routine preventive-maintenance task, but it directly affects edge process control and particle performance, so it should follow the tool owner’s qualified procedure. The general sequence below is typical for a TEL 300 mm etch chamber.
Focus rings are predictable, high-frequency consumables, which makes them ideal candidates for a managed second-source supply programme. Sourcing the 360-302-C through ESCT Fab Support gives fabs a way to hold the line on edge process integrity while diversifying their supply chain and controlling cost.
It surrounds the 300 mm wafer on the electrostatic chuck and shapes the plasma sheath at the wafer edge. By extending the field uniformly beyond the wafer perimeter, it keeps the outer die etching at the same rate and profile as the centre, and it protects the chuck by eroding sacrificially in place of more costly hardware.
No. This is a second-source, brand-new part supplied by ESCT Fab Support and verified to the form, fit and function of the original. It is not an original OEM part. It cross-references to OEM part number 3D10-251155-V1 and is intended as a compatible replacement for the same chamber position.
The usual triggers are accumulated RF hours against the tool owner’s wear limit, measured loss of ring height, or edge process symptoms such as critical-dimension drift, edge etch-rate non-uniformity or rising particle counts. Any visible crack or chip is grounds for immediate replacement regardless of remaining height.
A ring matched to the original geometry and material should reproduce the established edge behaviour. As with any focus ring change, best practice is to requalify the chamber with your standard edge uniformity and particle checks, and to run any seasoning recipe before returning the tool to production.
The current lead time for this part is 4-5 weeks. Because focus rings are consumed on a predictable schedule, we recommend planning replenishment around your preventive-maintenance cadence and holding appropriate buffer stock to avoid chamber downtime.
Keep it in its protective packaging until installation, handle it only with gloved hands or approved clean tooling, and avoid contact with the plasma-facing surfaces. Store in a clean, dry environment to prevent contamination or moisture pickup before the ring goes into the chamber.
The TEL Focus Ring 360-302-C (OEM P/N 3D10-251155-V1, ESCT P/N ES7099-133) is a sacrificial edge-confinement consumable for Tokyo Electron 300 mm plasma etch chambers. Sitting just outboard of the wafer on the electrostatic chuck, it shapes the plasma sheath at the wafer edge to protect within-wafer uniformity, edge critical dimensions and particle performance, while eroding in place of more costly chamber hardware. As a high-frequency consumable it benefits from disciplined replacement and stocking, and ESCT supplies it as a brand-new, second-source part verified to original form, fit and function with a 4-5 week lead time.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-251155-V1. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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