OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The Focus Ring T4G100-MF is a plasma-exposed edge-confinement consumable fitted to Tokyo Electron (TEL) 300 mm plasma etch process chambers. It is the annular ring that surrounds the 300 mm wafer at the plane of the electrostatic chuck (ESC), bridging the gap between the wafer edge and the surrounding chamber furniture. In TEL capacitively coupled etch platforms, this ring is one of the most consumable items in the chamber and is replaced on a defined preventive-maintenance interval because it sits directly in the ion flux that drives the etch.
Its job is deceptively simple to describe but demanding in practice: it extends the electrical and plasma environment of the wafer outward past the silicon edge so that the outermost die see the same sheath conditions as die at the wafer centre. Without a correctly conditioned focus ring, the plasma sheath bends sharply at the wafer edge, ion trajectories tilt, and the etch profile at the wafer periphery diverges from the rest of the wafer. Because the edge exclusion zone of a 300 mm wafer contains a large number of saleable die, the condition of this single ring has an outsized effect on overall die yield.
ESCT Fab Support supplies this focus ring (ESCT P/N ES7099-094) as a second-source component verified to the form, fit and function of TEL OEM P/N 3D10-250755-11, giving fabs a qualified alternative to single-channel OEM procurement for a part that is consumed continuously in production.
The focus ring is an active part of the plasma circuit, not merely a mechanical spacer. It tunes the local sheath geometry and RF coupling at the wafer edge, and its condition is tracked as a process parameter in its own right. Its principal functions include:
Focus rings for TEL 300 mm etch chambers are manufactured from high-purity plasma-grade materials chosen for predictable, slow erosion and minimal particle generation. Common constructions include high-resistivity single-crystal or polycrystalline silicon and silicon carbide, with the exact material matched to the process chemistry of the chamber. Key material characteristics include:
Because the ring is consumed as it is used, its dimensions drift across its service life and the process must tolerate that drift. A well-made ring erodes uniformly and predictably, which is what allows fabs to compensate with edge-tuning recipe knobs and to schedule replacement before the ring goes out of specification:
Few consumables in a 300 mm etch chamber influence edge yield as directly as the focus ring. As it erodes, sheath geometry at the wafer edge changes and the consequences propagate into the device data:
The dominant wear mode is gradual erosion from continuous ion bombardment. As the upper surface and inner diameter recede, the sheath drops relative to the wafer edge, ion trajectories tilt, and edge etch performance moves off target. This is expected and is the reason the ring carries a defined replacement limit measured in RF hours or processed wafers.
Thermal cycling, mechanical handling and localised arcing can crack or chip the ring, particularly as it thins late in life. Cracks and chips generate particles, distort the local electric field and can accelerate failure. Arcing marks indicate that edge electrical conditions have become unstable and that the ring should be removed from service.
Polymer and etch by-product can accumulate on the ring surface, then flake during subsequent cycles and land on the wafer as defects. Build-up also changes the surface condition and effective electrical behaviour of the ring. A ring carrying heavy, loosely adhered deposition is a particle risk even before it reaches its erosion limit.
Focus-ring replacement is a routine but precision preventive-maintenance task. Cleanliness and correct seating are critical, because the ring’s position relative to the wafer plane sets the edge process. A typical replacement sequence is:
Focus rings are recurring consumables, so procurement strategy has a direct effect on tool availability and cost of ownership. Sourcing this ring through ESCT Fab Support gives fabs a qualified second source for a part they buy repeatedly:
It surrounds the 300 mm wafer at the chuck plane and extends the plasma sheath and edge electrical environment beyond the wafer edge. This keeps ion bombardment vertical and uniform at the outermost die, preserving edge critical dimensions, profile and within-wafer uniformity.
No. This is supplied as a new, second-source component that is OEM-compatible. It is verified to the form, fit and function of TEL OEM P/N 3D10-250755-11 but it is not an original Tokyo Electron OEM part, and any OEM part numbers are quoted only for cross-reference.
Rings are replaced on a defined limit, usually expressed in RF hours or processed wafers, before erosion pushes edge performance out of specification. Drift in edge CD or uniformity, rising particle counts, or visible cracking, chipping or arcing damage are all signals to replace the ring.
TEL focus rings are made from high-purity plasma-grade materials such as high-resistivity silicon or silicon carbide, selected to match the chamber chemistry. The material is chosen for slow, predictable erosion, controlled resistivity and low particle generation.
A new ring changes the as-installed edge geometry, so a season or conditioning sequence followed by qualification wafers is normal practice. Because this ring is held to tight dimensional tolerances, it reproduces the expected geometry and helps minimise the qualification effort after a swap.
Typical lead time is 4-5 weeks. As a continuously consumed part, it is best held as buffer stock sized to your replacement interval so that rings are always available ahead of scheduled preventive maintenance and the tool is never held waiting on a consumable.
The Focus Ring T4G100-MF (ESCT P/N ES7099-094, cross-referenced to TEL OEM P/N 3D10-250755-11) is a critical edge-confinement consumable for Tokyo Electron 300 mm plasma etch chambers. By extending the plasma sheath and edge electrical environment beyond the wafer, it governs edge critical dimensions, profile, within-wafer uniformity and particle performance, making it one of the most yield-sensitive consumables in the chamber. Manufactured from high-purity plasma-grade material and held to tight dimensional tolerances, it erodes predictably so it can be managed on a scheduled replacement interval. Supplied by ESCT Fab Support as a qualified second source with a 4-5 week lead time, it offers fabs a cost-effective, reliable way to keep edge etch performance on target.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-250755-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
We use cookies We use analytics cookies to see how visitors use this site, so we can improve it. They are set only if you accept. Read our Cookie Policy.
