OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The Silicon Top Ring (PRO) is a high-purity silicon consumable that mounts at the periphery of the upper electrode assembly in a 300 mm plasma etch process chamber. Sitting above the wafer plane and encircling the central silicon electrode (or showerhead) plate, it forms the outermost silicon surface of the top of the discharge. In this position it is one of the first components the plasma sees at the chamber ceiling, and it works in concert with the lower edge ring and focus ring to define the boundary of the active etch region. Because it is fabricated from the same grade of process-compatible silicon as the main electrode, it presents a chemically consistent surface to the plasma rather than introducing a foreign material at the discharge edge.
Functionally, the top ring performs three intertwined jobs at once. It confines and shapes the plasma at the upper electrode edge, it acts as a sacrificial silicon source that protects the costlier electrode plate and ceramic insulators behind it, and it helps maintain a symmetric RF environment around the circumference of the chamber. The “PRO” designation denotes the production-grade variant intended for high-throughput etch recipes, where edge uniformity and particle performance are scrutinised on every wafer. As a consumable, it is expected to erode in service and to be replaced on a planned preventive-maintenance cadence rather than run to failure.
For fab engineers, the importance of this seemingly simple ring is out of all proportion to its size. A worn, cracked or contaminated top ring shifts edge etch rates, alters the impedance the generator sees, and can shed particles directly onto the wafer surface below. Keeping a qualified spare on the shelf is therefore central to protecting both yield at the wafer edge and the uptime of the etch module as a whole.
Within the upper-electrode stack, the Silicon Top Ring (PRO) sits at the junction between the powered or grounded electrode plate and the surrounding dielectric and metallic hardware. Its geometry and material purity directly influence how the plasma terminates at the chamber ceiling and how cleanly the discharge is bounded around the wafer. Its principal functions include the following.
As a silicon consumable exposed to aggressive fluorine- and chlorine-based plasmas, the top ring lives or dies by its bulk material quality and its surface condition. Two attributes dominate its behaviour in production: the purity and microstructure of the silicon itself, and the way that surface erodes and seasons over a maintenance cycle.
The ring is machined from high-resistivity, high-purity silicon selected to match the electrode material and to keep metallic contamination far below the thresholds that would threaten device yield. Bulk and surface quality govern both erosion behaviour and particle generation.
In service the silicon surface is continuously consumed by reactive radicals and ion bombardment. Predictable, even erosion is what keeps process drift gentle and gradual rather than abrupt.
Although it is a passive part with no moving elements, the condition of the Silicon Top Ring is felt directly on every wafer processed. Its erosion state changes the geometry and electrical environment at the top of the discharge, and those changes propagate through to edge yield and tool matching.
Understanding how a silicon top ring degrades helps maintenance teams set realistic replacement intervals and recognise problems before they reach the wafer.
The dominant wear mechanism is gradual consumption of the silicon by reactive-ion etching. As the ring thins, its profile and the local field geometry change, slowly shifting edge etch behaviour until the part reaches the end of its qualified life and must be swapped.
Silicon is brittle, so thermal cycling, uneven clamping or mishandling during a PM can initiate micro-cracks that propagate into chips or fractures. A cracked ring becomes a particle source and a local electrical anomaly, and is grounds for immediate replacement.
Polymer and by-product films accumulate on the ring surface over many wafers. When these films thicken and lose adhesion they flake, releasing particles onto the wafer below and degrading defect performance well before the silicon itself is fully consumed.
Replacing the Silicon Top Ring is a routine but contamination-sensitive task that should follow the tool owner’s documented preventive-maintenance procedure. The sequence below outlines the typical workflow; always defer to your site’s qualified instructions and lock-out/tag-out requirements.
Because the top ring is a scheduled consumable, the real cost driver is availability rather than unit price. Sourcing qualified spares through ESCT Fab Support lets fabs keep etch modules matched and productive without over-committing capital to OEM stock.
It is a high-purity silicon ring at the periphery of the upper electrode. It confines the plasma at the chamber ceiling, presents a chemically matched silicon surface to the discharge, protects the electrode and insulators as a sacrificial source, and helps maintain a symmetric RF environment that supports uniform edge etching.
No. This is supplied as a new, second-source part that is OEM-compatible and verified to the original form, fit and function under OEM P/N 0200-03576K. It is not an original AMAT part and is not sold as such; it is intended as a qualified equivalent for the same application.
Replacement intervals depend on the etch chemistry, RF power and wafer throughput of your specific recipe. As a consumable it is replaced on a preventive-maintenance schedule defined by erosion limits, particle performance and process drift rather than at a fixed universal interval.
Typical indicators include drifting edge etch rates or critical dimensions, rising particle or defect counts at the wafer edge, changes in RF match tuning, and visible thinning, cracking or heavy deposition observed during a chamber-open inspection.
Because it is verified to the original form, fit and function and made from process-compatible silicon, it is designed to season and behave like the part it replaces. As with any consumable change, you should run your standard seasoning and qualification recipes and confirm uniformity and particle performance before returning the tool to production.
The typical lead time is 4–5 weeks, which suits planned PM and buffer-stock strategies. Reorder using ESCT P/N ES1099-016 or OEM P/N 0200-03576K so you receive the correct production-grade silicon top ring for your etch module.
The Silicon Top Ring (PRO), ESCT P/N ES1099-016 / OEM P/N 0200-03576K, is a high-purity silicon consumable for the upper electrode of 300 mm plasma etch chambers. It confines the plasma, protects the electrode and insulators as a sacrificial silicon source, and supports a symmetric RF environment that underpins edge etch uniformity and particle performance. Because it erodes predictably and is replaced on a PM cadence, keeping a qualified spare on hand directly protects edge yield and tool uptime. Supplied new and second-source, verified to form, fit and function, it offers a cost-effective, readily reorderable alternative to OEM stock with a 4–5 week lead time.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Applied Materials part number 0200-03576K. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Applied Materials, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
We use cookies We use analytics cookies to see how visitors use this site, so we can improve it. They are set only if you accept. Read our Cookie Policy.
