RING,FOCUS 360-298.1-3.4(VU)

PART DETAILS

K-PU-000077-11
RING,FOCUS 360-298.1-3.4(VU)

OEM P/N: 

K-PU-000077-11

ESCT P/N: 

ES7099-184

PART TYPE:

2nd Source NEW

OEM: 

TEL
MORE INFO

K-PU-000077-11 focus ring for Tokyo Electron (TEL) etch systems

The K-PU-000077-11 (RING, FOCUS 360-298.1-3.4(VU)) is a plasma-facing focus ring used in Tokyo Electron (TEL) etch equipment. Installed around the wafer edge, it shapes plasma behaviour at the boundary of the wafer, supports etch uniformity into the outermost dies, and protects the chuck and chamber hardware beneath it.

Focus rings are true consumables: they sit in direct contact with the plasma and erode over accumulated RF hours. Managing their condition is part of normal chamber consumable discipline, because ring wear shows up in the process before it shows up as a mechanical failure.

Functional role of the K-PU-000077-11 in the etch chamber

  • Edge plasma control extends the wafer’s electrical environment beyond its physical edge so the plasma sheath stays uniform across the full wafer surface.
  • Etch uniformity supports consistent etch rate and profile in the outer wafer zone, protecting edge-die yield.
  • Hardware protection shields the electrostatic chuck and surrounding components from ion bombardment and radical attack.
  • Defined wafer environment maintains the intended geometry and materials boundary around the wafer during processing.

Material and design characteristics

Rings of this class are machined to tight dimensional tolerances from materials selected for plasma compatibility, commonly high-purity silicon, silicon carbide or quartz depending on the process chemistry. Key characteristics include:

  • High-purity, plasma-compatible material to minimise contamination of the process.
  • Precision-machined dimensions so the ring seats correctly and presents the intended profile to the plasma.
  • Controlled surface finish for predictable erosion behaviour.
  • Dimensional designations (such as RING, FOCUS 360-298.1-3.4(VU)) that identify the exact variant for the chamber and process configuration.

Impact on process results

The wafer edge is where uniformity is hardest to hold, and the focus ring is the component that holds it. As a ring erodes, sheath geometry at the edge changes: etch rate, CD and profile in the outer dies drift first, followed by increased particle risk as the ring surface degrades. Replacing rings at the correct interval protects edge yield and keeps chamber matching consistent across a fleet.

Common wear indicators

  • Edge-die yield loss or edge etch-rate drift in process data.
  • Visible erosion, thinning, chamfer rounding or surface texturing at inspection.
  • Rising particle counts associated with the wafer edge region.
  • Chamber-to-chamber mismatch that tracks ring age.

Replacement best practices

  • Replace at the OEM-recommended interval or measured wear limit rather than at failure.
  • Handle with appropriate cleanliness; the ring is a process-critical clean part.
  • Inspect adjacent edge components and the chuck seating surface at each change.
  • Confirm the correct variant (RING, FOCUS 360-298.1-3.4(VU)) for the chamber before installation.
  • Follow the tool’s requalification practice after consumable changes.

Why source the K-PU-000077-11 from ESCT Fab Support

ESCT Fab Support supplies the K-PU-000077-11 focus ring as a verified 2nd New OEM-compatible consumable for Tokyo Electron (TEL) etch systems, helping fabs manage consumable cost and availability on current and legacy chambers alike. Our engineers can confirm the correct ring variant against your chamber configuration before you order.

Frequently asked questions

What is the K-PU-000077-11 focus ring used for?

It is a plasma-facing focus ring used in Tokyo Electron (TEL) etch equipment, fitted around the wafer edge to shape plasma behaviour at the boundary of the wafer and protect the surrounding chamber hardware.

What does a focus ring actually do?

It extends the electrical and geometric environment of the wafer slightly beyond its edge, so etch conditions stay consistent right up to the outermost dies, and it shields the chuck and chamber components beneath it from plasma attack.

Is a focus ring a consumable?

Yes. The ring erodes with plasma exposure and is replaced on a schedule or at a measured wear limit; running a worn ring degrades edge-die results before it fails mechanically.

What are the signs that a focus ring needs replacement?

Common indicators include edge-die yield loss, drift in edge etch rate or profile, visible erosion, thinning or surface texturing of the ring, and increasing particle counts traced to the wafer edge region.

Can a worn focus ring affect process uniformity?

Yes. As the ring erodes, the plasma sheath at the wafer edge changes shape, which alters etch rate and profile in the outer zone of the wafer.

What does the RING, FOCUS 360-298.1-3.4(VU) designation refer to?

It is the catalogue designation identifying this specific ring variant and its dimensional configuration. Compatibility should always be confirmed against part number K-PU-000077-11 and your chamber configuration.

How is focus ring condition monitored?

Through scheduled inspection at chamber cleans, erosion or thickness measurement, edge yield and etch-uniformity trend review, and particle monitoring.

Should other edge components be checked at replacement?

Yes. Adjacent edge rings, cover rings and chamber surfaces wear in the same environment and are best inspected in the same intervention.

Is compatibility verification important before ordering?

Yes. Ring material, dimensions and configuration should be confirmed against OEM part number K-PU-000077-11 and your tool configuration before installation.

Can ESCT verify compatibility before shipment?

Yes. ESCT supports form, fit and functional verification aligned with OEM requirements before the part ships.

Is this an original OEM part?

This product is supplied as a 2nd New OEM-compatible part, verified to meet form, fit, and functional requirements aligned with the relevant part number. It is not an original OEM manufacturer part.

Summary

The K-PU-000077-11 (RING, FOCUS 360-298.1-3.4(VU)) is a plasma-facing focus ring consumable for Tokyo Electron (TEL) etch equipment. Its condition directly affects edge etch uniformity, edge-die yield and chamber hardware protection, making disciplined inspection and timely replacement a straightforward way to protect process results. Sourcing it from ESCT Fab Support gets you verified quality, reduced lead times, and expert technical support, keeping your equipment stable, efficient, and production-ready.

Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number K-PU-000077-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.

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