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The TEL Focus Ring 360-T6.5 is an annular consumable that encircles the 300 mm wafer at the periphery of the electrostatic chuck in a Tokyo Electron plasma etch process chamber. Carrying the OEM part number 3D10-251036-V1, it is one of the most heavily duty-cycled components in the entire etch module, sitting directly in the path of energetic ions and reactive radicals throughout every process step. The “360” designation identifies the chamber platform it is engineered for, while the “T6.5” suffix denotes the specific thickness and profile variant, a dimensional detail that is critical, because focus ring height directly sets the position of the plasma sheath relative to the wafer edge.
Physically, the focus ring is a precision-machined ring of process-compatible material that lies flush with, and slightly proud of, the top surface of the wafer. Its function is deceptively simple in geometry but profound in effect: by extending the conductive and dielectric environment of the chuck radially outward past the wafer rim, it allows the plasma sheath to remain flat and uniform across the very last few millimetres of the substrate. Without it, the sheath would curve sharply downward at the wafer edge, bending ion trajectories and destroying etch verticality in the outermost dies.
Because it is a sacrificial part exposed to continuous ion bombardment, the focus ring erodes over the course of normal production and is replaced on a defined preventive maintenance schedule. As it wears, its influence on edge uniformity and yield shifts measurably, which is why fabs treat it as a tightly controlled consumable rather than a fit-and-forget structural element. The 360-T6.5 supplied by ESCT Fab Support is dimensioned and material-matched to restore the chamber to its qualified baseline.
In a TEL etch chamber the focus ring performs several overlapping electrical, electromagnetic and process-conditioning duties simultaneously. It is not merely a mechanical spacer; it is an active participant in shaping the plasma at the wafer edge and in defining where energy is delivered to the substrate.
Focus rings for 300 mm etch are made from materials selected to balance sputter resistance, plasma compatibility and electrical behaviour against the chemistries the chamber runs. The 360-T6.5 is manufactured to match the OEM material specification and surface finish so that its erosion behaviour and electrical characteristics replicate those of the original part.
The ring must endure sustained ion bombardment in fluorine- and oxygen-bearing chemistries without shedding particles or eroding unevenly. Depending on the variant, focus rings are produced from high-purity silicon, silicon carbide, quartz or process ceramic; the controlling requirements are low contamination potential, predictable wear rate and freedom from microcracking under thermal cycling.
Because focus ring height and inner-diameter clearance directly set sheath position, the 360-T6.5 is held to tight tolerances on thickness, flatness, concentricity and edge profile. Matching the OEM dimensions puts the sheath where the process recipe expects it, and matching the bulk electrical properties leaves RF coupling at the edge unchanged.
The condition of the focus ring has an outsized effect on edge yield relative to its modest size and cost. A correctly specified, correctly seated ring keeps the outermost dies within profile and critical-dimension targets; a worn, mismatched or incorrectly installed ring degrades exactly the region where die density is highest.
As a sacrificial part, the focus ring is expected to wear; the engineering goal is to replace it before that wear begins to push edge results out of specification.
Continuous ion bombardment thins the ring over time, lowering its effective height. As the height drops, the plasma sheath sinks at the wafer edge, ion angles begin to tilt and edge etch rate and profile drift, typically the first symptom seen as edge critical dimension or tilt creeps out of band.
Repeated thermal cycling and localised hot spots can initiate microcracks, chips or flaking at the ring surface or inner edge. Once a ring begins to spall, it sheds particles directly onto the wafer edge, driving defect counts up sharply and forcing an unplanned chamber intervention.
Etch byproducts and polymer can accumulate on and beneath the ring, while particulate trapped under the ring during a maintenance event prevents it from seating flat. A ring that is not fully seated tilts the local sheath and creates an azimuthal non-uniformity that is often misdiagnosed as a recipe or hardware fault elsewhere in the chamber.
Focus ring replacement is a routine preventive-maintenance task, but it must be carried out under proper contamination control because the ring sits in the wafer’s immediate environment. The following sequence reflects general best practice; always follow the TEL chamber maintenance procedure and the relevant safety protocols for your facility.
Focus rings are high-turnover consumables, so dependable supply and consistent quality matter as much as the part itself. ESCT Fab Support stocks and sources the 360-T6.5 (ES7099-183) to keep TEL etch tools qualified and running without the cost and lead-time exposure of single-source OEM procurement.
It encircles the wafer at the chuck periphery and extends the plasma sheath past the wafer edge so that ion trajectories stay vertical there. This keeps edge etch rate, profile and critical dimension consistent with the centre of the wafer, protecting the outermost dies.
No. This is supplied as a new, OEM-compatible second-source part. It is manufactured and verified to match the form, fit and function of the original TEL ring (OEM P/N 3D10-251036-V1) but it is not an original OEM-branded component.
It identifies the specific thickness and profile variant of the ring. Focus ring height is critical because it sets where the plasma sheath sits relative to the wafer edge, so it is important to fit the exact variant your chamber is qualified to use rather than a different-thickness ring.
Service life depends on the chemistries, power levels and duty cycle of the specific process, so it is governed by each fab’s preventive-maintenance schedule and edge-uniformity monitoring rather than a single fixed interval. The ring is replaced once erosion begins to push edge results toward their control limits.
As the ring thins, the sheath sinks and edge etch profile and critical dimension drift, costing edge die yield. Pushed further, the ring can crack or flake and become a particle source, which can trigger an unplanned chamber intervention and wider wafer scrap.
The standard lead time is 4-5 weeks. As this is a consumable that is replaced on a regular cycle, we recommend planning orders around your preventive-maintenance schedule and holding appropriate safety stock to avoid tool downtime.
The TEL Focus Ring 360-T6.5 (OEM P/N 3D10-251036-V1, ESCT P/N ES7099-183) is a sacrificial wafer-edge consumable that governs plasma sheath position, edge etch uniformity and particle performance in Tokyo Electron 300 mm etch chambers. Its thickness, profile and material directly determine how the outermost dies etch, tying consistent specification and timely replacement to edge yield and chamber matching. Supplied by ESCT Fab Support as a quality-verified, OEM-compatible second-source part with a 4-5 week lead time, it lets fabs keep TEL etch tools qualified and productive while optimising the running cost of a frequently replaced part.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-251036-V1. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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