OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The 0010-06573 / 0010-06572 Cathode Assembly (200mm REV2, EMAX) is a critical plasma-facing electrode component used within Applied Materials semiconductor processing systems. Designed for 200mm wafer platforms, this cathode assembly provides the electrical interface required for plasma generation and wafer processing.
As the powered electrode within the chamber, the cathode plays a central role in establishing the electric field that sustains plasma. This assembly is supplied excluding the electrostatic chuck (ESC), allowing integration with compatible ESC configurations while maintaining core cathode functionality.
The cathode assembly functions as a primary plasma-generating electrode within the process chamber.
Core functions include:
The assembly operates alongside RF generators, matching networks, ESCs, gas delivery systems, and chamber hardware.
The cathode is central to plasma stability and process accuracy.
Key characteristics include:
The assembly supports both electrical and mechanical stability.
Performance features include:
The cathode experiences substantial thermal and plasma exposure.
Durability features include:
The 0010-06573 / 0010-06572 cathode assembly directly impacts plasma behaviour and process results.
Potential impacts of degradation or failure include:
Replacing a degraded cathode restores plasma stability and process consistency.
Continuous plasma exposure degrades the electrode surface.
Indicators include:
High temperatures impact structural integrity.
Symptoms include:
Changes in conductivity or contact quality affect operation.
Indicators include:
Mechanical or electrical interfaces may degrade.
Symptoms include:
For best performance:
The 0010-06573 / 0010-06572 are Applied Materials OEM cathode assemblies for 200mm systems.
Key considerations:
It serves as the powered electrode that couples RF energy into the chamber, establishing and sustaining the plasma. It directly defines plasma density, ion energy distribution, and sheath characteristics critical to etch or deposition performance.
The electrostatic chuck (ESC) is not included. The cathode is supplied as a standalone electrode assembly and must be integrated with a compatible ESC where required.
Cathode surface condition and electrical integrity influence plasma uniformity and stability. Erosion, coating buildup, or electrical degradation can cause non-uniform ion distribution, process drift, and reduced repeatability.
Signs include unstable plasma, increased RF mismatch or reflected power, visible surface erosion or pitting, abnormal chamber seasoning behavior, and gradual shifts in process results.
It may continue to function, but with degraded plasma control. This increases the risk of non-uniform processing, defect generation, and tighter process margins.
Critical. Improper seating, tilt, or interface issues can distort the electric field, leading to uneven plasma distribution, localized over-processing, and accelerated wear.
Yes. Inspection can include dimensional checks, surface condition assessment, and interface compatibility verification to confirm readiness for installation.
Replacement is driven by process conditions such as RF power levels, gas chemistry, duty cycles, and erosion rates. Monitoring RF stability, endpoint trends, and chamber performance typically informs replacement timing.
Yes. Plasma instability can propagate to RF generators, matching networks, ESC performance, and process control systems, affecting overall tool stability.
Mismatched geometry or electrical characteristics can disrupt impedance matching and plasma distribution, resulting in unstable operation, poor process uniformity, and potential system faults.
The 0010-06573 / 0010-06572 Cathode Assembly (200mm REV2, EMAX) is a mission-critical plasma-facing electrode within Applied Materials systems, responsible for generating and controlling plasma used in semiconductor processing. Its performance directly impacts process uniformity, yield, and system stability.
Sourcing through ESCT Fab Support gets you verified compatibility, faster availability, and reliable performance, helping maintain stable plasma conditions and consistent semiconductor manufacturing results.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Applied Materials part number 0010-06573 0010-06572. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Applied Materials, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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