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OEM:
The 2L10-251877-11 (FOCUS RING, 360-T3.6 FLAT) is a precision-engineered focus ring used within Tokyo Electron plasma etch systems, designed to control plasma distribution at the wafer edge and give uniform process conditions across 300 mm wafer platforms.
Positioned around the wafer on the electrostatic chuck (ESC), this focus ring shapes the electric field and plasma density at the wafer perimeter. Its flat profile and defined thickness (T3.6) are optimised for specific process conditions, enabling consistent edge performance while protecting chamber hardware from direct plasma exposure.
The 2L10-251877-11 focus ring functions as a critical plasma-facing consumable.
Core functions include:
It operates alongside ESCs, electrodes, insert rings, and other chamber hardware components.
The focus ring directly influences wafer edge performance.
Key characteristics include:
The ring’s dimensions are critical to process tuning.
Performance features include:
The focus ring is exposed to aggressive plasma conditions.
Durability features include:
The 2L10-251877-11 focus ring is directly tied to process quality and yield.
Potential impacts of wear or degradation include:
Replacing a worn focus ring restores plasma uniformity and process control.
Continuous plasma exposure alters ring dimensions.
Indicators include:
Material wear introduces contamination.
Symptoms include:
Worn rings affect wafer edge conditions.
Indicators include:
For best performance:
The 2L10-251877-11 (360-T3.6 FLAT) is a Tokyo Electron OEM focus ring.
Key considerations:
It refers to a 360 mm class focus ring with a 3.6 mm thickness and a flat surface profile, which directly influences plasma behaviour and edge control.
It shapes the electric field at the wafer edge, giving consistent plasma density and uniform etch or deposition rates across the wafer.
Thickness determines how the plasma sheath forms at the wafer edge. Even small deviations can markedly impact process uniformity.
A focus ring actively controls plasma behaviour, while an insert ring primarily protects chamber components.
Edge non-uniformity, increased particles, visible erosion, and process drift.
Yes, but it increases risk of yield loss, edge defects, and process instability.
Based on process chemistry, plasma intensity, and PM schedules. Monitoring edge performance is key.
Yes. ESCT verifies material quality, geometry, and performance aligned with OEM requirements.
Incorrect geometry can disrupt plasma distribution, leading to non-uniform processing and yield loss.
Yes. It acts as a sacrificial component, reducing wear on more expensive chamber hardware.
The 2L10-251877-11 focus ring (360-T3.6 FLAT) is a mission-critical plasma-facing consumable within Tokyo Electron systems, controlling wafer edge plasma behaviour and holding process uniformity. Its geometry and condition directly impact yield, edge performance, and overall tool stability.
Sourcing through ESCT Fab Support gives you verified material quality, precise dimensional accuracy, and faster availability, helping maintain consistent process control and high-performance semiconductor manufacturing.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-251877-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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