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The TEL Focus Ring 360-T6.5 is a circular plasma-confinement consumable that surrounds the 300 mm wafer at the perimeter of a Tokyo Electron etch process chamber. Identified by the raw descriptor “RING, FOCUS 360-T6.5” and OEM part number 3D10-251036-V1, it sits concentric to the electrostatic chuck (ESC) and frames the outer edge of the wafer where the plasma sheath would otherwise terminate abruptly. By extending the conductive and dielectric boundary of the wafer outwards, the focus ring “focuses” the ion flux so that the etch front at the wafer edge behaves much like the etch front across the central die.
In a TEL 300 mm chamber the focus ring is one of the most heavily duty-cycled consumables in the kit. It is directly exposed to the energetic ion bombardment and reactive radical chemistry of the etch plasma, and it erodes measurably over the course of normal production. The “360” and “T6.5” elements of the descriptor relate to the ring geometry and its nominal thickness profile, the dimension set that determines how the sheath bends across the wafer-to-ring transition. Because that geometry is the single largest lever on edge etch behaviour, the ring is treated as a controlled, scheduled-replacement item rather than a permanent chamber component.
ESCT Fab Support supplies this ring under part number ES7099-099 as a 2nd Source NEW component, verified to the form, fit and function of the original. It is intended as a drop-in replacement for fabs that want a reliable, cost-controlled supply of edge consumables without compromising edge yield. Typical lead time is 4-5 weeks.
The focus ring is a sacrificial dielectric/conductive annulus whose job is to make the wafer edge electrically and geometrically continuous with the wafer interior, so that the plasma sheath does not collapse or distort at the perimeter. In a TEL 300 mm etch chamber it performs several interlocking functions:
Focus rings for plasma etch are manufactured from materials selected for plasma compatibility, predictable erosion behaviour and low particle generation. The choice of material and the precision of the machined profile together determine both how the ring shapes the plasma and how long it lasts in service.
Etch focus rings are commonly produced from high-purity silicon, silicon carbide or quartz depending on the process chemistry. These materials resist the fluorine- and chlorine-based chemistries used in dielectric and conductor etch while keeping metallic and particulate contamination to a minimum.
The thickness profile encoded in the “T6.5” descriptor and the inner/outer diameters of the “360” geometry must be held to tight tolerance, because even small departures from nominal change how the sheath bends at the wafer edge and therefore shift edge critical dimension.
Because the focus ring governs the plasma environment at the wafer perimeter, its condition has an outsized effect on the die nearest the edge, exactly the die that are most expensive to lose at a mature 300 mm node. A worn or out-of-spec ring shows up directly in process data:
The dominant wear mechanism is gradual erosion of the upper surface under continuous ion bombardment. As the ring thins, the sheath sits lower and bends differently across the wafer edge, progressively degrading edge uniformity until the ring reaches its erosion limit and must be replaced.
Thermal cycling, handling during preventive maintenance and localised hot spots can initiate cracks or edge chips in brittle ring materials. A cracked ring is a substantial particle source and can shift its electrical behaviour, so any visible fracture warrants immediate removal from service.
Process by-products can accumulate on and around the ring, and uneven deposition or seating gaps create sites for arcing. Arc damage pits the surface, accelerates local erosion and injects defects onto nearby wafers, often appearing as a sudden rather than gradual excursion.
Focus ring replacement is a routine preventive-maintenance task, but it must be carried out cleanly and precisely because the ring’s seating and concentricity directly affect edge performance. The following sequence reflects good general practice and should always be performed in line with the relevant TEL chamber procedures:
Focus rings are high-turnover consumables, so a dependable second-source supply is central to keeping etch chambers running at target uptime without overspending on edge kit. Sourcing ES7099-099 through ESCT Fab Support gives fabs a practical alternative to single-channel OEM procurement:
It surrounds the 300 mm wafer and extends the plasma sheath beyond the wafer edge, so ions strike the outermost die vertically and edge etch behaviour matches the wafer interior. This keeps edge etch rate, critical dimension and feature profile uniform out to the edge exclusion zone.
No. This ring is supplied as a 2nd Source NEW, OEM-compatible component. It is a brand-new part manufactured to match the original’s form, fit and function, but it is not an original Tokyo Electron OEM part and is not sold as one.
The clearest indicators are drift in edge etch rate and edge critical dimension, rising particle counts and degraded edge die yield, alongside the measured erosion depth approaching the chamber’s defined limit. Most fabs replace the ring on a scheduled basis tied to RF hours or wafer count derived from wear-trend data.
The typical lead time is 4-5 weeks. Because focus rings are consumed on a regular cycle, we recommend planning replenishment around your preventive-maintenance schedule and holding a sensible buffer stock to cover demand spikes.
Any new edge consumable changes the starting point of the wear curve, so a conditioning or season recipe and a verification run against the chamber baseline are recommended after installation. Maintaining consistent, in-tolerance rings across a fleet is one of the most effective ways to preserve chamber-to-chamber matching.
It should be unpacked and installed in a clean environment, handled only with clean powder-free gloves, and protected from impact because the brittle materials used in focus rings can chip or crack. Contamination or mechanical damage before installation can compromise both particle performance and edge uniformity.
The TEL Focus Ring 360-T6.5 (OEM P/N 3D10-251036-V1, ESCT P/N ES7099-099) is a sacrificial plasma-confinement consumable that shapes the sheath at the wafer edge in Tokyo Electron 300 mm etch chambers. Its material purity and dimensional precision directly control edge etch uniformity, critical dimension and particle performance, and its predictable erosion makes it a scheduled-replacement item central to edge yield. Supplied by ESCT Fab Support as a 2nd Source NEW, OEM-compatible part with a 4-5 week lead time, it offers fabs a cost-effective, dependable second-source option for this high-turnover edge consumable.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-251036-V1. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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