(C2)HOT EDGE RING, HE,38X ESC,RND

PART DETAILS

716-023013-027
(C2)HOT EDGE RING, HE,38X ESC,RND

OEM P/N: 

716-023013-027

ESCT P/N: 

ES2099-004

PART TYPE:

2nd Source NEW

OEM: 

LAM
MORE INFO

716-023013-027 (C2) hot edge ring, HE, 38X ESC, RND for Lam Research systems

Precision hot edge ring for plasma edge control, ESC process stability, and chamber performance

The 716-023013-027 (C2) HOT EDGE RING, HE, 38X ESC, RND is a precision-engineered chamber component used in Lam Research semiconductor equipment to support plasma edge conditioning, electrostatic chuck (ESC) process stability, and repeatable chamber performance in demanding semiconductor applications.

Installed around the wafer processing zone as part of the ESC chamber environment, this hot edge ring helps manage edge plasma behavior, support thermal and process boundary control, and contribute to uniform wafer treatment near the edge exclusion region. In semiconductor processes where edge conditions can influence uniformity, defectivity, and yield performance, reliable hot edge ring condition is critical.

Because edge rings operate under sustained plasma exposure, ion bombardment, thermal cycling, reactive chemistries, and particle-sensitive conditions, erosion, coating wear, dimensional drift, or contamination buildup can contribute to edge non-uniformity, particle risk, chamber instability, or increased maintenance frequency. The 716-023013-027 is engineered to support stable chamber conditions and reliable performance under demanding fab production environments.

Functional role within Lam Research systems

The 716-023013-027 functions as a critical plasma-facing edge control and chamber conditioning component.

Core functions include:

  • Supporting plasma edge conditioning around the wafer perimeter
  • Helping manage edge exclusion process behavior
  • Supporting stable ESC process boundary conditions
  • Contributing to chamber uniformity and repeatability
  • Helping reduce edge-related process variation
  • Supporting uptime through reliable chamber component performance

Design and performance characteristics

Plasma edge conditioning and uniformity control

The hot edge ring supports stable edge process behavior.

Key performance characteristics include:

  • Support for controlled plasma edge conditions
  • Stable wafer edge conditioning
  • Repeatable process boundary support
  • Reduced risk of edge effect variability
  • Contribution to uniform process performance

Consistent edge behavior is critical to repeatable wafer results.

Thermal and plasma-facing material performance

Material behavior is central to ring performance.

Performance attributes may include:

  • Resistance to plasma-induced wear
  • Stable performance under thermal cycling
  • Support for high-temperature process conditions
  • Reduced susceptibility to dimensional drift
  • Reliable operation across sustained process duty

Material stability helps preserve chamber performance over time.

Precision geometry and continuous duty reliability

Designed for demanding semiconductor production environments.

Durability characteristics may include:

  • Precision dimensional tolerances
  • Stable fit within ESC chamber assemblies
  • Reliable performance under repetitive process cycles
  • Support for long service life under production conditions
  • Repeatable maintenance outcomes

Reliable ring condition helps support yield and uptime.

Integration with related chamber hardware

The 716-023013-027 may operate alongside related chamber components including:

  • 716-023013-004 associated edge ring hardware

Together these components support broader chamber control and process consistency.

Impact on tool performance, yield, and uptime

The 716-023013-027 can directly influence process stability and equipment availability.

Potential impacts of wear or degradation include:

  • Edge non-uniformity risks
  • Plasma distribution instability
  • Increased particle generation risk
  • Chamber conditioning drift
  • Higher defect exposure
  • Increased preventive maintenance frequency
  • Reduced equipment availability

Replacing a worn hot edge ring can help restore chamber stability and improve process repeatability.

Common failure modes and diagnostic indicators

Plasma-facing surface wear

Process exposure may gradually affect ring performance.

Indicators include:

  • Surface erosion or wear patterns
  • Coating degradation
  • Dimensional change over time
  • Increased edge process variability
  • Chamber instability trends

Contamination or particle contribution

Surface condition can influence contamination risk.

Symptoms may include:

  • Increased particle counts
  • Process defect excursions
  • Chamber cleanliness concerns
  • Repeatability issues
  • More frequent chamber cleans

Thermal or mechanical degradation

Long-term process duty may contribute to component drift.

Indicators include:

  • Geometry distortion
  • Reduced fit integrity
  • Chamber performance shifts
  • Increased edge process variation
  • Progressive process instability

Installation and maintenance best practices

To support best performance:

  • Follow OEM-approved handling procedures
  • Inspect ring surfaces before installation
  • Verify correct orientation and seating
  • Evaluate related chamber hardware during maintenance events
  • Inspect for wear or contamination during PM intervals
  • Perform chamber qualification after replacement
  • Confirm stable process conditions before return to production

OEM part number and compatibility

The 716-023013-027 (C2) Hot Edge Ring, HE, 38X ESC, RND is a Lam Research OEM part.

Key considerations:

  • Must match chamber and process requirements
  • Dimensional compatibility may be critical
  • Verify OEM specifications before replacement
  • Confirm integration with ESC chamber hardware
  • Evaluate related consumable wear during maintenance events

Why source from ESCT Fab Support

ESCT advantages

  • OEM-aligned functional and compatibility verification
  • Quality-controlled handling and packaging
  • Verified subsystem support
  • Faster availability versus OEM lead times
  • Reduced Mean Time To Repair (MTTR)
  • Expertise in semiconductor chamber components
  • Second-new and refurbishment options where available

Frequently asked questions

1. What does the 716-023013-027 hot edge ring do?

It supports plasma edge conditioning and helps maintain stable process behavior around the wafer perimeter within ESC chamber environments, interacting with surrounding components such as the focus ring, ring edge, ring quartz, cover ring, and silicon ring to stabilise edge conditions.

2. Why is a hot edge ring important in ESC processes?

Because edge rings influence edge plasma behavior, chamber conditioning, and uniformity control, all of which can affect yield and repeatability, alongside supporting hardware such as the ring focus, ring clamp, and clamp ring that help maintain correct positioning.

3. What does “38X ESC RND” bearing refer to?

It generally references a specific round edge ring configuration associated with a 38X electrostatic chuck application, including compatibility considerations for ring silicon geometry, bore dimensions, and integration with pillow block bearing-supported assemblies.

4. Why is it called a hot edge ring?

The designation typically reflects its process-zone role in a thermally and plasma-active edge region of the chamber, often located near the top of the wafer environment and supported by underlying base structures.

5. What are signs the edge ring bearings may need replacement?

Common indicators include:

  • Surface erosion
  • Coating wear
  • Particle-related issues
  • Edge process variability
  • Chamber conditioning drift
  • Increased PM frequency

Mechanical wear affecting bearings, bolt integrity, or roller-supported movement where applicable

6. Can edge ring wear affect wafer edge uniformity?

Yes. Degraded ring geometry or surface condition can contribute to edge non-uniformity or process instability, particularly if support components like bearings or alignment hardware degrade.

7. Can a worn edge ring contribute to particle generation?

Yes. Surface wear or material degradation can increase contamination or particle risk within the chamber.

8. Can this component affect uptime?

Yes. Performance degradation can contribute to maintenance interventions, process instability, or unplanned downtime.

9. How are hot edge ring issues typically diagnosed?

Issues may be identified through PM inspections, particle excursions, process trend analysis, chamber qualification shifts, or visual wear evaluation.

10. Does replacement require chamber qualification afterward?

Yes. Chamber and process verification should be performed after replacement before returning the tool to production.

11. Can dimensional drift affect performance before visible severe damage occurs?

Yes. Even minor geometry shifts can influence edge process behavior before major wear is obvious.

12. What happens if the wrong edge ring is installed?

Incorrect geometry or incompatible hardware may affect fit, plasma behavior, or process performance.

13. Is compatibility verification important before ordering?

Yes. Dimensional, material, and subsystem compatibility should be confirmed against OEM requirements.

14. Can ESCT verify compatibility before shipment?

Yes. ESCT supports functional and compatibility verification aligned with OEM requirements.

15. Are related chamber and edge control components available as well?

Depending on availability, associated edge rings, chamber hardware, and related process components may also be supported.

16. Is this an original OEM part?

This product is supplied as a 2nd New OEM-compatible assembly, verified to meet form, fit, and functional requirements aligned with the relevant part number. It is not an original OEM manufacturer part.

Summary

The 716-023013-027 (C2) Hot Edge Ring, HE, 38X ESC, RND is a critical chamber process component supporting plasma edge control, ESC stability, and process repeatability in Lam Research systems.

Its condition can directly influence edge uniformity, contamination control, and equipment uptime.

Sourcing through ESCT Fab Support provides verified quality, faster availability, and semiconductor-focused expertise to help maintain reliable, production-ready chamber performance.

Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Lam Research part number 716-023013-027. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Lam Research, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.

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