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The TEL Focus Ring 360-302-C is a precision-machined consumable component that sits at the outer perimeter of the wafer in a Tokyo Electron (TEL) 300 mm plasma etch chamber. Carrying OEM part number 3D10-251155-V1 and supplied by ESCT Fab Support under part number ES7099-146, this annular ring encircles the electrostatic chuck and frames the production wafer, forming a continuous, dielectrically and electrically matched surface that extends the plasma sheath out beyond the silicon edge. In doing so it converts the abrupt physical boundary at the wafer edge into a gradual transition, which is the single most important factor in achieving acceptable etch results across the outermost few millimetres of the wafer.
Focus rings are sacrificial by design. Because they occupy the same plasma-facing plane as the wafer, they absorb a continuous flux of energetic ions and reactive radicals throughout every process cycle, eroding measurably over their service life. The 360-302-C naming convention reflects a specific ring geometry, inner and outer diameter, and step profile tuned to a particular TEL chamber configuration and process regime, so dimensional fidelity to the original is mandatory rather than optional.
As a high-turnover wear part, the focus ring has a direct and measurable effect on edge etch uniformity, critical dimension (CD) control at the wafer edge, and overall device yield. A worn, mismatched or contaminated ring is one of the most common root causes of edge-zone excursions, which is why fabs hold qualified ring inventory and replace on a scheduled basis rather than waiting for failure.
Within a TEL 300 mm etch chamber, the focus ring performs several interlocking electrical, geometric and plasma-physics functions simultaneously. It is not a passive spacer; it actively shapes the field environment that the wafer edge experiences during processing.
Focus ring performance is governed almost entirely by the material chosen and how that material behaves under sustained plasma exposure. The 360-302-C is produced from a process-matched, high-purity material consistent with TEL focus ring practice, selected to combine the correct electrical character with predictable, low-particle erosion behaviour.
The ring must erode slowly and uniformly so that its step height changes predictably over thousands of RF hours rather than degrading abruptly. High material purity minimises metallic and particulate contamination released into the discharge as the surface wears, while a consistent grain or fibre structure keeps the recession rate even around the full circumference. This predictability is what allows fabs to qualify a fixed replacement interval.
Because the ring forms part of the RF and dielectric environment around the wafer, both its physical dimensions and its electrical properties must replicate the original. Inner diameter, outer diameter, thickness, step profile and surface finish are held to tight tolerances so that the as-installed ring presents the same sheath-shaping geometry and the same impedance to the discharge as the part it replaces.
The condition of the focus ring shows up directly in edge-zone metrology long before it causes an obvious tool fault. Operating with a worn or out-of-spec ring carries measurable consequences for the products being etched.
A focus ring is consumed in service, so its failure modes are dominated by progressive wear rather than sudden breakage. Recognising the pattern allows the ring to be replaced before yield is affected.
The dominant wear mode is gradual recession of the plasma-facing surface under continuous ion bombardment. As the ring thins and the step relative to the wafer shrinks, the sheath geometry at the edge changes and edge CD drifts out of specification. This is the normal end-of-life mechanism and the reason rings are tracked against RF hours.
Thermal cycling, mechanical shock during handling, or careless installation can crack or chip the ring. A cracked ring is an immediate source of particles and can disturb the local field, so any visible fracture, chip or edge damage warrants immediate removal from service.
Polymer and by-product films can accumulate on the ring surface and later flake away as defect-generating particles, while a contaminated or incorrectly cleaned ring can introduce unwanted species into the discharge. Uneven deposition can also locally alter the electrical environment, degrading edge uniformity before the ring is fully eroded.
Focus ring replacement is a routine preventive-maintenance task, but it must be carried out under cleanroom discipline to protect both the new ring and the chamber. The following sequence reflects good practice for TEL 300 mm etch chambers; always defer to the tool owner’s qualified procedure.
Because focus rings are consumed continuously, sourcing strategy has a direct bearing on cost of ownership and tool availability. ESCT Fab Support supplies the ES7099-146 focus ring as a qualified second-source alternative to the OEM part, giving fabs a dependable supply channel for a high-turnover consumable.
It encircles the wafer at the edge of the electrostatic chuck and extends the plasma sheath beyond the silicon, so that ion bombardment at the wafer edge matches the centre. This preserves edge etch uniformity, controls critical dimension at the perimeter and protects the chamber hardware beneath it from erosion.
No. This is a second-source, new component supplied by ESCT Fab Support under part number ES7099-146. It is manufactured as a new OEM-compatible part and verified to the form, fit and function of TEL OEM P/N 3D10-251155-V1, but it is not an original Tokyo Electron OEM part and is not sold as one.
Service life depends on the process chemistry, power and duty cycle, so it is normally tracked against accumulated RF hours and edge metrology rather than a universal figure. Most fabs establish a qualified replacement interval and swap the ring preventively before step-height loss pushes edge CD out of specification.
Typical indicators include drifting edge CD, tilted or bowed sidewalls in the outer wafer zone, declining edge etch uniformity, rising particle counts and, in advanced cases, visible thinning, roughening, chipping or cracking of the ring surface during inspection.
The ring is part of the electrical and geometric environment around the wafer. If its diameter, step height or material properties differ from the original, it shapes the plasma sheath and RF return path differently, which shifts edge results. Holding the original tolerances is what allows the ES7099-146 to behave like the part it replaces.
The typical lead time is 4-5 weeks. Because the focus ring is a continuously consumed item, we recommend factoring this into preventive-maintenance planning and holding buffer stock so that scheduled ring changes are never gated by procurement.
The TEL Focus Ring 360-302-C (OEM P/N 3D10-251155-V1), supplied by ESCT Fab Support as ES7099-146, is a sacrificial plasma-confinement edge ring for Tokyo Electron 300 mm etch chambers. By extending the plasma sheath and matching the electrical environment at the wafer perimeter, it governs edge etch uniformity, critical-dimension control and particle performance, while protecting the chuck and chamber hardware beneath it. Because it erodes predictably in service, dimensional and material fidelity to the original are decisive, and a reliable, qualified second-source supply with a known 4-5 week lead time helps fabs keep cost of ownership and tool availability under control.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-251155-V1. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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