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The 716-023013-027 (C2) HOT EDGE RING, HE, 38X ESC, RND is a precision-engineered chamber component used in Lam Research semiconductor equipment to support plasma edge conditioning, electrostatic chuck (ESC) process stability, and repeatable chamber performance in demanding semiconductor applications.
Installed around the wafer processing zone as part of the ESC chamber environment, this hot edge ring helps manage edge plasma behavior, support thermal and process boundary control, and contribute to uniform wafer treatment near the edge exclusion region. In semiconductor processes where edge conditions can influence uniformity, defectivity, and yield performance, reliable hot edge ring condition is critical.
Because edge rings operate under sustained plasma exposure, ion bombardment, thermal cycling, reactive chemistries, and particle-sensitive conditions, erosion, coating wear, dimensional drift, or contamination buildup can contribute to edge non-uniformity, particle risk, chamber instability, or increased maintenance frequency. The 716-023013-027 is engineered to support stable chamber conditions and reliable performance under demanding fab production environments.
The 716-023013-027 functions as a critical plasma-facing edge control and chamber conditioning component.
Core functions include:
The hot edge ring supports stable edge process behavior.
Key performance characteristics include:
Consistent edge behavior is critical to repeatable wafer results.
Material behavior is central to ring performance.
Performance attributes may include:
Material stability helps preserve chamber performance over time.
Designed for demanding semiconductor production environments.
Durability characteristics may include:
Reliable ring condition helps support yield and uptime.
The 716-023013-027 may operate alongside related chamber components including:
Together these components support broader chamber control and process consistency.
The 716-023013-027 can directly influence process stability and equipment availability.
Potential impacts of wear or degradation include:
Replacing a worn hot edge ring can help restore chamber stability and improve process repeatability.
Process exposure may gradually affect ring performance.
Indicators include:
Surface condition can influence contamination risk.
Symptoms may include:
Long-term process duty may contribute to component drift.
Indicators include:
To support best performance:
The 716-023013-027 (C2) Hot Edge Ring, HE, 38X ESC, RND is a Lam Research OEM part.
Key considerations:
It supports plasma edge conditioning and helps maintain stable process behavior around the wafer perimeter within ESC chamber environments, interacting with surrounding components such as the focus ring, ring edge, ring quartz, cover ring, and silicon ring to stabilise edge conditions.
Because edge rings influence edge plasma behavior, chamber conditioning, and uniformity control, all of which can affect yield and repeatability, alongside supporting hardware such as the ring focus, ring clamp, and clamp ring that help maintain correct positioning.
It generally references a specific round edge ring configuration associated with a 38X electrostatic chuck application, including compatibility considerations for ring silicon geometry, bore dimensions, and integration with pillow block bearing-supported assemblies.
The designation typically reflects its process-zone role in a thermally and plasma-active edge region of the chamber, often located near the top of the wafer environment and supported by underlying base structures.
Common indicators include:
Mechanical wear affecting bearings, bolt integrity, or roller-supported movement where applicable
Yes. Degraded ring geometry or surface condition can contribute to edge non-uniformity or process instability, particularly if support components like bearings or alignment hardware degrade.
Yes. Surface wear or material degradation can increase contamination or particle risk within the chamber.
Yes. Performance degradation can contribute to maintenance interventions, process instability, or unplanned downtime.
Issues may be identified through PM inspections, particle excursions, process trend analysis, chamber qualification shifts, or visual wear evaluation.
Yes. Chamber and process verification should be performed after replacement before returning the tool to production.
Yes. Even minor geometry shifts can influence edge process behavior before major wear is obvious.
Incorrect geometry or incompatible hardware may affect fit, plasma behavior, or process performance.
Yes. Dimensional, material, and subsystem compatibility should be confirmed against OEM requirements.
Yes. ESCT supports functional and compatibility verification aligned with OEM requirements.
Depending on availability, associated edge rings, chamber hardware, and related process components may also be supported.
This product is supplied as a 2nd New OEM-compatible assembly, verified to meet form, fit, and functional requirements aligned with the relevant part number. It is not an original OEM manufacturer part.
The 716-023013-027 (C2) Hot Edge Ring, HE, 38X ESC, RND is a critical chamber process component supporting plasma edge control, ESC stability, and process repeatability in Lam Research systems.
Its condition can directly influence edge uniformity, contamination control, and equipment uptime.
Sourcing through ESCT Fab Support provides verified quality, faster availability, and semiconductor-focused expertise to help maintain reliable, production-ready chamber performance.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Lam Research part number 716-023013-027. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Lam Research, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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