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OEM:
The 1D10-350653-11 (RING, F-6S-SI-240-3.4A) is a precision-engineered silicon focus ring used within Tokyo Electron plasma etch systems, designed to control plasma distribution at the wafer edge and maintain process uniformity across the substrate.
Positioned around the wafer, this focus ring shapes the electric field and plasma density near the wafer perimeter, holding etch or deposition rates consistent from center to edge. As a plasma-facing consumable, it also protects chamber hardware from direct exposure, extending the lifespan of critical components.
The 1D10-350653-11 focus ring functions as a key chamber consumable within plasma processing environments.
Core functions include:
It operates alongside electrodes, ESCs (electrostatic chucks), insert rings, and other chamber hardware.
The ring plays a critical role in maintaining process consistency.
Key characteristics include:
The F-6S-SI-240-3.4A designation indicates a silicon-based ring optimised for plasma environments.
Performance features include:
The focus ring is designed to wear in a controlled manner.
Durability features include:
The 1D10-350653-11 focus ring directly impacts process uniformity and yield.
Potential impacts of wear or degradation include:
Replacing a worn focus ring restores plasma uniformity and process stability.
Continuous plasma exposure alters the ring surface.
Indicators include:
Material wear can introduce contamination.
Symptoms include:
Worn rings affect plasma distribution.
Indicators include:
For best performance:
The 1D10-350653-11 (F-6S-SI-240-3.4A) is a Tokyo Electron OEM silicon focus ring.
Key considerations:
It typically refers to the ring type (focus ring), silicon material, diameter (~240 mm class), and specific geometry or thickness profile used for process optimisation.
A focus ring actively shapes plasma distribution at the wafer edge, while an insert ring primarily protects chamber components and defines process boundaries.
Extremely critical. Small deviations in ring geometry can markedly affect plasma uniformity and yield at tight process tolerances.
Edge non-uniformity, increased particle counts, subtle process drift, and visible surface erosion.
It may function, but at the cost of reduced process stability and yield. Continued use increases risk of defects and variability.
It alters electric field distribution, causing uneven plasma density and inconsistent processing near the wafer edge.
Delayed replacement can lead to edge defects, reduced usable wafer area, and overall yield loss.
Yes. ESCT verifies material quality, dimensional accuracy, and compatibility aligned with OEM requirements.
Depends on process chemistry, plasma intensity, and usage hours. Most fabs use PM intervals and process monitoring.
Yes. A degraded ring exposes chamber hardware to plasma, accelerating wear on more expensive components.
The 1D10-350653-11 silicon focus ring (F-6S-SI-240-3.4A) is a mission-critical plasma-facing consumable within Tokyo Electron systems, controlling wafer edge plasma behaviour and holding process uniformity. Its condition directly impacts yield, edge performance, and overall tool stability.
Sourcing through ESCT Fab Support gets you verified material quality, precise fitment, and faster availability, helping maintain consistent process control and maximise semiconductor manufacturing performance.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 1D10-350653-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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