OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The Upper Electrode Plate (ES7099-217) is the upper, plasma-facing cathode component that sits at the top of the process chamber in Tokyo Electron (TEL) 300 mm plasma etch tools. Mounted opposite the lower electrode and electrostatic chuck on which the wafer rests, this upper plate forms one half of the parallel-plate electrode pair that establishes the capacitively coupled discharge. It is the surface through which RF energy and, in many TEL configurations, the process gas are delivered into the volume directly above the wafer, making it one of the most influential parts in the entire etch reactor.
In TEL nomenclature this part is catalogued as a cathode, a powered or referenced electrode that participates directly in sustaining the plasma rather than simply confining it. Because it faces the discharge across the full diameter of the wafer, the upper plate is continuously exposed to ion bombardment, energetic radicals and the thermal load of the plasma. It is therefore treated as a scheduled consumable: its condition drifts predictably with accumulated RF hours, and replacing it on a planned interval is a routine part of keeping a TEL etch chamber within its process window.
Although the upper plate is mechanically simple in appearance, a large-diameter disc bolted into the chamber lid or showerhead assembly, its flatness, surface finish, material purity and electrical contact integrity all feed directly into etch rate, uniformity and defectivity. A worn or contaminated upper electrode is a common, and frequently overlooked, root cause of slowly degrading etch performance.
As the upper cathode in a parallel-plate reactor, the plate performs several roles at once, it shapes the field, completes the RF circuit, manages heat and, in showerhead-style designs, helps distribute gas. Its key functions include:
Upper electrode plates for TEL etch chambers are manufactured from high-purity materials selected for the chemistry they will face, typically high-resistivity silicon for fluorocarbon dielectric etch, or anodised or coated aluminium for other process families. The plasma-facing surface is held to tight purity and finish specifications because any material sputtered from it lands on the wafer. A correctly specified plate erodes predictably and cleanly, contributing controlled surface chemistry rather than uncontrolled particulate or metallic contamination.
Because the electrode gap directly sets local plasma density, the plate must be flat and dimensionally stable across its full diameter, and it must hold that geometry as it heats. Good thermal contact with the cooled lid keeps the facing surface at a repeatable temperature, which in turn stabilises etch rate and prevents thermally driven distortion that would skew uniformity from centre to edge.
As a full-diameter, plasma-facing cathode, the upper electrode plate exerts a strong influence on the metrics fabs care about most. Its condition shows up directly in etch results:
Continuous ion bombardment steadily sputters material from the plasma-facing surface. Over the service life the plate thins, the surface roughens and the effective electrode gap changes. This shifts plasma impedance and etch rate, gradually pushing the recipe off centre until the plate is replaced and the process re-centred.
As erosion progresses, or as polymer and by-product films build up and then delaminate, the surface begins to shed particles. These land on the wafer below as adders and can cause pattern defects or yield loss. A rising particle trend on a chamber is frequently traced back to a worn or contaminated upper electrode.
Localised hot spots, contamination or a poor mounting interface can lead to micro-arcing at the electrode surface or at the RF contact. Arcing damages the plate, injects particles and destabilises the plasma. Degraded contact also raises impedance and undermines power delivery, both of which compromise uniformity and repeatability.
Replacement of the upper electrode plate should be carried out by trained technicians following the TEL maintenance procedure for the specific tool and chamber, under appropriate cleanroom and ESD controls. A typical sequence is:
Because the upper electrode plate is a scheduled consumable, fabs benefit from holding qualified spares on the shelf rather than waiting on long procurement cycles. ESCT Fab Support supplies the ES7099-217 upper electrode as a cost-effective, fit-for-purpose alternative for TEL 300 mm etch chambers, with advantages including:
It is the upper cathode of the parallel-plate electrode pair. It couples RF power into the plasma, sets the electrode gap above the wafer and presents a controlled plasma-facing surface, so it directly governs etch rate, uniformity and particle performance.
No. ES7099-217 is supplied as a new, second-source part that is OEM-compatible with TEL P/N 1810-224852-12 and verified to match its form, fit and function. It is not an original TEL OEM part and is not sold as one.
Replacement is usually driven by accumulated RF hours together with trends in etch-rate drift, uniformity and particle counts. Visible thinning, roughening, pitting or signs of arcing on the surface are clear indicators that the plate has reached the end of its useful life.
The typical lead time is 4-5 weeks. Because the upper electrode is a planned consumable, we recommend holding a qualified spare on site so that scheduled maintenance is never gated by procurement.
As with any plasma-facing consumable, a new electrode should be installed, seasoned and re-qualified against your baseline. The part is verified to OEM form, fit and function, but normal post-maintenance checks of etch rate, uniformity and particles should always be performed before returning the chamber to production.
Keep it in its original protective packaging until use, store it in a clean, dry environment, and handle the plasma-facing surface only with clean, powder-free gloves. Avoid contact with the facing surface and any contamination of the mating and contact areas to preserve flatness and electrical integrity.
The Upper Electrode Plate (ES7099-217, OEM P/N 1810-224852-12) is the upper cathode that defines the top of the discharge in TEL 300 mm plasma etch chambers. By coupling RF power, setting the electrode gap and presenting a controlled plasma-facing surface, it has a direct bearing on etch rate, within-wafer uniformity, particle performance and tool-to-tool matching. As a high-wear consumable it benefits from planned replacement and on-shelf sparing. ESCT Fab Support offers it as a new, OEM-compatible alternative with competitive pricing and a 4-5 week lead time, helping fabs maintain etch performance while controlling consumable cost.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 1810-224852-12. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
We use cookies We use analytics cookies to see how visitors use this site, so we can improve it. They are set only if you accept. Read our Cookie Policy.
