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The 305.4 mm teaching wafer (OEM P/N CX10-352390-11) is a precision-machined calibration disc used to teach and verify the wafer-handling positions of the transfer robots, load-lock stations and process-module chucks within Tokyo Electron (TEL) Tactras 300 mm plasma etch systems. Unlike the focus rings, edge rings and silicon electrode parts that sit inside the plasma, a teaching wafer never enters a production process step. Instead, it is a metrology and set-up tool: a dimensionally certified stand-in for a real 300 mm device wafer that engineers and field service technicians use to establish accurate pick, place and centring coordinates throughout the vacuum transfer path.
The nominal diameter of 305.4 mm is deliberately a few millimetres larger than the 300 mm production wafer it represents. That slight oversize gives the teaching disc a defined reference edge for alignment fixtures, optical sensors and robot end-effector seating, while remaining compatible with the same cassette slots, aligner chucks and electrostatic chuck (ESC) pockets that a 300 mm wafer occupies. Because every downstream etch result depends on a wafer arriving flat, centred and correctly clamped on the chuck, the accuracy of the teaching wafer underpins the accuracy of the entire tool.
In a Tactras platform, where multiple process modules share a common transfer chamber and atmospheric front-end, a single mis-taught position can translate into edge contact, particle generation or chuck-to-wafer misregistration across every module fed by that robot. The teaching wafer is therefore a small but disproportionately important item in the maintenance toolkit, used during installation, robot replacement, end-effector swaps and routine handling-accuracy audits.
The teaching wafer provides a known, repeatable physical reference that lets the tool’s handling subsystems be aligned to one another and to the process chambers. Its core functions include:
A teaching wafer must behave dimensionally like a production wafer while surviving repeated manual and robotic handling. Its value rests on tight geometric tolerances and a stable, low-particle surface, rather than on plasma resistance.
The disc is machined to a precise diameter, thickness and flatness so that sensors, aligners and end-effectors register it identically to a real wafer. Any bow, warp or edge irregularity would teach a false position, so flatness and concentricity are the defining quality attributes.
Because the teaching wafer shares cassettes, aligners and chucks with product wafers, its surface must not shed particles or transfer contamination into the transfer path. A clean, stable finish keeps the disc fab-compatible across many handling cycles.
Although the teaching wafer never etches a device, the accuracy it delivers cascades directly into productivity and yield. Correct handling positions taught with a certified disc prevent a wide range of downstream problems:
A teaching wafer is a long-life tool, but it is not immune to damage and drift. Recognising its failure modes prevents it from quietly teaching inaccurate positions.
Repeated end-effector contact, mishandling or accidental knocks can chip or burr the reference edge. Because edge sensors and centring routines rely on that edge, even small damage can shift taught coordinates and must be inspected for before each teaching session.
Improper storage, thermal cycling or stacking under load can introduce bow or warp. A no-longer-flat disc will seat differently from a real wafer and teach a height or tilt error, so periodic flatness checks against the original specification are recommended.
Handling outside cleanroom protocol, fingerprints or accumulated residue can turn the teaching wafer into a particle source within the shared transfer path. A contaminated disc should be cleaned to fab protocol or retired rather than introduced into the EFEM.
Teaching is a controlled maintenance activity that should be carried out by trained personnel following the OEM service procedure for the specific Tactras configuration. The following sequence summarises good practice:
Keeping a certified teaching wafer on hand is inexpensive insurance against the far higher cost of mis-taught handling positions and the downtime they cause. ESCT Fab Support helps fabs secure these set-up tools without long OEM lead-time exposure:
It is a precision calibration disc used to teach and verify the wafer-handling positions of the transfer robots, aligners and process-module chucks on TEL Tactras 300 mm plasma etch systems. It is a maintenance and set-up tool, not a wafer that is processed in the plasma.
No. This item is supplied as a new, second-source component that is cross-referenced to OEM P/N CX10-352390-11 and verified to form, fit and function. It is not an original OEM-branded part and carries no affiliation with or endorsement by the OEM.
The slightly oversized diameter gives the disc a defined reference edge for alignment fixtures and edge sensors while keeping it compatible with the same cassette slots, aligners and chuck pockets used by standard 300 mm production wafers.
Teaching is typically performed after robot or end-effector replacement, following major maintenance, and during periodic handling-accuracy audits. The exact interval should follow your fab’s preventive maintenance schedule and the OEM service guidance for your tool.
Yes. Store it flat, protected and within a contamination-controlled enclosure to preserve its flatness and surface cleanliness. Stacking it under load or exposing it to handling outside cleanroom protocol can introduce warp or particles that compromise its accuracy.
The typical lead time is 4-5 weeks. We recommend holding at least one certified teaching wafer as a spare so that handling calibration is never delayed by procurement.
The 305.4 mm teaching wafer (OEM P/N CX10-352390-11) is a precision calibration tool that underpins accurate wafer handling on Tokyo Electron Tactras 300 mm plasma etch platforms. By providing a certified, dimensionally stable reference, it lets engineers teach robot pick, place and centring positions, verify concentric chuck seating and audit handling accuracy, protecting yield and uptime across every module the transfer robot serves. Inspected for edge damage, flatness and cleanliness, and stored correctly, it is a low-cost, high-leverage item in any Tactras maintenance toolkit. ESCT Fab Support supplies it as a second-source new component with a 4-5 week lead time and full technical fit support.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of the original equipment manufacturer part number CX10-352390-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with the original equipment manufacturer, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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