OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The SHIN Cooling Focus Ring (TEL OEM P/N 3D10-250755-21, ESCT P/N ES7099-008) is a consumable focus ring fitted to the wafer-edge region of Tokyo Electron 300 mm plasma etch process chambers. In this catalogue the “360-T4-298” designator identifies the specific ring geometry and material variant, while the “SHIN cooling” descriptor points to its role in managing the thermal boundary at the wafer perimeter. The ring sits concentrically around the electrostatic chuck, encircling the 300 mm wafer and bridging the abrupt discontinuity between the silicon surface and the surrounding chamber hardware.
A focus ring is one of the most plasma-exposed parts in any etch chamber. It is deliberately a sacrificial component: it stands directly in the ion flux at the wafer edge, taking erosion that would otherwise distort the process at the outermost dies. Because the ring extends the wafer plane outward and shapes the local sheath, even small changes in its height, profile or surface condition translate into measurable shifts in edge etch rate, profile angle and critical-dimension uniformity.
The “cooling” element of this particular ring matters because edge thermal control increasingly governs edge yield. As the ring heats under continuous RF power and ion bombardment, its temperature feeds back into the wafer-edge temperature, the local reaction chemistry and the polymer deposition balance. A ring designed and seated to conduct heat away from the edge keeps that boundary stable across long campaigns, which is exactly what high-volume 300 mm production demands.
Within a TEL 300 mm etch chamber, the focus ring performs several overlapping electrical, plasma and thermal functions simultaneously. It is not simply a spacer; it is an active part of the process boundary that the chamber is tuned around.
Focus rings for TEL etch chambers are produced from carefully selected plasma-grade materials, typically high-purity silicon, silicon carbide or a comparable etch-resistant ceramic chosen to match the process chemistry. The material is specified for controlled, predictable erosion: it must wear slowly and evenly so that ring height and profile change in a way the process can tolerate and the engineer can schedule around. Purity is critical, because trace contaminants liberated from the ring surface become particle and metals sources at the wafer edge.
The cooling function of this ring depends on tight dimensional tolerances and good thermal contact at its seating surface. Flatness, parallelism and a consistent contact interface let the ring conduct heat into the surrounding cooled hardware rather than letting the wafer edge run hot. Dimensional accuracy on the inner diameter, height and step profile is what keeps the sheath geometry, and therefore edge CD, matched to the recipe the tool was qualified on.
Because the focus ring directly defines the edge-exclusion environment, its condition is one of the strongest levers on edge-die yield. A worn, contaminated or incorrectly seated ring shows up first at the wafer perimeter, where margins are already tightest.
The dominant wear mode is steady erosion from ion bombardment and chemical attack. As the ring thins, the sheath above the wafer edge bends and the edge etch rate and profile drift outside the process window. This is normal, expected wear; the part is designed to be replaced on a defined interval before the drift reaches the rejection limit.
As the surface erodes it roughens, and redeposited polymer or by-product layers can accumulate and later flake. Both effects raise the particle count at the wafer edge and can trigger defect excursions well before the ring is fully consumed, making particle monitoring an important secondary indicator.
Thermal cycling, mechanical handling or an uneven seating surface can crack or chip the ring, or compromise the thermal contact the cooling function relies on. A poorly seated ring runs hot, loses dimensional reference and can cause localised edge non-uniformity that no recipe tuning will fully correct.
Focus ring replacement is a routine but precision preventive-maintenance task. Always follow the relevant TEL maintenance procedure and your site’s safety and contamination-control requirements; the steps below summarise good practice.
Focus rings are scheduled consumables, so availability and consistency matter as much as the part itself. Sourcing ES7099-008 through ESCT Fab Support gives fabs a dependable, form-fit-function alternative to single-source OEM purchasing.
It surrounds the 300 mm wafer at the edge of the electrostatic chuck and extends the wafer plane outward, keeping the plasma sheath flat and vertical over the outermost dies. It also manages the edge thermal boundary and acts as a sacrificial surface that takes erosion in place of more costly chamber hardware.
No. ES7099-008 is supplied as a second-source new, OEM-compatible part. It is manufactured and verified to match the original form, fit and function of TEL OEM P/N 3D10-250755-21, but it is not an original Tokyo Electron part and is not supplied by TEL.
Under continuous RF power and ion bombardment the ring heats up, and that heat couples into the wafer edge. A ring seated for good thermal contact conducts heat away and keeps the edge temperature stable, which protects deposition balance, selectivity and edge CD over long production campaigns.
Most fabs replace focus rings on a defined RF-hour or wafer-count interval derived from observed wear. Drifting edge etch rate or profile, rising edge particle counts and visible height loss or roughening are all signals that the ring is approaching the end of its useful life.
The part is built to the original dimensional and material specification so that, when correctly seated, it reproduces the qualified edge geometry. As with any consumable change, run your standard monitor-wafer and edge-uniformity checks after installation before returning the tool to production.
The typical lead time is 4–5 weeks. Because focus rings are scheduled consumables, we recommend holding buffer stock sized to your PM interval and replenishing against forecast so a ring change never gates tool availability.
The SHIN Cooling Focus Ring (TEL OEM P/N 3D10-250755-21, ESCT P/N ES7099-008, type 360-T4-298) is a plasma-grade, thermally managed focus ring for TEL 300 mm plasma etch chambers. It shapes the plasma sheath at the wafer edge, stabilises edge temperature and serves as the chamber’s primary sacrificial surface, making it a direct driver of edge CD uniformity, profile control, particle performance and edge-die yield. Supplied as a second-source new part on a 4–5 week lead time, it gives fabs a verified, cost-effective and supply-resilient route to keeping etch chambers productive.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-250755-21. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
We use cookies We use analytics cookies to see how visitors use this site, so we can improve it. They are set only if you accept. Read our Cookie Policy.
