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The 1D10-350647-M2 RING, F-8SO-SI-260-3.4A (325-10) is a precision-engineered silicon focus ring used in Tokyo Electron (TEL) semiconductor processing equipment to support plasma confinement, stabilize wafer edge conditions, and improve process uniformity during advanced plasma etch applications.
Installed around the wafer process zone, the focus ring helps shape the plasma environment near the wafer perimeter, controlling ion distribution and electrical field behavior for consistent etching performance across the wafer surface. In semiconductor manufacturing environments where critical dimension control, profile accuracy, and yield optimization matter, maintaining focus ring integrity is critical to process success.
Because focus rings are continuously exposed to plasma, RF energy, thermal cycling, and aggressive process chemistries, they gradually experience erosion and wear over time. The 1D10-350647-M2 is designed to provide stable chamber performance and repeatable process conditions throughout its operational life.
The ESCT equivalent part number for this component is ES7099-194, supplied as a 2nd Source NEW OEM-compatible replacement designed to meet form, fit, and functional requirements aligned with the original TEL component.
The 1D10-350647-M2 functions as a critical plasma-management component.
Core functions include:
In TEL plasma-processing systems, focus rings commonly operate alongside electrodes, ground rings, ESC assemblies, chamber liners, and other plasma-facing consumables.
The focus ring helps regulate plasma behavior near the wafer perimeter.
Key performance characteristics include:
Proper edge control helps improve manufacturing precision and yield.
Silicon is widely used in plasma-facing chamber applications.
Performance attributes may include:
High-purity silicon helps maintain contamination-sensitive semiconductor processes.
Designed for demanding semiconductor manufacturing environments.
Durability characteristics may include:
Maintaining dimensional integrity helps preserve chamber qualification and process repeatability.
The 1D10-350647-M2 may operate alongside related chamber components including:
Together these components support plasma control and chamber optimization.
The 1D10-350647-M2 can directly influence chamber performance and manufacturing productivity.
Potential impacts of wear or degradation include:
Replacing a worn focus ring can help restore process stability and improve chamber performance.
Continuous plasma exposure gradually affects the ring surface.
Indicators include:
Long-term process exposure may alter component geometry.
Symptoms may include:
Wear progression may contribute to contamination concerns.
Indicators include:
Failure to replace worn focus rings may accelerate wear on adjacent plasma-facing components.
To support best performance:
The 1D10-350647-M2 Ring, F-8SO-SI-260-3.4A (325-10) is an OEM-referenced TEL component.
Key considerations:
Maintaining inventory of the ES7099-194 / 1D10-350647-M2 can help reduce downtime exposure and improve maintenance readiness.
It helps control plasma behavior around the wafer edge, supporting process uniformity, plasma stability, and repeatable chamber performance.
Focus rings influence plasma confinement and ion distribution, directly affecting etch uniformity, profile control, and wafer yield.
It identifies a specific TEL focus ring design and dimensional configuration developed for compatible chamber platforms and process applications.
4. What are signs the focus ring may need replacement?
Common indicators include:
Yes. Changes in ring geometry can alter plasma characteristics and impact wafer processing consistency.
Yes. Plasma-facing erosion may contribute to particle generation and wafer defects.
Yes. Plasma instability, contamination, and edge process variation can directly impact manufacturing yield.
Issues are commonly identified through PM inspections, chamber qualification testing, plasma diagnostics, and particle monitoring.
Yes. Chamber qualification and process verification should always be performed following focus ring replacement.
Incorrect dimensions or material characteristics may affect plasma performance, chamber compatibility, and process outcomes.
No. This product is supplied as ESCT P/N ES7099-194, a 2nd Source NEW OEM-compatible replacement aligned with the original TEL component requirements.
Yes. Chamber configuration, dimensions, process requirements, and subsystem compatibility should always be confirmed.
Yes. ESCT supports compatibility verification based on equipment and application requirements.
Depending on availability, associated electrodes, ground rings, liners, shields, confinement rings, and other plasma-facing components may also be supported.
Preventive replacement helps maintain plasma stability, reduce particle-related defects, preserve process consistency, and minimize unexpected production interruptions.
The 1D10-350647-M2 Ring, F-8SO-SI-260-3.4A (325-10) is a critical plasma-facing consumable that supports plasma confinement, wafer edge control, and repeatable semiconductor manufacturing performance in TEL systems.
Its condition can directly influence process uniformity, contamination control, equipment uptime, and wafer yield.
Sourcing through ESCT Fab Support as ES7099-194 provides a verified 2nd Source NEW OEM-compatible replacement backed by semiconductor expertise, quality verification, and responsive supply support.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 1D10-350647-M2. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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