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The Focus Ring 360-315-6 is an annular plasma-facing consumable that seats around the wafer in a Tokyo Electron (TEL) 300 mm plasma etch chamber. Designated by TEL part number 2L10-252056-11 and supplied by ESCT Fab Support as ES7099-134, it is one of the most influential single components governing edge etch behaviour. Although it carries no active electronics and performs no mechanical motion, the focus ring sits directly in the path of the plasma sheath at the wafer perimeter, where it shapes the electric field, extends the effective process area beyond the 300 mm wafer edge, and protects the underlying electrode hardware from ion bombardment.
In a capacitively coupled etch chamber, the wafer is electrostatically clamped to the lower electrode while RF power drives a plasma above it. The boundary of that plasma, the sheath, must remain flat and uniform out to and slightly beyond the wafer edge if the outermost dies are to etch at the same rate, profile angle and critical dimension as the wafer centre. The focus ring is the part that makes this possible. By presenting a surface at the correct height and dielectric character around the wafer, the 360-315-6 ring “focuses” the sheath, preventing it from curving downward at the wafer edge and tilting etch features inward.
Because the ring is exposed to the same energetic ions and reactive radicals as the wafer, it erodes over time. As it thins, edge yield drops and tilt defects climb, which is why the focus ring is treated as a scheduled consumable and stocked as a routine spare in any high-volume TEL etch operation.
The focus ring performs several interlocking jobs at the wafer edge, all of which directly determine whether the perimeter dies meet specification. Its functions include:
Focus rings for TEL etch chambers are manufactured from carefully selected plasma-resistant materials whose composition is matched to the process chemistry they serve. The material choice governs both how long the ring lasts and how it influences the wafer it surrounds.
The ring must withstand continuous ion bombardment and reactive fluorine- or chlorine-based chemistries without rapid sputtering or chemical attack. Common focus-ring materials for silicon and dielectric etch are chosen for their predictable, slow erosion rate and their compatibility with the wafer being processed.
A focus ring only works if it sits at the exact height and flatness the chamber was designed around. Tight dimensional control keeps the sheath flat across the wafer-to-ring transition and avoids the small steps that create edge defects.
Because the focus ring controls the plasma at the wafer perimeter, its condition is felt most strongly in the outermost dies, the ones most easily lost to non-uniformity. A worn, cracked or incorrectly specified ring shows up quickly in edge-ring yield data and process control charts. The consequences include:
The dominant failure mode is gradual erosion. Continuous ion bombardment sputters material from the upper surface, lowering the ring height over thousands of RF hours. As the step between wafer and ring changes, the sheath geometry shifts and edge etch results drift out of band, the point at which the ring must be replaced or, where the process allows, recessed compensation reaches its limit.
Repeated thermal cycling between idle and high-power plasma states stresses brittle ceramic and silicon rings. Hairline cracks, chips or fractures can develop, especially around the inner edge or at handling contact points, and a cracked ring is both a particle source and a confinement risk that warrants immediate removal.
Polymer and etch by-products accumulate on the ring surface during processing. If deposits flake or redeposit, they raise particle counts and cause edge defects. Surface roughening from erosion accelerates this, so a ring that has reached the end of its useful life often shows rising defectivity before its height limit alone would dictate a swap.
Focus ring replacement is a routine preventive-maintenance task, but it must be carried out cleanly and precisely because the ring’s seating directly affects edge process results. The following steps outline good practice; always follow your facility’s qualified TEL maintenance procedure.
Focus rings are scheduled consumables, so steady availability matters as much as part quality. Sourcing this ring through ESCT Fab Support as ES7099-134 gives fabs a dependable, cost-controlled supply without compromising on the form, fit and function the chamber demands.
It surrounds the 300 mm wafer and extends the plasma sheath out past the wafer edge, keeping the electric field flat and the ion trajectories vertical at the perimeter. This keeps edge dies etching at the same rate and profile as the wafer centre while protecting the electrode beneath it from ion bombardment.
No. This ring is supplied as a second-source new part that is verified to the form, fit and function of TEL OEM P/N 2L10-252056-11. It is not an original OEM-branded component, but it is built to be a direct equivalent for the same chamber position and function.
Service life depends on the process chemistry, RF power and run hours, so it is governed by accumulated erosion rather than a fixed calendar interval. Fabs typically track ring height loss and edge-yield trends, replacing the ring when it reaches its erosion limit or when edge process metrics begin to drift.
Typical indicators are rising edge-die defectivity, tilted or non-uniform edge etch profiles, drift in edge-to-centre etch rate, and increased particle counts. Visible cracks, chips or excessive height loss on inspection are clear reasons to retire the ring immediately.
Lead time is approximately 4-5 weeks. Because the focus ring is a recurring consumable, it is best held as a forward-stocked spare so that preventive-maintenance swaps are never delayed waiting on supply; ordering against your PM cadence avoids unplanned tool downtime.
Manufactured to match the dimensions and material character of the original, the ring is intended to reproduce the same edge behaviour. As with any consumable change, ESCT recommends seasoning the new ring and running your standard edge-uniformity and particle qualification before returning the tool to production.
The Focus Ring 360-315-6 (TEL OEM P/N 2L10-252056-11, ESCT P/N ES7099-134) is a critical edge-process consumable for TEL 300 mm plasma etch chambers. It shapes the plasma sheath at the wafer perimeter, keeps edge etch rate and profile uniform, and shields the electrode from ion bombardment, all while serving as the sacrificial wear item that erodes in place of more expensive hardware. Supplied second-source new and verified to form, fit and function, with an approximately 4-5 week lead time, it offers fabs a dependable, cost-effective way to keep edge yield and particle performance on target.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252056-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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