OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The 8″ Wafer Holder is the fixed substrate carrier that supports and positions a 200 mm (8″) wafer within the strip module of a LAM photoresist removal system. In a stripper chamber the holder presents the wafer to the process environment, whether that environment is an oxygen-based plasma, a downstream radical flow, or a wet-chemical strip stage, while maintaining the wafer at a defined height, planarity, and concentricity relative to the chamber and any overlying gas distribution or RF hardware. This particular variant is supplied without an alignment hole, meaning it is intended for configurations where wafer registration is achieved by the holder pocket geometry and external handling references rather than by a dedicated locating pin or notch feature machined into the holder itself.
Although a wafer holder is a passive mechanical fixture rather than an active electrical or fluidic component, its dimensional accuracy and surface condition have an outsized influence on strip uniformity, particle performance, and handoff reliability. A holder that has worn, warped, or accumulated polymer and resist residue will tilt or shift the wafer by a few hundred microns, enough to disturb plasma sheath uniformity at the wafer edge, to cause robot pick errors, or to leave under-stripped crescents where the substrate is shadowed or thermally decoupled from the carrier.
Because the holder sits at the heart of the strip module and is exposed to reactive chemistry, repeated thermal cycling, and mechanical wafer transfer thousands of times over its service life, it is treated as a periodically replaced fixture. Carrying a verified, form-fit-function equivalent such as ESCT P/N ES2022-126 lets fab maintenance teams refresh a degraded holder during planned preventive maintenance rather than scheduling unplanned downtime around OEM lead times.
Within a LAM strip module the wafer holder performs several simultaneous mechanical and process functions. It is far more than a shelf for the wafer; its pocket, datum surfaces, and edge features all participate in defining the process geometry seen by every wafer that passes through the chamber.
Wafer holders used in resist-strip service are manufactured from materials chosen for resistance to oxygen plasma, fluorine- or oxygen-bearing radicals, and the elevated temperatures common to ashing and stripping. Depending on the specific configuration, holders of this class are produced from anodised or hard-coated aluminium, from technical ceramics such as alumina, or from machined high-purity plastics where the process is wet or low-temperature. Whatever the base material, the carrier must remain dimensionally stable and avoid shedding particles or metallic contamination into the strip environment.
The value of a wafer holder lies in tight control of its pocket diameter, depth, flatness, and the perpendicularity of its datum surfaces. Because this variant omits the alignment hole, the pocket geometry itself carries the full burden of registration, so concentricity and edge definition are especially important. A holder machined and finished to the original specification keeps the wafer flat, centred, and at the correct height with no rocking or eccentric offset.
Because the holder sets where and how flat the wafer sits, its condition propagates directly into strip results and into the reliability of automated handling. A degraded holder rarely fails outright; instead it quietly erodes margin until defectivity or handling alarms force attention.
Repeated wafer contact and exposure to resist by-products gradually polish, scratch, or coat the pocket and datum surfaces. Residue build-up changes the effective seating height and becomes a source of backside particles, while abrasive wear opens up clearance and allows the wafer to rock or shift.
Continuous thermal cycling in the strip environment can warp the carrier over time and degrade any anodised or hard-coat surface treatment. As protective coatings erode, the base material is exposed to chemical attack, accelerating particle generation and dimensional drift.
Because this holder relies on its pocket and edge geometry for registration rather than an alignment hole, chips, nicks, or eroded edges directly compromise wafer centring. Even small damage at the seating edge can introduce eccentric offset that disturbs edge uniformity and confuses downstream handling references.
Replacement should be carried out during scheduled preventive maintenance by a qualified technician following the relevant LAM service procedure for the specific strip module. The steps below summarise good practice; always defer to the tool-specific maintenance documentation and your fab’s safety protocols.
Holding a verified replacement wafer holder on the shelf protects throughput against the slow, hard-to-diagnose drift that worn carriers cause. ESCT supplies ES2022-126 as a stocked, form-fit-function equivalent so that maintenance teams can refresh degraded holders on their own schedule.
It indicates the configuration variant: this holder does not include the machined alignment-hole feature found on some versions. Wafer registration is achieved through the holder pocket and edge geometry together with the tool’s external handling references. It is important to match this variant to the specific module configuration so that registration behaves as expected.
No. This is supplied as a new, OEM-compatible part. It is not an original LAM-branded item, but it is verified to match the form, fit, and function of LAM OEM P/N 715-011492-008 so that it performs equivalently in the application.
It is designed for 200 mm (8″) wafers, seating a single substrate in the holder pocket within the LAM strip module.
Typical indicators include rising backside particle counts, strip non-uniformity or under-stripped edge regions, robot placement alarms or mispicks, and visible wear, residue, chipping, or coating degradation on the pocket and datum surfaces. Periodic inspection during preventive maintenance is the best way to catch degradation before it affects yield.
The typical lead time for ES2022-126 is around 5 weeks. We recommend ordering in advance of planned maintenance so a verified replacement is on hand when the tool is opened.
Yes. The part is cross-referenced under LAM OEM P/N 715-011492-008 and ESCT P/N ES2022-126. Quoting either number, along with the without-alignment-hole configuration, gets you the correct holder.
The 8″ Wafer Holder (LAM OEM P/N 715-011492-008, ESCT P/N ES2022-126) is the precision substrate carrier that seats and registers a 200 mm wafer in the strip module of a LAM photoresist removal system, in the without-alignment-hole configuration. Its pocket and datum geometry, surface condition, and dimensional stability directly govern strip uniformity, backside particle performance, and the reliability of automated wafer handling. As a periodically replaced fixture exposed to reactive chemistry and thermal cycling, it benefits from being kept on the shelf as a verified spare so maintenance teams can refresh degraded holders on a planned schedule and protect tool availability and yield.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Lam Research part number 715-011492-008. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Lam Research, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
We use cookies We use analytics cookies to see how visitors use this site, so we can improve it. They are set only if you accept. Read our Cookie Policy.
