3D10-201448-11(U2)
SI FOCUS RING (TE Modify)Rev.1 (4t)

SI focus ring, TE Modify Rev.1 (4t) (OEM P/N 3D10-201448-11(U2)), high-purity silicon focus ring for Tokyo Electron etch chambers

Modified 4 mm-thick silicon focus ring for TEL plasma etch chambers, ESCT P/N ES7099-032

The SI Focus Ring (TE Modify, Rev.1, 4t) is a high-purity silicon focus ring used in Tokyo Electron (TEL) plasma etch chambers. It surrounds the wafer at the edge of the electrode, extending the plasma sheath beyond the wafer perimeter so that etch conditions at the outermost die match those at the centre. The “4t” designation indicates the nominal 4 mm ring thickness, and “TE Modify Rev.1” denotes a modified revision of the base focus-ring geometry.

As a consumable, the focus ring is continuously exposed to ion bombardment and reactive plasma and erodes over its service life. Because it shapes the electric field and plasma sheath at the wafer edge, its dimensions and surface condition have a direct effect on edge etch-rate uniformity, critical-dimension control and particle performance.

This item is supplied as a 2nd-source new part, manufactured from high-purity silicon to match the form, fit and function of OEM P/N 3D10-201448-11(U2).

Functional role of the focus ring in TEL etch chambers

The focus ring works with the electrode and edge hardware to control conditions at the wafer perimeter, providing:

• Extension and shaping of the plasma sheath beyond the wafer edge
• A consistent electric-field profile across edge die
• Uniform ion flux and etch rate at the wafer perimeter
• Protection of the electrode and edge hardware from erosion
• A stable edge boundary as the consumable set ages

Material and process performance

Silicon purity and particle control

High-purity silicon limits contamination and controls particle generation as the ring erodes:

• Low trace-metal content to protect device integrity
• Predictable, controlled erosion behaviour
• Reduced flaking and particulate shedding
• Surface finish matched to the OEM consumable specification

Dimensional accuracy and edge uniformity

Accurate ring geometry preserves the field profile at the wafer edge, supporting:

• Consistent edge-to-centre etch-rate ratios
• Reduced edge tilt and CD variation on outer die
• Stable process performance across the consumable lifetime

Impact on tool performance and yield

Sitting in a yield-sensitive region, a degraded focus ring may contribute to:

• Edge etch-rate drift and CD non-uniformity
• Elevated particle counts and defect excursions
• Plasma instability at the wafer edge
• Shortened intervals between chamber cleans
• Loss of wafer-to-wafer and chamber-to-chamber matching

Common wear and failure modes

Erosion and end-of-life wear

Continuous ion bombardment thins the ring over time, producing edge etch-rate drift as it approaches end-of-life thickness limits.

Particle generation and flaking

Surface degradation as erosion advances can release particles, raising defect counts and shortening the usable interval.

Cracking or mechanical damage

Thermal cycling, mishandling or over-torque can crack silicon, causing arcing, contamination and immediate process excursions.

Installation and replacement guidance

Replacement should follow TEL-approved chamber, ESD and cleanroom procedures:

• Power down and lock out the chamber before opening
• Use clean, ESD-safe handling and powder-free gloves
• Inspect seating surfaces and adjacent edge hardware
• Seat the ring evenly to specified alignment
• Run the prescribed seasoning recipe before production
• Verify edge uniformity and particle performance before release

Spare parts strategy for TEL etch consumables

Recurring consumable demand and OEM lead times make a reliable secondary source useful for TEL etch tools. ESCT Fab Support provides:

• High-purity silicon parts matched to OEM form, fit and function
• Inspection and dimensional verification before dispatch
• Cleanroom-appropriate handling and packaging
• Reduced lead time and controlled consumable cost
• Technical support for TEL etch chamber maintenance

Frequently asked questions

1. What is this focus ring used for?

It is a high-purity silicon focus ring for Tokyo Electron etch chambers. It extends and shapes the plasma sheath at the wafer edge to maintain etch-rate uniformity on outer die, and is a consumable replaced on a defined maintenance interval.

2. Is this an original OEM part?

It is supplied as a 2nd-source new part, manufactured from high-purity silicon to match the form, fit and function of OEM P/N 3D10-201448-11(U2). It is a compatible alternative and is not an original OEM-branded item.

3. What does “TE Modify Rev.1 (4t)” mean?

It denotes a modified revision (Rev.1) of the base focus-ring geometry with a nominal 4 mm thickness (“4t”), matched to the referenced TEL part configuration.

4. What happens if a worn focus ring is left in service?

It can cause edge CD non-uniformity, particle excursions, arcing and reduced chamber matching, affecting edge yield before a tool alarm occurs.

5. Can ESCT verify the part before shipment?

Yes. Parts undergo dimensional and visual inspection against the OEM consumable specification, with cleanroom-appropriate handling and packaging prior to dispatch.

6. How quickly can ESCT supply this consumable?

Lead time depends on current inventory; an indicative 4–5 weeks applies, with a focus on consistent availability for planned etch maintenance.

Summary

The SI Focus Ring (TE Modify Rev.1, 4t; OEM P/N 3D10-201448-11(U2)) is a high-purity silicon focus ring for Tokyo Electron etch chambers that maintains the electric-field and plasma boundary at the wafer edge. By preserving controlled erosion and edge etch-rate uniformity, it directly supports edge yield, particle performance and chamber matching. Sourcing through ESCT Fab Support provides inspected, OEM-matched consumables with controlled cost and lead time.

Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-201448-11(U2). It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.

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